JPS60161628A - Semiconductor wire bonder - Google Patents

Semiconductor wire bonder

Info

Publication number
JPS60161628A
JPS60161628A JP59017330A JP1733084A JPS60161628A JP S60161628 A JPS60161628 A JP S60161628A JP 59017330 A JP59017330 A JP 59017330A JP 1733084 A JP1733084 A JP 1733084A JP S60161628 A JPS60161628 A JP S60161628A
Authority
JP
Japan
Prior art keywords
ultrasonic horn
semiconductor circuit
wire
rotating shaft
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59017330A
Other languages
Japanese (ja)
Inventor
Kenichi Oku
健一 奥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59017330A priority Critical patent/JPS60161628A/en
Publication of JPS60161628A publication Critical patent/JPS60161628A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase the movement of an x-y table, and to join a wire extending over a wide area by mounting the x-y table on the side reverse to a semiconductor circuit to an ultrasonic horn and a shaft. CONSTITUTION:A cam 19 is turned by a motor 18, a lever 20 interlocked with a shaft 17 is moved vertically, and an ultrasonic horn 15 is rocked. The ultrasonic horn is vibrated by a vibrator 16, and a wire 13 is connected between a semiconductor circuit 11 and an external substrate 12 by a joining tool 14. Since the shaft 17 is fixed to an xy table 21 positioned on the side reverse to the semiconductor circuit 11 to the ultrasonic horn 15 and the shaft 17 and the shaft 17 is positioned on the side reverse to the semiconductor circuit 11 to the ultrasonic horn 15, a mechanism for joining the wire does not collide with the semiconductor circuit 11 and the external substrate 12 even when the movement of the x-y table is large.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体基板にワイヤを接合する、半導体ワイ
ヤボンダーに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor wire bonder for bonding wires to a semiconductor substrate.

従来例の構成とその問題点 従来の半導体ワイヤーボンダーは、第１図にその具体構
成を示すように、ワイヤ１を半導回路基板２と外部基板
３とに接続する接合工具４を保持した超音波ホーン５が
、ｘ−ｙテーブル６上の回転軸７のまわりを揺動運動で
きるように回転軸７に固定され、モータ８の駆動によシ
、カム９が回転し、回転軸７と連動するレバー１０を上
下運動させ、レバー１ｏと連動する超音波ホー〉′６が
回転軸７のまわりを上下に揺動運動していた。また超音
波ホーン６を乗せたｘｙテーブル６は半導体回路基板２
に対して、前後、左右に移動し、半導体回路基板２と外
部基板３の規定の位置にワイヤ１を接続していた。Structure of the conventional example and its problems The conventional semiconductor wire bonder, as shown in the concrete structure in FIG. A sonic horn 5 is fixed to a rotating shaft 7 so as to be able to swing around the rotating shaft 7 on an x-y table 6, and a cam 9 is rotated by the drive of a motor 8 and interlocks with the rotating shaft 7. The lever 10 is moved up and down, and the ultrasonic hoe 6, which is interlocked with the lever 1o, is oscillated up and down around the rotating shaft 7. In addition, the xy table 6 on which the ultrasonic horn 6 is placed is a semiconductor circuit board 2.
The wires 1 were connected to predetermined positions on the semiconductor circuit board 2 and the external board 3 by moving back and forth and left and right.

しかしながら上記のような構成では、ｘｙテーブル６の
移動量が大きくなると、外部基板３にＸｙテーブル６が
衝突するため、ｘｙテーブル６の移動量が大きくとれず
、従って、外部基板３が犬きく、広い面積にわたってワ
イヤ１を接続しなければならない場合には、接続が不可
能であった。However, in the above configuration, when the amount of movement of the xy table 6 becomes large, the Xy table 6 collides with the external board 3, so the amount of movement of the xy table 6 cannot be made large, and therefore, the external board 3 is stuck. If the wires 1 had to be connected over a large area, it was impossible to do so.

発明の目的 本発明は、上記欠点に鑑み、ワイヤを接続する接合工具
とともに移動するＸ７テーブルの移動範囲を大きくとる
ことができ、広い面積にわたって半導体回路基板上にワ
イヤを接続できる半導体ワイヤボンダーを提供するもの
である。Purpose of the Invention In view of the above-mentioned drawbacks, the present invention provides a semiconductor wire bonder that can widen the movement range of the X7 table that moves together with the bonding tool that connects wires, and can connect wires on a semiconductor circuit board over a wide area. It is something to do.

