JPS60145271A - Laser working method - Google Patents

Laser working method

Info

Publication number
JPS60145271A
JPS60145271A JP59000998A JP99884A JPS60145271A JP S60145271 A JPS60145271 A JP S60145271A JP 59000998 A JP59000998 A JP 59000998A JP 99884 A JP99884 A JP 99884A JP S60145271 A JPS60145271 A JP S60145271A
Authority
JP
Japan
Prior art keywords
soldered
soldering
hole
lead
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59000998A
Other languages
Japanese (ja)
Inventor
Tadao Nakaichi
中市　忠男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59000998A priority Critical patent/JPS60145271A/en
Publication of JPS60145271A publication Critical patent/JPS60145271A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)

Abstract

PURPOSE:To perform soldering with high stability and reliability by punching preliminarily a through-hole to the part of the 1st part to be applied directly with laser light and applying directly the laser light to the solder interposed with the 2nd part as well. CONSTITUTION:A through-hole 11 is preliminarily punched to the part to be soldered of a lead piece 10 and a lead terminal 3a of an insulating circuit board 3 is superposed thereon after solder 12 is interposed therebetween then laser light 4 is irradiated via a condenser lens 7 to the hole 11. The entire part of the part to be soldered of the lead piece 10 and the lead terminal 3a is thus quickly heated to the same temp. and the lead piece 10 and the terminal 3a are soldered without contact in short time without giving any unnecessary thermal influence to the work.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はレーザｆＴｈ使用して半田付するレーザ加工方
法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a laser processing method for soldering using a laser fTh.

従来例の構成とその問題点 従来半田付加工するには半田ごて等を使用する方法が多
く用いられているが、この方法では半田とての温度管理
、こて先の摩耗や酸化、被加工物に及ぼす加工圧などに
問題がある。その点レーザ光を使用すると非接触のため
、半田付する加工物に加工圧を与えることなく、工具の
摩耗や酸化もなく、短時間に半田付をおこなうため被加
工物に熱影響をおよぼすことなく半田付をおこなうこと
ができる利点を有するため、最近レーザ光による半田付
加工がおこなわれるようになってきた。Conventional structure and its problems Traditionally, a method using a soldering iron etc. is often used for soldering, but this method requires temperature control of the soldering iron, wear and oxidation of the iron tip, and damage to the soldering iron. There are problems with the processing pressure exerted on the workpiece. On the other hand, since laser light is non-contact, it does not apply processing pressure to the workpiece to be soldered, and there is no wear or oxidation of the tool, and since soldering is performed in a short time, there is no heat effect on the workpiece. Recently, soldering processing using laser light has come to be performed because it has the advantage of being able to perform soldering without any problems.

第１図は半田ごてによる従来例を示し、１は半田ごて、
２はリード片、３は絶縁基板、３ａはリード端子である
。そしてリード片２の半田付する個所およびリード端子
３ａの半田付する個所にはあらかじめ半田メッキをして
おき、半田ごて１の熱と加工圧によりリード片２とリー
ド端子３ａとを半田付するのが一般的である。しかしな
がら、このような従来の半田付方法においては、前記半
田ごて１の温度管理やリード片２、リード端子３８への
接触時間および加工圧等作業上、作業者の熟練度や制御
上きわめて難しい点が多く、半田付部の安定性、信頼性
を損なう欠点を有するため、最近ではレーザ光による短
時間で非接触で半田付がおこなえるレーザ加工方法がク
ローズアップされてきた。Figure 1 shows a conventional example using a soldering iron.
2 is a lead piece, 3 is an insulating substrate, and 3a is a lead terminal. The parts of the lead piece 2 to be soldered and the parts of the lead terminal 3a to be soldered are plated with solder in advance, and the lead piece 2 and the lead terminal 3a are soldered using the heat and processing pressure of the soldering iron 1. is common. However, in such a conventional soldering method, it is extremely difficult to control the temperature of the soldering iron 1, the contact time to the lead piece 2 and the lead terminal 38, the processing pressure, etc., and the operator's skill level and control. Since there are many dots and the disadvantage is that it impairs the stability and reliability of the soldered part, recently, laser processing methods that can perform non-contact soldering in a short time using laser light have been attracting attention.

