JPS60153192A - Substrate for printed circuit board - Google Patents

Substrate for printed circuit board

Info

Publication number
JPS60153192A
JPS60153192A JP913084A JP913084A JPS60153192A JP S60153192 A JPS60153192 A JP S60153192A JP 913084 A JP913084 A JP 913084A JP 913084 A JP913084 A JP 913084A JP S60153192 A JPS60153192 A JP S60153192A
Authority
JP
Japan
Prior art keywords
substrate
circuit board
printed circuit
heat treatment
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP913084A
Other languages
Japanese (ja)
Inventor
昭士 中祖
岡村 寿郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP913084A priority Critical patent/JPS60153192A/en
Publication of JPS60153192A publication Critical patent/JPS60153192A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 A発明a杷豚叡めゐいtコ杷啄2イルム寺の杷縁基似の
肉1朗よ1こσ片開に市い伸ひ半と疲労頻度τもつ−り
泊の増を設け7ζプリント配疎叡用基板に閏丁ゐ0多j
−プリント配線板において、内11I導体がe轍き似に
fめ積繊δrした凧冶銅陥のエツテングV(よって形成
さ71.内鳩尋坏と他の専捧1曽との燻絖がスルホール
めっきでおこなわfi/)吃りで61.地品恰載暗の手
出あけなどの熱mi軍によってスルホール壁近くの内J
曽尋捧にクラックの入ることかめvlこの九めrC多鳩
プリント配線板L/7候杭情租住の低下がふ゛こり間屯
とl々o’47cμす囲スルーホールプリント配線板に
おいて、平面部分の導体か杷に、基板に予め禎増すt′
L′fc電解鋼f’hのエツテングVCよって形成さn
[Detailed Description of the Invention] A Invention A Loquat Pig Meat with Loquat 2 Irum Temple's Loquat Enki-like Meat 1 Royo 1 Ko σ One-sided Market Growth and Half and Fatigue Frequency τ- Increased number of holes was added to the board for the 7ζ print distribution board.
- In the printed wiring board, the inner 11I conductor is stacked with f and δr similar to the e-rut. Do it with through-hole plating fi/) stuttering 61. Inner J near the Surhole wall by the heat mi army, such as the opening of the underground
In order to avoid cracks in the surface of the printed wiring board, the surface area of the printed wiring board with through-holes is 47 cm. t' is added to the conductor of the part in advance on the board.
L'fc formed by etching VC of electrolytic steel f'h
.

スリホールあるいにスルホールとランド部分tめっきK
 J: 11畳体化すゐ力法でも#1働軍rCよってス
ルホール壁剋くO平囲部分寺14 V(−クラックの人
ゐことがあり、こりためI/C4−こゐ接続1百租件の
低゛トが問題に−なる。グリント配線叡用り亀屏蛸尚a
杷械材料とり密盾力を篩〈でさゐ町出衣[IUffもつ
よう16% 電、屏1枚にね\刀p丁ゐ鉛≦刀O角りの
種類や亀屏条汗が大めらfしてい勾0この・也屏廟陥a
一般1/Cf?び半の尚さが十分でCなり、11ζ被労
5gi縦か十分でないので上記し1c久点かめ心。
Slit hole or through hole and land part T plating K
J: Even in the 11 tatami body conversion method, #1 force rC will push through the wall through the hole. The low cost of the wire becomes a problem.
Sieve the power of the secret shield by taking the materials of the locomotive. From then on, this place fell into place.
General 1/Cf? If the length of Bihan is enough, it becomes C, and the 11ζ labored 5gi vertical is not enough, so the above is 1C Kupoint Kameshin.

本発明にこの工う、t、aに−みてlさjしたtのでh
杷w、敏あるいa絶縁ンイルム寺の杷做基板の両面ま′
fcに片面に、還元雰曲気で160℃以上の自吸で熱処
理しfc銅紬τ収けることτ鉤望と丁ゐものである。
This invention is applied to t, a and t, so h
Both sides of the loquat substrate of the insulation board
It is desirable that one side of the fc be heat treated by self-priming at 160°C or higher in a reducing atmosphere so that the fc copper pongee can be stored.

