JPS60145972A - セラミックス−金属接合体 - Google Patents
セラミックス−金属接合体Info
- Publication number
- JPS60145972A JPS60145972A JP24598183A JP24598183A JPS60145972A JP S60145972 A JPS60145972 A JP S60145972A JP 24598183 A JP24598183 A JP 24598183A JP 24598183 A JP24598183 A JP 24598183A JP S60145972 A JPS60145972 A JP S60145972A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- metal
- bonded body
- thermal expansion
- metal bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 35
- 239000002184 metal Substances 0.000 title claims description 35
- 239000000919 ceramic Substances 0.000 claims description 32
- 239000007769 metal material Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims description 8
- 239000011733 molybdenum Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229910052575 non-oxide ceramic Inorganic materials 0.000 claims description 2
- 239000011225 non-oxide ceramic Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 229910052759 nickel Inorganic materials 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- NMHMDUCCVHOJQI-UHFFFAOYSA-N lithium molybdate Chemical compound [Li+].[Li+].[O-][Mo]([O-])(=O)=O NMHMDUCCVHOJQI-UHFFFAOYSA-N 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24598183A JPS60145972A (ja) | 1983-12-29 | 1983-12-29 | セラミックス−金属接合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24598183A JPS60145972A (ja) | 1983-12-29 | 1983-12-29 | セラミックス−金属接合体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60145972A true JPS60145972A (ja) | 1985-08-01 |
| JPH0460947B2 JPH0460947B2 (enrdf_load_stackoverflow) | 1992-09-29 |
Family
ID=17141699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24598183A Granted JPS60145972A (ja) | 1983-12-29 | 1983-12-29 | セラミックス−金属接合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60145972A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63206365A (ja) * | 1987-02-23 | 1988-08-25 | 京セラ株式会社 | セラミツクスと金属の接合体 |
| US4924033A (en) * | 1988-03-04 | 1990-05-08 | Kabushiki Kaisha Toshiba | Brazing paste for bonding metal and ceramic |
| JP2019185905A (ja) * | 2018-04-04 | 2019-10-24 | 日本特殊陶業株式会社 | セラミックス部材および緩衝部材の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125673A (ja) * | 1982-01-12 | 1983-07-26 | 新明和工業株式会社 | 拡散接合方法 |
-
1983
- 1983-12-29 JP JP24598183A patent/JPS60145972A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125673A (ja) * | 1982-01-12 | 1983-07-26 | 新明和工業株式会社 | 拡散接合方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63206365A (ja) * | 1987-02-23 | 1988-08-25 | 京セラ株式会社 | セラミツクスと金属の接合体 |
| US4924033A (en) * | 1988-03-04 | 1990-05-08 | Kabushiki Kaisha Toshiba | Brazing paste for bonding metal and ceramic |
| JP2019185905A (ja) * | 2018-04-04 | 2019-10-24 | 日本特殊陶業株式会社 | セラミックス部材および緩衝部材の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0460947B2 (enrdf_load_stackoverflow) | 1992-09-29 |
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