JPS60143579A - セラミツク基板の端子構造 - Google Patents
セラミツク基板の端子構造Info
- Publication number
- JPS60143579A JPS60143579A JP58245736A JP24573683A JPS60143579A JP S60143579 A JPS60143579 A JP S60143579A JP 58245736 A JP58245736 A JP 58245736A JP 24573683 A JP24573683 A JP 24573683A JP S60143579 A JPS60143579 A JP S60143579A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- electrode wire
- terminal structure
- platinum
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 30
- 239000000919 ceramic Substances 0.000 title claims description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 50
- 229910052697 platinum Inorganic materials 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 238000002485 combustion reaction Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000005385 borate glass Substances 0.000 description 2
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 235000014121 butter Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Measuring Oxygen Concentration In Cells (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58245736A JPS60143579A (ja) | 1983-12-29 | 1983-12-29 | セラミツク基板の端子構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58245736A JPS60143579A (ja) | 1983-12-29 | 1983-12-29 | セラミツク基板の端子構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60143579A true JPS60143579A (ja) | 1985-07-29 |
JPH024993B2 JPH024993B2 (enrdf_load_stackoverflow) | 1990-01-31 |
Family
ID=17138035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58245736A Granted JPS60143579A (ja) | 1983-12-29 | 1983-12-29 | セラミツク基板の端子構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60143579A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02124456A (ja) * | 1988-11-02 | 1990-05-11 | Ngk Spark Plug Co Ltd | 固体電解質素子の接続構造 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02120443U (enrdf_load_stackoverflow) * | 1989-03-16 | 1990-09-28 |
-
1983
- 1983-12-29 JP JP58245736A patent/JPS60143579A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02124456A (ja) * | 1988-11-02 | 1990-05-11 | Ngk Spark Plug Co Ltd | 固体電解質素子の接続構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH024993B2 (enrdf_load_stackoverflow) | 1990-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6880969B2 (en) | Temperature sensor and production method thereof | |
US4660407A (en) | Gas sensor | |
EP0182485B1 (en) | Gas sensing element | |
JPH0915201A (ja) | 出力補正機能付きセンサ | |
JP4036933B2 (ja) | 抵抗・温度ヒュ−ズ及びその製作方法 | |
JPS60211345A (ja) | 高温で使用するセンサーのセラミック基板の端子構造 | |
JP2868272B2 (ja) | センサの組付構造 | |
JP5083898B2 (ja) | アンモニアガスセンサ | |
JPS60143579A (ja) | セラミツク基板の端子構造 | |
JP2020034348A (ja) | 粒子状物質検出センサ素子 | |
JPS60227158A (ja) | ガスセンサ− | |
JP4791834B2 (ja) | ガスセンサ | |
JPS60158346A (ja) | ガスセンサ | |
JPH0310131A (ja) | 高温用サーミスタ | |
JP4763381B2 (ja) | セラミックヒータ素子、ヒータ付属ガスセンサ素子、温度センサ素子、およびガスセンサ | |
US4909066A (en) | Thick-film gas sensor of a laminar structure and a method of producing the same | |
JP4421756B2 (ja) | 積層型ガスセンサ素子の製造方法 | |
JPH052848Y2 (enrdf_load_stackoverflow) | ||
JPH0410586B2 (enrdf_load_stackoverflow) | ||
JPS60225050A (ja) | ガス成分検出器 | |
JPS60120593A (ja) | セラミック基板の端子構造 | |
JPH03257357A (ja) | センサの組付構造 | |
JPH03170044A (ja) | センサの組付構造 | |
JP2007232598A (ja) | 温度センサ | |
JP2868269B2 (ja) | センサ構造 |