本発明rCおいて熱処理副成a160℃以上でめ41J
o熱処理時間a短い刀が習盪しいので好逢しくi’ff
15c1℃以上でめゐ0熱処理tJm元雰卯気でおこな
う。通量の雰囲気で熱処理すると銅量表面からば化さr
Lm表曲が灰黒色に変色すること、この欧化の進行した
層が加重fするようになる。この場合、剥崩片がプリン
ト配祿板用基也の製造工程で異物不良となり品質の低下
τもたら丁ので串犬上使用小oj Weであ/)0還元
雰囲気で熱処理し′fc楊f l’ff *J消衣表面
著しい装色や叡化増の8−11喘不艮が72 < 71
:!It%また通量の雰囲り(で熱処理した揚台エクも
銅量の伸ひ第や疲対シ虫度り同上が浚rLる。賑)c雰
囲気は熱処理用炉内に屋累カスおLひアルゴンガスなと
の不r15性ガスτ辿気することによってつぐらnゐ0
上記力法で熱処理した奄屏附rhは杷線材桝との密着力
の而〈できる析出式曲形状に変化はおこら丁、銅山の伸
びやりul而は疲労−1髪が数音さtLる〇還元′$、
囲気で160℃以上の渦鍵で熱処理したLA+1ン白τ
杷鍬板、肥蝋フィルム忙収けゐVtけ、銅泊士積層板、
鰺1泊加フィルム(ンレキシブル印桐配蛛似用基似)τ
装逅丁ゐ一般の方法が使用小米ゐ。
In the present invention rc, heat treatment by-product a is 41J at 160℃ or higher.
o Heat treatment time a It's good to learn a short sword, so I'ff
15C Heat treatment is carried out at a temperature of 1°C or above in a normal atmosphere for tJm. When heat treated in a normal atmosphere, the copper surface will become brittle.
The color of the Lm surface changes to gray-black, and this layer with advanced Europeanization becomes weighted f. In this case, the flaking pieces may become defective foreign substances in the manufacturing process of the printed grater board, resulting in a decrease in quality. l'ff *J 8-11 pancreatic discoloration with significant discoloration and increased oxidation on the undressed surface 72 < 71
:! In addition, the atmosphere of heat treatment is such that the amount of copper increases and the fatigue level increases as well. By tracing the non-conducting gas τ such as argon gas, Tsugura n20
The heat-treated rh with the above-mentioned force method is due to the adhesion force with the loquat wire rod.There is a change in the precipitation type curved shape that can be formed. Reduction'$,
LA+1 white τ heat treated with a vortex key at 160℃ or higher in an ambient atmosphere
Laminated board, waxed film, copper laminated board,
Mackerel 1 night ka film (flexible indigo paulownia hina imitation base imitation) τ
A common method of mounting is used for small rice.

実施例 辿冨のプリント配線板に使用されゐ懺叡鋼給から侍らf
した電解銅山から侍らfした箪牌銅Vbx室索ガス雰凹
気の炉内で熱処理時間1時間、熱処理崗吸1.50,1
50,200,250.3oo 、 65o 、400
℃で熱処理した0熱処堆さnた銅紬の引加試験tおこな
い伸び牟忙御」矩した。1tato東洋ボ一ルドワイン
表テンンロン型引張試験)炊を用いた。試験片サイスU
10×1201111O,テ’ryり間距x’i s 
o mm、引張速凝=21I1mZ分で66゜−E7t
J I 5−P−51135に足めらfしてい/8耐3
jr試験慎忙用い竹9曲は彼方強鵬τ脚ベアCo試料幅
にl Q 01111.り「す囲は月間げ表向と表面に
各々155°、り丁り曲は速度a175土1回/分hk
り曲tプ面の千K IJ 2 an 7用いた0こnら
の結果を第1図、第2図VC示す。
Used in the printed wiring board of the example tracer from Samurai F
Heat treatment time 1 hour in a furnace with gas atmosphere, heat treatment time 1.50,1
50,200,250.3oo, 65o, 400
Additional tests were carried out on copper pongee which had been heat treated at 0°C and its growth was evaluated. 1tato Toyo Boiled Wine table Tenron type tensile test) was used. Test piece size U
10×1201111O, Te'ry distance x'i s
o mm, tensile speed solidification = 66°-E7t at 21I1mZ min
J I 5-P-51135 is running out of time/8 hours 3
JR exam Shinjyo used bamboo 9 songs are far Qiangpeng τ leg Bear Co sample width l Q 01111. The radius is 155° for both the upper and lower sides, and the curve is at a speed of A175 and 1 time/min.
The results obtained using 1,000 K IJ 2 an 7 of a curved surface are shown in FIGS. 1 and 2 VC.