発明の構成 本発明の半導体ワイヤボンダーは、半導体回路にワイヤ
を接合する接合工具と、前記接合工具を保持し揺動運動
する超音波ホーンと、前記超音波ホーンを振動させる振
動子と、前記超音波ホーンに対して、前記半導体回路と
反対側に位置し、前記超音波ホーンがそのまわりを揺動
運動するだめの回転軸と、前記超音波ホーンを揺動運動
させる揺動手段と前記超音波ホーン、及び回転軸を上方
より支持し前記回転軸を支持するｘｙテーブルとから構
成され、ワイヤを接合する接合工具とともに移動するｘ
ｙテーブルの移動範囲を大きくとることができ、広い面
積にわたって、半導体回路基板上にワイヤを接続できる
という特有の効果を有する。Structure of the Invention The semiconductor wire bonder of the present invention includes a bonding tool for bonding a wire to a semiconductor circuit, an ultrasonic horn that holds the bonding tool and performs rocking motion, a vibrator that vibrates the ultrasonic horn, and a bonding tool for bonding a wire to a semiconductor circuit. a rotating shaft located on a side opposite to the semiconductor circuit with respect to the sonic horn, around which the ultrasonic horn swings; a swinging means for swinging the ultrasonic horn; and the ultrasonic wave. The x-axis is composed of a horn and an xy table that supports a rotating shaft from above and moves together with a joining tool that joins wires.
This has the unique effect that the y-table can be moved over a wide range, and wires can be connected to the semiconductor circuit board over a wide area.

実施例の説明 以下本発明の一実施例について図面を参照しながら説明
する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第２図は、本発明の実施例における半導体ワイヤボンダ
ーの斜視図を示すものである。第２図において、１１は
半導体回路、１２は外部基板、１３はワイヤ、１４は半
導体回路１１と、外部基板１２の間にワイヤ１３を接合
する接合工具、１５は接合工具１４を保持し揺動運動す
る超音波ホーン、１６は超音波ホーン１５を振動させる
振動子、１７は、超音波ホーン１５に対して、半導体回
路１１と反対側に位置し、超音波ホーン１５がそのまわ
りを揺動するだめの回転軸、１８はモータ、１９はモー
タ１８により回転するカム、２ｏはカム１９と連動して
、揺動運動するレバー、２１は前記超音波ホーン１６、
及び回転軸１７に対して、半導体回路１１と反対側に位
置し、前記回転軸が固定されているＸ７テーブルである
。FIG. 2 shows a perspective view of a semiconductor wire bonder in an embodiment of the present invention. In FIG. 2, 11 is a semiconductor circuit, 12 is an external substrate, 13 is a wire, 14 is a bonding tool for bonding the wire 13 between the semiconductor circuit 11 and the external substrate 12, and 15 is a bonding tool that holds and swings. A moving ultrasonic horn; 16 is a vibrator that vibrates the ultrasonic horn 15; 17 is located on the side opposite to the semiconductor circuit 11 with respect to the ultrasonic horn 15, around which the ultrasonic horn 15 swings; 18 is a motor, 19 is a cam rotated by the motor 18, 2o is a lever that swings in conjunction with the cam 19, 21 is the ultrasonic horn 16,
and an X7 table located on the opposite side of the semiconductor circuit 11 with respect to the rotating shaft 17, to which the rotating shaft is fixed.

以上のように構成された半導体ワイヤボンダーについて
、以下にその動°作を説明する。The operation of the semiconductor wire bonder configured as described above will be explained below.

まず、ワイヤ１３を半導体回路１１と外部基板１２に接
続する接合工具１４を保持した超音波ホーン１６が、回
転軸１７のまわりを揺動運動できるように回転軸１７に
固定されている。そしてモータ１８によりカム１９が回
転し、回転軸１７と連動するレバー２０を上下運動させ
、レバー２０と連動する超音波ホーン１５を揺動運動さ
せ、また振動子１６で超音波ホーンを振動させて接合工
具１４でワイヤ１３を半導体回路１１と外部基板１２０
間に接続する。ここで回転軸１７は、超音波ホーン１６
及び回転軸１７に対して、半導体回路１１と反対側に位
置しだｘｙテーブル２１に固定されており、また回転軸
１７は、超音波ホーン１５に対して半導体回路１１と反
対側に位置しているため、超音波ホーンの先端に保持さ
れている接合工具１４と半導体回路１１との間には、ワ
イヤ１３を接合するだめの機構がない構造となる。従っ
て、ｘｙテーブルの移動量が大きくても、半導体回路１
１及び外部基板１２にワイヤを接合するだめの機構が衝
突することなく、接合工具１４を半導体回路１１と外部
基板１２の規定の位置に、移動させワイヤ１３を接合で
きる。First, an ultrasonic horn 16 holding a bonding tool 14 for connecting the wire 13 to the semiconductor circuit 11 and the external substrate 12 is fixed to the rotating shaft 17 so as to be able to swing around the rotating shaft 17. Then, the motor 18 rotates the cam 19, causes the lever 20 interlocked with the rotating shaft 17 to move up and down, causes the ultrasonic horn 15 interlocked with the lever 20 to swing, and also causes the vibrator 16 to vibrate the ultrasonic horn. The wire 13 is connected to the semiconductor circuit 11 and the external board 120 using the joining tool 14.
Connect between. Here, the rotating shaft 17 is the ultrasonic horn 16
The rotary shaft 17 is located on the side opposite to the semiconductor circuit 11 with respect to the rotating shaft 17 and is fixed to the xy table 21, and the rotating shaft 17 is located on the opposite side of the semiconductor circuit 11 with respect to the ultrasonic horn 15. Therefore, there is no mechanism for joining the wire 13 between the joining tool 14 held at the tip of the ultrasonic horn and the semiconductor circuit 11. Therefore, even if the amount of movement of the xy table is large, the semiconductor circuit 1
The bonding tool 14 can be moved to a prescribed position between the semiconductor circuit 11 and the external substrate 12 to bond the wire 13 without colliding with the mechanism for bonding the wire to the semiconductor circuit 11 and the external substrate 12.

