JPS6122357U - Semiconductor stack support equipment - Google Patents
Semiconductor stack support equipmentInfo
- Publication number
- JPS6122357U JPS6122357U JP10557984U JP10557984U JPS6122357U JP S6122357 U JPS6122357 U JP S6122357U JP 10557984 U JP10557984 U JP 10557984U JP 10557984 U JP10557984 U JP 10557984U JP S6122357 U JPS6122357 U JP S6122357U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor stack
- airtight terminal
- support frame
- support
- adapter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の半導体スタック支持装置の構成を示す
部分縦断面の概略図、第２図は沸騰冷媒式冷却装置の縦
断面慨略図、第３図は従来の半導体スタック支持手段を
示す部分縦断面の概略区をそれぞれ表わす。
１・・・・・・半導体スタック、２・・・・・・支持フ
レーム、３・・・・・・気密端子、４・・・・・・気密
端子のベース、６・・・・・・接続導体、７・・・・・
・アタブタ、８・・・・・・ビン、９・・・・・・ボル
ト、１１・・・・・・密閉容器、１２・・・・・・沸騰
冷媒。FIG. 1 is a schematic partial vertical cross-sectional view showing the structure of the semiconductor stack support device of the present invention, FIG. 2 is a schematic vertical cross-sectional view of a boiling refrigerant type cooling device, and FIG. 3 is a partial schematic view showing a conventional semiconductor stack support means. Each represents a rough section of the longitudinal section. 1... Semiconductor stack, 2... Support frame, 3... Airtight terminal, 4... Base of airtight terminal, 6... Connection Conductor, 7...
・Attachment, 8... Bottle, 9... Bolt, 11... Airtight container, 12... Boiling refrigerant.
Claims (1)
行なう沸騰冷媒式冷却装置の畜閉容器内に収納され、該
密閉容器に接合される気密端子を介して外部電路に接続
される半導体スタックの支持装置において、前記半導体
スタックの支持フレーノ−、、前記半導体スタックの接
続用気密端子並びに前記支持フレームと前記気密端子と
の間に介在するアタブタからなり、前記支持フレーム、
前記気密端子並びに前記アグブタが同一外径寸法を有す
るとともに、前記アダプタと前記気密端子とを桟械的に
強因な結合手段により一体に結合し、かつ前記アダプタ
と前記支持フレームとを相互に軸方向に適宜の滑りを許
し得る如き結合手段により結合してなることを特徴とす
る半導体スタックの支持装置。A boiling refrigerant type cooling system that performs cooling by utilizing the circulation of a boiling refrigerant that involves a phase change in gas and liquid, and is housed in a closed container and connected to an external electrical circuit through an airtight terminal connected to the closed container. A support device for a semiconductor stack comprising: a support flanges for the semiconductor stack, an airtight terminal for connecting the semiconductor stack, and a tab interposed between the support frame and the airtight terminal, the support frame;
The airtight terminal and the agubuta have the same outer diameter, the adapter and the airtight terminal are mechanically coupled together by a strong coupling means, and the adapter and the support frame are mutually axially connected. 1. A support device for a semiconductor stack, characterized in that the device is coupled by a coupling means capable of allowing appropriate sliding in the direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557984U JPS6122357U (en) | 1984-07-12 | 1984-07-12 | Semiconductor stack support equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557984U JPS6122357U (en) | 1984-07-12 | 1984-07-12 | Semiconductor stack support equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6122357U true JPS6122357U (en) | 1986-02-08 |
| JPH0217483Y2 JPH0217483Y2 (en) | 1990-05-16 |
Family
ID=30664894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10557984U Granted JPS6122357U (en) | 1984-07-12 | 1984-07-12 | Semiconductor stack support equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6122357U (en) |
-
1984
- 1984-07-12 JP JP10557984U patent/JPS6122357U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217483Y2 (en) | 1990-05-16 |
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