比教?!I、実施例で用いたのと同じ電解山で用いて、
通冨の雰囲気で実施例と同じ熱処理時間と終処Jff謳
度で熱処理した。夾btM例と11ηじ末汁で伸び率と
にり曲げ彼方強凌τ調べた0処鹿τおこlわlかった′
也屏陥も同じ条件で測足した〇こnらの結果を実N例の
結果と合わせて図1゜図21/(ボす。
Hinduism? ! I, using the same electrolytic mountain as used in the example,
Heat treatment was carried out in a rich atmosphere at the same heat treatment time and final Jff rating as in the example. I investigated the elongation rate and the bending distance in the case of 11η with the btM example.
The results of 〇 and others, which were also measured under the same conditions, are combined with the results of the actual N cases in Figure 1゜Figure 21/(Boss).

第1図、第2凶から明らかなように、本発明Kjflは
電解銅山の還元雰囲気での熱処理によって、人聞形状と
クト駅に変化τおこさせることZ(、伸び率と切2り曲
は彼方551iI貌?f″著しく同上さぜることがで@
ゐ0その粕来、プリント配祿似において半田ありなとの
熱1に1玉よって引さおこさrtゐスルホール近(の電
解銅陥のエツチングで倚らt′LfC,畳体のクラック
梶庄が抑制さnるQ
As is clear from Fig. 1 and Fig. 2, the Kjfl of the present invention causes a change τ in the human shape and curve by heat treatment in the reducing atmosphere of an electrolytic copper mine. Beyond 551iI appearance?
In the process of printing, the cracks in the tatami body are caused by the etching of the electrolytic copper recess (near the through hole), which is caused by one ball per heat of the solder. suppressed nru Q

【図面の簡単な説明】[Brief explanation of drawings]

第1凶a熱処理渦度と一牌鋼陥の伸び率の圓保tボ丁り
ラフ、第2凶は熱処理溝を貌と′亀鱗廁消の釘9曲は成
力強度の閃恍τ示すグラフでろ/bら 第1図 熱ル理温度(0C) 第2図 ψ 杷 迂 す 蓼 に 鮎迅理温度(0C)
The first one is the heat treatment vorticity and the elongation rate of the steel plate, and the second one is the heat treatment groove, and the 9 nails of the turtle scales are the flash of strength. Figure 1: Thermal temperature (0C) Figure 2: ψ The temperature of Ayu (0C)

Claims (1)

【特許請求の範囲】[Claims] 1、絶縁基板の氷面に、逮元雰囲気で150℃以上の繊
成で熱処理し7j章泊で収りてなゐプリントF!len
M板用丞撤〇
1. Printed on the ice surface of the insulating substrate, heat-treated at 150 degrees Celsius or higher in an atmosphere that will last for 7 years. len
Removal for M plate
JP913084A 1984-01-20 1984-01-20 Substrate for printed circuit board Pending JPS60153192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP913084A JPS60153192A (en) 1984-01-20 1984-01-20 Substrate for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP913084A JPS60153192A (en) 1984-01-20 1984-01-20 Substrate for printed circuit board

Publications (1)

Publication Number Publication Date
JPS60153192A true JPS60153192A (en) 1985-08-12

Family

ID=11712042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP913084A Pending JPS60153192A (en) 1984-01-20 1984-01-20 Substrate for printed circuit board

Country Status (1)

Country Link
JP (1) JPS60153192A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237996A (en) * 1985-08-12 1987-02-18 松下電工株式会社 Multilayer printed wiring board
JPS63264341A (en) * 1987-04-21 1988-11-01 Toshiba Chem Corp Multi-layer copper plated laminate
JPH01119091A (en) * 1987-10-30 1989-05-11 Ibiden Co Ltd Printed circuit board for ic card
JPH05243698A (en) * 1991-04-24 1993-09-21 Matsushita Electric Works Ltd Metal-foil-clad laminated board and its manufacture
JP2014060092A (en) * 2012-09-19 2014-04-03 Sh Copper Products Corp Method for manufacturing negative electrode collector copper foil, negative electrode collector copper foil, negative electrode for lithium ion secondary battery, and lithium ion secondary battery

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237996A (en) * 1985-08-12 1987-02-18 松下電工株式会社 Multilayer printed wiring board
JPS63264341A (en) * 1987-04-21 1988-11-01 Toshiba Chem Corp Multi-layer copper plated laminate
JPH01119091A (en) * 1987-10-30 1989-05-11 Ibiden Co Ltd Printed circuit board for ic card
JPH05243698A (en) * 1991-04-24 1993-09-21 Matsushita Electric Works Ltd Metal-foil-clad laminated board and its manufacture
JP2014060092A (en) * 2012-09-19 2014-04-03 Sh Copper Products Corp Method for manufacturing negative electrode collector copper foil, negative electrode collector copper foil, negative electrode for lithium ion secondary battery, and lithium ion secondary battery

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