JPS6016552U - semiconductor cooling equipment - Google Patents
semiconductor cooling equipmentInfo
- Publication number
- JPS6016552U JPS6016552U JP10837283U JP10837283U JPS6016552U JP S6016552 U JPS6016552 U JP S6016552U JP 10837283 U JP10837283 U JP 10837283U JP 10837283 U JP10837283 U JP 10837283U JP S6016552 U JPS6016552 U JP S6016552U
- Authority
- JP
- Japan
- Prior art keywords
- hollow electrode
- semiconductor cooling
- condenser
- cooling equipment
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の半導体冷却装置の実施例を示す断面図
、第２図は、本考案による半導体冷却装置の実施例を示
す断面図、第３図は本考案によるスタックの外観図を示
す。
１は半導体、２は絶縁物、３は凝縮器、４は接続管、５
は中空電極、６は液溜め、７はフレオン１１３．８はフ
レオン１１３蒸気の流れ、９は耐圧気密容器である。尚
、図中同一あるいは相当部分には同一符号を付して示し
である。FIG. 1 is a sectional view showing an embodiment of a conventional semiconductor cooling device, FIG. 2 is a sectional view showing an embodiment of a semiconductor cooling device according to the present invention, and FIG. 3 is an external view of a stack according to the present invention. . 1 is a semiconductor, 2 is an insulator, 3 is a condenser, 4 is a connecting pipe, 5
is a hollow electrode, 6 is a liquid reservoir, 7 is a Freon 113.8 is a flow of Freon 113 vapor, and 9 is a pressure-resistant airtight container. In the drawings, the same or corresponding parts are denoted by the same reference numerals.
Claims (1)
た中空の電極と、上記中空の電極中に充填された冷媒と
、上記中空の電極内で発生した冷媒蒸気を凝縮する凝縮
器と、上記凝縮器で液化した冷媒を溜ある液溜めと、上
記中空の電極と上記液溜めおよび凝縮器を接続する配管
とにより構成されたことを特徴とする半導体冷却装置。an electrically insulated hollow electrode provided on both sides of the semiconductor to be cooled, a refrigerant filled in the hollow electrode, and a condenser for condensing refrigerant vapor generated in the hollow electrode; A semiconductor cooling device comprising: a liquid reservoir containing refrigerant liquefied in the condenser; and piping connecting the hollow electrode to the liquid reservoir and the condenser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10837283U JPS6016552U (en) | 1983-07-13 | 1983-07-13 | semiconductor cooling equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10837283U JPS6016552U (en) | 1983-07-13 | 1983-07-13 | semiconductor cooling equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6016552U true JPS6016552U (en) | 1985-02-04 |
Family
ID=30252860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10837283U Pending JPS6016552U (en) | 1983-07-13 | 1983-07-13 | semiconductor cooling equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016552U (en) |
-
1983
- 1983-07-13 JP JP10837283U patent/JPS6016552U/en active Pending
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