JPS60153531U - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS60153531U
JPS60153531U JP4244784U JP4244784U JPS60153531U JP S60153531 U JPS60153531 U JP S60153531U JP 4244784 U JP4244784 U JP 4244784U JP 4244784 U JP4244784 U JP 4244784U JP S60153531 U JPS60153531 U JP S60153531U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lead wire
semiconductor chip
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4244784U
Other languages
Japanese (ja)
Inventor
石川　才司
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP4244784U priority Critical patent/JPS60153531U/en
Publication of JPS60153531U publication Critical patent/JPS60153531U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ　”　ｅは従来装置の構造図、第２図ａ〜ｆ及
び第３図は本考案の実施例構造図である。図に於て１は
リード線、１ａは板状放熱体、２は半導体チップ、３は
リード線、４は接続子、ＡＢは樹脂成形治具、５は樹脂
部、５ａは樹脂パリ、６はリード線上の溝である。 ０＝［コＦ「＋１ｃＬ 、エエゴーー午−Ｊ１ 、ＤＰ　　へ ・　　−一Figures 1a and 1e are structural diagrams of a conventional device, and Figures 2 a to f and 3 are structural diagrams of embodiments of the present invention. In the figures, 1 is a lead wire, 1a is a plate-shaped heat sink, 2 is a semiconductor chip, 3 is a lead wire, 4 is a connector, AB is a resin molding jig, 5 is a resin part, 5a is a resin pad, 6 is a groove on the lead wire. Morning-J1, DP to -1

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 板状放熱体と前記放熱体の一端に連なるリード線部と前
記放熱体に一電極部が固着された半導体チップと前記半
導体チップの他の電極部に接続された他のリード線と前
記半導体チップ及び放熱体を封止する樹脂部を備えた半
導体装置において、前記リード線の前記樹脂部近傍の少
くとも一表面に前記樹脂部に沿った溝を設けたことを特
徴とする樹脂密封型半導体装置。A plate-shaped heat radiator, a lead wire portion connected to one end of the heat radiator, a semiconductor chip having one electrode portion fixed to the heat radiator, another lead wire connected to another electrode portion of the semiconductor chip, and the semiconductor chip. and a resin-sealed semiconductor device comprising a resin portion for sealing a heat sink, characterized in that a groove along the resin portion is provided on at least one surface of the lead wire near the resin portion. .
JP4244784U 1984-03-23 1984-03-23 Resin-sealed semiconductor device Pending JPS60153531U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4244784U JPS60153531U (en) 1984-03-23 1984-03-23 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4244784U JPS60153531U (en) 1984-03-23 1984-03-23 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS60153531U true JPS60153531U (en) 1985-10-12

Family

ID=30553209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4244784U Pending JPS60153531U (en) 1984-03-23 1984-03-23 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS60153531U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019062214A (en) * 2018-11-27 2019-04-18 日亜化学工業株式会社 Light-emitting device, and method for manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512439U (en) * 1978-07-11 1980-01-26
JPS5549966A (en) * 1978-10-05 1980-04-11 Necchi Spa Electromechanical actuator for electrically controlled sewing machine
JPS5664445A (en) * 1979-10-30 1981-06-01 Toshiba Corp Manufacture of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512439U (en) * 1978-07-11 1980-01-26
JPS5549966A (en) * 1978-10-05 1980-04-11 Necchi Spa Electromechanical actuator for electrically controlled sewing machine
JPS5664445A (en) * 1979-10-30 1981-06-01 Toshiba Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019062214A (en) * 2018-11-27 2019-04-18 日亜化学工業株式会社 Light-emitting device, and method for manufacturing the same

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