JPS6016541U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6016541U
JPS6016541U JP1984080295U JP8029584U JPS6016541U JP S6016541 U JPS6016541 U JP S6016541U JP 1984080295 U JP1984080295 U JP 1984080295U JP 8029584 U JP8029584 U JP 8029584U JP S6016541 U JPS6016541 U JP S6016541U
Authority
JP
Japan
Prior art keywords
wire bonding
capillary
bonding equipment
rotation
eccentric shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984080295U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0343717Y2 (enrdf_load_stackoverflow
Inventor
実津男 広田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1984080295U priority Critical patent/JPS6016541U/ja
Publication of JPS6016541U publication Critical patent/JPS6016541U/ja
Application granted granted Critical
Publication of JPH0343717Y2 publication Critical patent/JPH0343717Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1984080295U 1984-05-30 1984-05-30 ワイヤボンデイング装置 Granted JPS6016541U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984080295U JPS6016541U (ja) 1984-05-30 1984-05-30 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984080295U JPS6016541U (ja) 1984-05-30 1984-05-30 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6016541U true JPS6016541U (ja) 1985-02-04
JPH0343717Y2 JPH0343717Y2 (enrdf_load_stackoverflow) 1991-09-12

Family

ID=30210288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984080295U Granted JPS6016541U (ja) 1984-05-30 1984-05-30 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6016541U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111346U (enrdf_load_stackoverflow) * 1979-01-29 1980-08-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111346U (enrdf_load_stackoverflow) * 1979-01-29 1980-08-05

Also Published As

Publication number Publication date
JPH0343717Y2 (enrdf_load_stackoverflow) 1991-09-12

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