JPS60144356A - Phenolic resin molding material - Google Patents

Abstract

PURPOSE:To provide the titled material giving moldings which pass the Food Sanitation Act, can be well finished by coating with dry Japanese lacquer and have good adhesion to ground coats, by adding walnut shell flour as a filler. CONSTITUTION:A phenolic resin molding material is obtd. by adding pref. 30- 70wt% (based on the total quantity of the material) walnut shell flour as a filler. Japanese lacquer or a urethane coating as a ground coating for Japanese lacquer wares has been conventionally applied to the surfaces of phenolic resin moldings. However, there is a problem that coating time is as long as one week. The coating time can be shortened to 1/3 by coating with dry Japanese lacquer. However, this method has problems in adhesion to ground coats and finishing depending on ground coats. By adding walnut shell flour, moldings which can be well finished by the coating with dry Japanese lacquer and has improved adhesion to ground coats can be obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a phenolic resin molding material used for molded tableware for dry lacquered bases, such as bowls, lunch boxes, jubako, bowls, and plates.

[Background technology]

To be used in tableware molded products, the consumption amount of potassium permanganate must be 10% according to the Food Sanitation Law Ministry of Health and Welfare Notification No. 1) regulation.
It is necessary to have a relatively light molded product with a specific gravity of less than 1.35 ppm and a specific gravity of less than 1.35. Conventionally, wood flour, which is the main filler in phenolic resin molding materials, has been reduced and inorganic fillers such as Merck are used instead. However, the combined use of inorganic fillers had the problem of increasing specific gravity. Furthermore, conventionally, lacquer or urethane coating has been applied to the surface of phenolic resin molded articles as a base for lacquerware, but this has the disadvantage that the coating period requires a long period of about one week. In response to this, dry lacquer painting has recently appeared, and the painting period has been shortened to 1/3 culm. However, dry lacquer painting had problems with its adhesion to the base material and the finish achieved by the base material.

[Purpose of the invention]

An object of the present invention is to provide a phenolic resin molding material that passes the Food Sanitation Law, has a good finish when coated with dry lacquer, and can yield molded products with good adhesion to the substrate.

[Disclosure of the invention]

The present invention is a phenolic resin molding material characterized by the addition of walnut powder as a filler, which provides a good finish with dry lacquer coating and improves adhesion to the substrate. be. The present invention will be explained in detail below.

It is safe to use walnut flour as the main component of the filler used in the present invention, and the particle size and shape of the walnut flour are not particularly limited. The amount added is not limited either, but it is preferably 30 to 70% by weight (hereinafter simply referred to as %) of the total amount from the viewpoint of improving the finish of dry lacquer coating and adhesion to the substrate. As the phenol resin, phenol resin, cresol resin, xylenol resin, etc. alone, modified products, mixtures, etc. can be used, and there is no particular limitation as long as it is a phenol resin.Additions other than phenol resin and walnut powder As an agent, a curing agent commonly used for phenolic resin molding materials,
A mold release agent, a coloring agent, a reinforcing agent, a filler, etc. can be used as they are, and these materials are mixed, kneaded, crushed and, if necessary, granulated to obtain a phenolic resin molding material.

The present invention will be explained below using examples.

[Examples 1 to 3 and conventional example] The first example using a novolac type phenolic resin with a melting point of 90°C
A phenolic resin molding material was obtained by mixing, mixing, and pulverizing according to the recipe shown in the table.

Table 1 [Effects of the invention] The phenolic resin molding materials of Examples 1 to 3 and the conventional example were molded in a bowl mold at a molding pressure of 100"QAa and 150"C.
As is clear from Table 2, the performance of the molded product obtained from the phenolic resin molding-1 material of the present invention was well confirmed to be superior to that of the present invention.

Claims (1)

[Claims] 111. A pheno-1v resin molding material characterized in that walnut powder is added as a filler. (The 7-enol resin molding material according to claim 1, wherein the amount of walnut powder is 30 to 70% by weight of the total amount.