JPS60143792A - Temperature testing method - Google Patents

Abstract

PURPOSE:To perform high temp. burning-in, by providing a partition plate to a shelf having a printed circuit board therein and attaining to raise the temp. in the shelf by heat generated from the semiconductor element monted to the printed circuit board by driving the fan of a fan unit. CONSTITUTION:A shelf 8 is constituted so that a printed circuit board 6 having a plurality of semiconductor elements 13 mounted thereto is received in a detachable manner and the open air is taken in from the direction shown by the arrow C by driving the fan 11 of a fan unit 10 and exhausted from the direction shown by the arrow D to cool the elements 13. Partititon plates 14 are respectively provided to surfaces above and below the mounting boundary of the shelf 8 and other machineries to form a predetermined space and a plurality of fans 11-1-11-4 provided in opposed relation to upper and lower surfaces of the shelf 8 so as to recirculate heat generated from the elements 13 secured to the printed circuit board 12 are driven to send out air to directions E1, E2...E6 and an electronic apparatus is operated. Whereupon, the temp. in the shelf 8 rises and high temp. burning-in can be carried out.

Description

Detailed Description of the Invention (al) Technical Field of the Invention The present invention relates to a temperature test method for burn-in an electronic device having a shelf Z storing printed boards at a predetermined high temperature. Conventional technology and problems It is more effective to perform high-temperature burn-in to eliminate initial failures of semiconductor elements mounted on printed circuit boards used in electronic devices. Therefore, in general, when testing electronic devices, as part of the environmental resistance test, the ambient temperature is set to a predetermined high temperature, and a high temperature operation margin test is performed.

Such a temperature test was conducted using the configuration shown in FIG. FIG. 1 is an explanatory diagram illustrating a conventional temperature testing method.

11゛i First, open door 2 of ↑l greenhouse 1 in the direction of the arrow, -1'
Insert the slave device 5 into the thermostatic chamber 1. Next, a power line and a signal line are connected to the electronic device 5, and the door 2
The temperature inside the greenhouse is increased by the heater 9, and the electronic device 5 is closed at a temperature of about 50°C.
Operation tests will be carried out.

It has the disadvantage of requiring a lot of man-hours. However, with this test method, there is a problem in that it is necessary to divide the four-force section 7 and perform the test, especially when the printed circuit board is stored. Ta.

(cl) Purpose of the Invention The purpose of the present invention is to set a fixed point H1 to a high temperature due to heat generated by a semiconductor element on a printed board mounted on an electronic device.
SUMMARY OF THE INVENTION An object of the present invention is to provide a temperature test method in which high temperature burn-in is performed and the above-mentioned problems are eliminated. A partition plate is provided to form a predetermined space, and one or more fans are provided facing the upper and lower surfaces of the shelf to circulate the heat generated by the semiconductor elements fixed to the printed board in the space. This is achieved by a temperature testing method characterized by driving the temperature to a predetermined temperature rise.

tel　Embodiments of the invention The present invention will be explained in detail below with reference to FIG.

FIG. 2 shows an embodiment of the temperature test method according to the present invention (
The figure a) is a side view, and the figure (b) is an explanatory view.

By moving the fan lly<m of the fan unit 10 provided on the digital camera 8 in which the printed board 12 is stored, and furthermore, by providing a partition plate 14 on the upper and lower surfaces of the shelf 8, the printed board 12 can be mounted. The heat generated by the semiconductor element 13 is circulated inside the shelf 8, raising the temperature inside the shelf 8 and performing high-temperature burn-in.

A printed board 12 is removably housed in the shelf 8, and a plurality of semiconductor elements 15 are mounted on the printed board 12. This shelf 8 is provided with a fan unit 10, and by driving the fan 11 of the fan unit 10, outside air is taken in in the direction indicated by the arrow and exhausted in the direction indicated by the arrow, thereby cooling the semiconductor element 13. It is designed so that it can be

Therefore, partition plates 14 are provided on the upper and lower surfaces of this shelf 8, respectively.
v Mounted in the direction of arrow B, each fan 11 of the fan unit 10 is driven as shown in FIG. The fan 11-1 takes in air from the direction of arrow E6,
The fan 11-2 takes in air from the direction of arrow E2 so as to send out air in the direction of arrow E3, and the fan 11-3 takes in air from the direction of arrow E in the direction of force.
The fan 11-4 takes in air in the direction of arrow E, force direction, and sends out air in the direction of arrow E6, so that the air inside the shelf 8 is circulated so as to be sent out in four directions. Such driving of the fan 11 can be easily performed by changing the connection of the power supply wiring.

As a result, when the electronic device 5Y is operated, the temperature inside the shelf 8 is increased and high-temperature burn-in can be performed. This is also possible by providing such a temperature riser. Therefore, the above-mentioned location is only the shelf 8, and there is an advantage that high-temperature burn-in can be performed without any problem even if the above-mentioned mechanical section 7 is mounted.

Tfl As described in detail, the present invention provides a partition plate 14 on the shelf 8 in which the printed circuit board 12 is stored, and a fan unit lO.
The fan 11 is driven, and the heat generated by the semiconductor element 13 mounted on the printed board 12 raises the internal temperature of the knife 8, eliminating the need for high temperatures and the need to relocate the electronic device 11t5 for temperature testing. Furthermore, since the temperature is raised only at the necessary predetermined locations, even if the mechanical section 7 is mounted, there is no need to divide it (high-temperature burn-in can be performed, which has a great practical effect).

[Brief explanation of drawings]

Figure 1 is an explanatory diagram of the conventional temperature test method, and Figure 2 is a diagram of the conventional temperature test method.
An example according to the temperature test method according to Akira, 9 indicates a cable, 5 indicates an electronic device, 6 indicates an operator panel, 7 indicates a mechanical section, 8 indicates a shelf, 9 indicates a heater, 10 indicates a fan unit, 11 -1.11-2.11-3.11-4 is a fan, 12 is a printer i-version, 13 is a semiconductor element, and 14 is a partition plate. Figure 2 4 Cb)

Claims (1)

[Claims] Electronic equipment fly with shelf containing printed boards
a: A temperature test method in which burn-in is performed at a predetermined temperature, in which a partition plate is provided at the mounting boundary between the shelf and other equipment to form a predetermined space, and in the space there is a partition plate fixed to the printed board. A temperature testing method characterized in that a plurality of fans provided facing each other on the upper and lower surfaces of the shelf are driven so that the heat generated by the semiconductor elements is circulated, and a constant temperature rise is performed.