第２図はレーザ加工方法の従来例を示す。２゜３，３ａ
は第１図のそれと同様のリード片、４はレーザ発振器５
からのレーザ光、６は屈折ミラー、７は集光レンズ、８
はノズル、９はアシストガス入口である。そして前記レ
ーザ発振器５より発振されたレーザ光４が屈折ミラー６
により９００屈折され集光レンズ７によりリード片２と
密着されたリード端子３ａ上にレーザ照射することによ
り、無加圧、非接触で短時間に半田付をおこなう、もの
である。しかしこの方法では集光レンズ６により集光さ
れたレーザ光４の波長１０．６μｍがリード片２の半田
メッキ層により反射がおこり、集光されたレーザ光４の
エネルギーを有効に活用することができず、捷だその反
射の度合いも不定で半田付に要する時間およびエネルギ
ーが設定しにくい欠点を有し、半田付の安定性、信頼性
が損なわれる。FIG. 2 shows a conventional example of a laser processing method. 2゜3,3a
is a lead piece similar to that in Fig. 1, and 4 is a laser oscillator 5.
6 is a refracting mirror, 7 is a condensing lens, 8 is a laser beam from
9 is a nozzle, and 9 is an assist gas inlet. Then, the laser beam 4 oscillated from the laser oscillator 5 is transmitted to a refracting mirror 6.
By irradiating a laser onto the lead terminal 3a which is refracted by 900 degrees and brought into close contact with the lead piece 2 by the condensing lens 7, soldering can be performed in a short time without pressure and without contact. However, in this method, the wavelength of 10.6 μm of the laser beam 4 focused by the condensing lens 6 is reflected by the solder plating layer of the lead piece 2, making it impossible to effectively utilize the energy of the focused laser beam 4. It has the disadvantage that the degree of reflection of the shingles is not constant and that it is difficult to set the time and energy required for soldering, which impairs the stability and reliability of soldering.

発明の目的 本発明のレーザ加工方法は、従来の半田ごてによる半田
付方法あるいはレーザ光による半田付方法における欠点
を解消することを目的とする。OBJECTS OF THE INVENTION The purpose of the laser processing method of the present invention is to eliminate the drawbacks of conventional soldering methods using a soldering iron or laser beam.

発明の構成 そのための構成として、本発明のレーザ加工方法は、レ
ーザ発振器の出射光からみて直接レーザ光のあたる第１
の部品と、その裏にある第２の部品を半田を介して半田
付する場合において、前記第１の部品にレーザ光があた
る部分に貫通孔を予め穿設し、レーザ光を照射した場合
に直接半田にもレーザ光があたるようにしたものである
。Structure of the Invention As a structure for that purpose, the laser processing method of the present invention provides a first
When a part and a second part on the back thereof are soldered together, a through hole is drilled in advance in the part of the first part that is hit by the laser beam, and the laser beam is irradiated. The laser beam also directly hits the solder.

実施例の説明 以下、本発明のレーザ加工方法を実施した図面の第３図
、第４図に沿って詳細に説明する。３゜３ａ、４．７は
それぞれ従来と同様の絶縁基板。DESCRIPTION OF EMBODIMENTS Hereinafter, a detailed explanation will be given with reference to FIGS. 3 and 4 of the drawings in which the laser processing method of the present invention is implemented. 3゜3a and 4.7 are the same insulating substrates as the conventional ones.

リード端子、レーザ光、集光レンズである。These are a lead terminal, a laser beam, and a condensing lens.

第３図および第４図に示すようにリニド片１０の半田付
する部分に貫通孔１１を設け、半田１２およびリード端
子３ａに集光レンズ７により集光されたレーザ光４が直
接当たるようにした。なお貫通孔１１は複数設けても良
い。これにより半田付の基本である半田付しようとする
部分全体をすぼやく同じ温度にし、被加工物によけいな
熱影響をおよぼすことなく短時間に非接触で半田付をす
ることを可能にした。As shown in FIGS. 3 and 4, a through hole 11 is provided in the part of the linide piece 10 to be soldered so that the laser beam 4 focused by the condensing lens 7 directly hits the solder 12 and the lead terminal 3a. did. Note that a plurality of through holes 11 may be provided. This makes it possible to quickly bring the entire part to be soldered to the same temperature, which is the basis of soldering, and to perform non-contact soldering in a short period of time without any significant thermal effect on the workpiece.

