JPS60137671A - Blank material for thermal head base - Google Patents

Abstract

PURPOSE:To provide an inexpensive blank material for a thermal head base ensuring easy separation with each base as a unit and ensuring that a thermal recording paper can form a color uniformly, by a construction wherein a plurality of smooth polygonal thermal head bases having rectilinear sides are arranged on the same plane while connecting parts of the sides by bridge parts. CONSTITUTION:The plurality of polygonal thermal head bases 1 are arranged on the same plane while connecting them by the bridge parts 2 to form a plate form blank material M, leaving openings 5 at the parts other than the bridge parts 2. On the surface of each of the bases 1, a glass glaze layer 6 for forming heating resistor film by a thin film method is provided while positioning it relatively to the sides 3, 4, and an edge part at which the surface of the base intersects with the side 4 is chamfered 7. Heat-radiating plates 8 are fixed by pressing the sides 3, 4 of each of the thermal head basses 1 against a projected streak 9 and positioning projections 10, and this assembly is fitted to a carrier 12, and is brought into contact with a platen 13, whereby the heating resistor film is made to correspond accurately with the platen 13.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to an element for a thermal head substrate used when manufacturing a thermal head.

Technical Background of the Invention 5 ゛□ Conventionally, as a means of manufacturing a thermal head Yr*, a heating resistor film or an electrode film is entirely formed at multiple locations on a single large sheet of material, and then □ this material is entirely coated. The heat-generating resistive film is separated into blocks.The separated chips, that is, the individual thermal head substrates, are placed on a carrier that moves along the platen.
It is held by a heat sink attached to it. Now, the methods to easily separate the X material for thermal head boards from each thermal head board are as follows: firstly, by precise mechanical cutting, secondly by laser scribing, and thirdly by laser scribing. There is a method of forming all the grooves on the substrate and folding the grooves like a chocolate bar of confectionery. Problems with the Background Art However, the first method described above increases the number of processing steps and costs. The second method has the problem that the cut surface cannot be finished smoothly, and the third method has the problem that the fold 9 does not coincide with the center of the groove. The thermal head board is a consumable item, and the mounting position for the heat sink is based on the side of the thermal head board. Therefore, in the second and third methods, the gate surface will be distorted, and the position of the heating resistor film with respect to the platen will be misaligned.
II & uneven coloring of thermal paper occurs. To prevent this, it is necessary to increase the outer diameter of the platen so that the entire area of the heat-generating resistive film can come into uniform contact with the outer periphery of the platen, which has the disadvantage of increasing the size of the apparatus.

Purpose of the Invention The present invention is based on the above points, and when the thermal head is separated into individual thermal head units, the sides of each thermal head substrate are separated by at most 1. It is an object of the present invention to provide a complete material for a thermal head substrate that can be formed as a dense reference surface and that can be easily separated into individual thermal head substrate units with a small number of man-hours.

Summary of the Invention This invention arranges a plurality of thermal head substrates in succession on the same plane, and each thermal head substrate is provided with a heating resistive film,
After forming the electrode film, wear-resistant layer, etc., each thermal head substrate is folded into individual thermal head substrates, but by continuously folding the bridge portions at a part of the side of each thermal head substrate, each thermal head substrate is folded. Separation t1! It is very easy to do, and the part to be folded is a small bridge part, so that most sides of each thermal head board can be folded into a molded one.
Therefore, the sides of the thermal head substrate are configured so that they can serve as a reference surface for attaching the heat sink on the carrier.

Examples of the invention An embodiment of this invention will be described based on the drawings.

A plate-shaped material (M) is formed and provided by arranging a plurality of rectangular thermal head substrates (1) on the same plane and connecting them with a bridge portion (2). Bridge part (2) is thermal head board + 110 sides + 31 + 4
) is significantly smaller than the long opening (5), and therefore, the portion other than the bridge portion (2) is formed with an elongated opening (5).

Further, on the surface of each thermal head substrate (1), a glass gelatin layer (6) for later forming a heat generating resistive film by a thin film method is formed and positioned with respect to the sides (3) and (4). There is. Roughly speaking, the edge portion where the surface of the thermal head substrate (1) and the side (4) intersect is chamfered (7).

In such a configuration, each thermal layer of the material (M) has a heating resistive film, 1!, although not shown, on the RAD substrate (1). Other films, wear-resistant layers, etc. are formed. After this, the material (yoFi
By folding the ridge portion (2), the thermal head substrate (1) can be easily separated into units. Bridge part (
Although the fragments of 2) remain on sides (3) and (4), they are very small, so most of the sides (31 and 4) are smooth during molding and can be set as the reference plane of the iM line. That is, @6
As shown in Figures and Figures 11 and 7, the positioning protrusion (9) formed on the heat sink (8) and the positioning protrusion a1 have sides (31+
4) Press to ', f --r /l/''y board +1) 'fI: Heat sink (83K fixed -t-ru 6-)
Now, heat sink (8) all its mounting holes uD! Then, as shown in Fig. 8, the thermal head board is mounted on the carrier 03, and the distance between the mounting hole 0υ and the positioning protrusion (9) is determined, and the exact side (
3), the position of the heat-generating resistive film (glass glaze layer (6) part) with respect to the platen (131) is maintained accurately. By contacting the entire area of the platen α3 almost evenly on the outer periphery of the platen α3, it is possible to prevent dots and uneven color development in the vertical direction.Since the thermal head board (1) is a consumable item, it is attached to the unit together with the heat dissipation plate (8). Even when replacing it as a (thermal head), the heating resistance M is always
X can be made to correspond correctly with the platen a mark. Furthermore, the formation of the chamfer (7) allows the thermal head to slide against the printing paper.

Effects of the Invention Since the present invention is configured as described above, the bridge portion that is folded when separating the continuous thermal head, substrate, and plate is small.1. Therefore, the separation work is facilitated, and the edge of the head board can be used as a reference plane for positioning to the heat sink, and accurate dimensions and finishing can be maintained. Even if the total diameter ratio is reduced, the entire area of the heating resistive film of each thermal head board can be brought into even contact with the outer periphery of the platen, thereby preventing uneven color development during printing. now·

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 shows a flat view of the material, Fig. 2 shows a side view of its long side, Fig. 3 shows a 5II 1-side view of its short side, and Fig. FIG. 4 is a plan view of the separated thermal head board, FIG. 5 is a side view thereof, and FIG. 6 is a plan view showing how the thermal head board is attached to the heat sink.
FIG. 7 is a side view thereof, and FIG. 8 is a side view showing the printing state. l... Thermal head board, 2... Bridge part, 3
．． 4... Side, 7... Chamfer Request Person Tokyo Electric Co., Ltd.! /-+r1ノIIi=;=2-22--1・Figure 33J+2Figure:f31.3Country

Claims (1)

[Claims] '1. For a thermal head substrate characterized in that a plurality of polygonal thermal head substrates having all smooth and straight sides are arranged continuously on the same plane with some and all bridges on the 0 sides thereof. material. 2. The material for a thermal head board according to claim 1, which is characterized in that the entire thickness of the bridge part is thinner than the thickness of the pull head board. 3. Both sides of the thermal head board Claims m@ characterized in that the edges of the m@ are chamfered.
Thermal head substrate material e described in item 1 or 2