JPS55111346U - - Google Patents

Info

Publication number
JPS55111346U
JPS55111346U JP1979010655U JP1065579U JPS55111346U JP S55111346 U JPS55111346 U JP S55111346U JP 1979010655 U JP1979010655 U JP 1979010655U JP 1065579 U JP1065579 U JP 1065579U JP S55111346 U JPS55111346 U JP S55111346U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979010655U
Other languages
Japanese (ja)
Other versions
JPS5852684Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979010655U priority Critical patent/JPS5852684Y2/ja
Publication of JPS55111346U publication Critical patent/JPS55111346U/ja
Application granted granted Critical
Publication of JPS5852684Y2 publication Critical patent/JPS5852684Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344Eccentric cams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1979010655U 1979-01-29 1979-01-29 ワイヤボンデイング装置 Expired JPS5852684Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979010655U JPS5852684Y2 (ja) 1979-01-29 1979-01-29 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979010655U JPS5852684Y2 (ja) 1979-01-29 1979-01-29 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS55111346U true JPS55111346U (enrdf_load_stackoverflow) 1980-08-05
JPS5852684Y2 JPS5852684Y2 (ja) 1983-12-01

Family

ID=28823653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979010655U Expired JPS5852684Y2 (ja) 1979-01-29 1979-01-29 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5852684Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016541U (ja) * 1984-05-30 1985-02-04 株式会社東芝 ワイヤボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016541U (ja) * 1984-05-30 1985-02-04 株式会社東芝 ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPS5852684Y2 (ja) 1983-12-01

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