発明の効果 以上のように、本発明のレーザ加工方法は、貫通孔をリ
ード片に予め穿設してレーザ光を半田に直接当たるよう
にしたため安定性および信頼性の高い半田付を提供する
ことができる優れた効果を奏するものである。Effects of the Invention As described above, the laser processing method of the present invention provides highly stable and reliable soldering because a through hole is pre-drilled in the lead piece so that the laser beam directly hits the solder. It has excellent effects.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の半田ごてによる半田付方法を示す説明図
、第２図は従来のレーザ加工方法を示す説明図、第３図
は本発明のレーザ加工方法を実施する一部説明図、第４
図は同一部断面図である。 ３・、・・・・絶縁基板、３ａ・・・・・・リード端子
、４・・・・・・レーザ光、７・・・・・・集光レンズ
、８・・・・・・ノズル、９・・・・・・アシストガス
入口、１０・・・・・・リード片、１１・・・・・・貫
通孔、１２・・・・・・半田。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名菓　
１　図 第２図FIG. 1 is an explanatory diagram showing a conventional soldering method using a soldering iron, FIG. 2 is an explanatory diagram showing a conventional laser processing method, and FIG. 3 is a partial explanatory diagram showing the laser processing method of the present invention. Fourth
The figure is a sectional view of the same part. 3...Insulating substrate, 3a...Lead terminal, 4...Laser light, 7...Condensing lens, 8...Nozzle, 9...Assist gas inlet, 10...Lead piece, 11...Through hole, 12...Solder. Name of agent: Patent attorney Toshio Nakao and one other name
1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] レーザ発振器の出射光からみて直接レーザ光のあたる第
１の部品と、その裏にある第２の部品を半田を介して半
田付する場合に−おいて、前記第１の部品にレーザ光が
あたる部分に貫通孔を予め穿設し、レーザ光を照射した
場合に直接半田にもレーザ光があたるようにしたレーザ
加工方法。When soldering a first component that is directly hit by the laser beam when viewed from the output light of the laser oscillator and a second component that is behind it, the first component is hit by the laser beam. A laser processing method in which a through hole is pre-drilled in the part so that when the laser beam is irradiated, the laser beam also directly hits the solder.
JP59000998A 1984-01-06 1984-01-06 Laser working method Pending JPS60145271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59000998A JPS60145271A (en) 1984-01-06 1984-01-06 Laser working method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59000998A JPS60145271A (en) 1984-01-06 1984-01-06 Laser working method

Publications (1)

Publication Number Publication Date
JPS60145271A true JPS60145271A (en) 1985-07-31

Family

ID=11489255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59000998A Pending JPS60145271A (en) 1984-01-06 1984-01-06 Laser working method

Country Status (1)

Country Link
JP (1) JPS60145271A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6380988A (en) * 1986-09-22 1988-04-11 Shimadzu Corp Laser beam welding method
WO2002099366A1 (en) * 2001-05-31 2002-12-12 Nippon Seiki Co.,Ltd Liquid level detector and method of assembling the detector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6380988A (en) * 1986-09-22 1988-04-11 Shimadzu Corp Laser beam welding method
JP2638787B2 (en) * 1986-09-22 1997-08-06 株式会社島津製作所 Laser welding method
WO2002099366A1 (en) * 2001-05-31 2002-12-12 Nippon Seiki Co.,Ltd Liquid level detector and method of assembling the detector

Similar Documents

Publication Publication Date Title
JP2004505457A (en) Method for contacting a flexible printed wiring board with a contact partner and a unit comprising a flexible printed wiring board and a contact partner
MY106703A (en) A fluxless soldering process.
KR860003756A (en) Electronic circuit device and manufacturing method
IE841438L (en) Etching and plating processes
US5194710A (en) Method and apparatus for laser masking of lead bonding
JPS60145271A (en) Laser working method
EP0999729A3 (en) Process for laser soldering and for temperature monitoring of semi-conductor chips, and chip cards manufactured according to this process
JPH0230576B2 (en)
JPS60133992A (en) Piercing device for printed circuit board
JPH0767613B2 (en) Soldering tool
JPS6195792A (en) Production of printed wiring board
JPS61229492A (en) Formation of through-hole to substrate
JPH026055A (en) Method of soldering printed circuit board and silicon chip
JPS5929496A (en) Method of soldering multileg electronic part
JPH0313944B2 (en)
JPH04162641A (en) Laser bonding method
JPH07211424A (en) Soldering method and soldering device
JPH10180478A (en) Welding method and surface mounting parts
JPH07283511A (en) Laser trimming method of circuit element formed of copper foil of printed wiring board
JP2001047222A (en) Reflow soldering method for coated thin wire by laser beam
Kenney III et al. Laser drilling of very small electronic via holes in common circuit board materials
Messler Jr et al. Laser soldering: new light on an old joining process
JPH0362562A (en) Semiconductor integrated circuit device
Battista et al. Laser welding of microcircuit interconnections-simultaneous multiple bonds of aluminum to kovar
JPH02247076A (en) Laser beam soldering device