以上のように本実施例によれば、超音波ホーンが揺動運
動するだめの回転軸を超音波ホーンに対して半導体回路
と反対側に設け、Ｘ７テーブルを超音波ホーン及び回転
軸に対して半導体回路と反対側に設けることによシ、ｘ
ｙテーブルの移動量を大きくでき、広い面積にわたって
ワイヤを接合できる。As described above, according to this embodiment, the rotation axis on which the ultrasonic horn swings is provided on the side opposite to the semiconductor circuit with respect to the ultrasonic horn, and the X7 table is provided with respect to the ultrasonic horn and the rotation axis. By providing it on the side opposite to the semiconductor circuit, x
The amount of movement of the y-table can be increased, and wires can be joined over a wide area.

発明の効果 以上のように、本発明によれば、超音波ホーンが揺動運
動するだめの回転軸を超音波ホーンに対して半導体回路
と反対側に設け、ｘｙテーブルを超音波ホーン及び回転
軸に対して、半導光回路と反対側に設けることにより、
ワイヤを接合する接合工具とともに移動するｘｙテーブ
ルの移動範囲を大きくとることができ広い範囲にわたっ
て、半導体回路基板上にワイヤを接続でき、その効果は
犬なるものがある。Effects of the Invention As described above, according to the present invention, the rotation axis on which the ultrasonic horn swings is provided on the side opposite to the semiconductor circuit with respect to the ultrasonic horn, and the xy table is connected to the ultrasonic horn and the rotation axis. However, by providing it on the side opposite to the semi-conducting optical circuit,
The movement range of the xy table that moves together with the joining tool for joining the wires can be increased, and the wires can be connected on the semiconductor circuit board over a wide range, which has a remarkable effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体ワイヤボンダーの斜視図、第２図
は、本発明の一実施例における半導体ワイヤボンダーの
斜視図である。 １．１３・・・・・・ワイヤ、２，１１・・・・・・半
導体回路、３．１２・・・・・・外部基板、４，１４・
・・・・・接合工具、５，１５・・・・・・超音波ホー
ン、６，２１・・・・・・ｘｙチーフル、７，１７・・
・・・・回転軸、８，１８・・・・・・モータ、９，１
９・・・・・・カム、１０．２０・・・・・・レバー、
１６・・・・・・振動子。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名第１
図FIG. 1 is a perspective view of a conventional semiconductor wire bonder, and FIG. 2 is a perspective view of a semiconductor wire bonder according to an embodiment of the present invention. 1.13...Wire, 2,11...Semiconductor circuit, 3.12...External board, 4,14...
...Joining tool, 5,15...Ultrasonic horn, 6,21...xy chiffle, 7,17...
... Rotating shaft, 8, 18 ... Motor, 9, 1
9...Cam, 10.20...Lever,
16... Vibrator. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure

Claims (1)

【特許請求の範囲】[Claims] 半導体回路にワイヤを接合する接合工具と、前記接合工
具を保持し揺動する超音波ホーンと、前記超音波ホーン
を振動させる振動子と、前記超音波ホーンを揺動運動可
能に支持する回転軸と、前記超音波ホーン、及び回転軸
を上方よシ支持し、平面内を移動可能なｘｙテーブルと
を備えだ半導体ワイヤボンダー。A bonding tool for bonding wires to a semiconductor circuit, an ultrasonic horn that holds and swings the bonding tool, a vibrator that vibrates the ultrasonic horn, and a rotating shaft that supports the ultrasonic horn so that it can swing. and an xy table that supports the ultrasonic horn and the rotating shaft upwardly and is movable within a plane.
JP59017330A 1984-02-01 1984-02-01 Semiconductor wire bonder Pending JPS60161628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59017330A JPS60161628A (en) 1984-02-01 1984-02-01 Semiconductor wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59017330A JPS60161628A (en) 1984-02-01 1984-02-01 Semiconductor wire bonder

Publications (1)

Publication Number Publication Date
JPS60161628A true JPS60161628A (en) 1985-08-23

Family

ID=11941037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59017330A Pending JPS60161628A (en) 1984-02-01 1984-02-01 Semiconductor wire bonder

Country Status (1)

Country Link
JP (1) JPS60161628A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

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