JPH0611545B2 - Thermal print head - Google Patents

Thermal print head

Info

Publication number
JPH0611545B2
JPH0611545B2 JP62087850A JP8785087A JPH0611545B2 JP H0611545 B2 JPH0611545 B2 JP H0611545B2 JP 62087850 A JP62087850 A JP 62087850A JP 8785087 A JP8785087 A JP 8785087A JP H0611545 B2 JPH0611545 B2 JP H0611545B2
Authority
JP
Japan
Prior art keywords
substrate
end surface
heat dissipation
cutting
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62087850A
Other languages
Japanese (ja)
Other versions
JPS63252756A (en
Inventor
隆也 長畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP62087850A priority Critical patent/JPH0611545B2/en
Publication of JPS63252756A publication Critical patent/JPS63252756A/en
Publication of JPH0611545B2 publication Critical patent/JPH0611545B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Landscapes

  • Electronic Switches (AREA)
  • Resistance Heating (AREA)
  • Non-Adjustable Resistors (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ファクシミリ、プリンタ又は各種記録計器等
に使用されるサーマルプリントヘッドの改良に関するも
のである。The present invention relates to improvements in thermal print heads used in facsimiles, printers, various recording instruments, and the like.

〔従来の技術とその問題点〕[Conventional technology and its problems]

最近のサーマルプリントヘッドは、高速印字性を維持す
るために、第１０図及び第１１図に示すようにセラミッ
ク製基板１の表面に形成されるグレーズ層２のうち両電
極膜３，４の間における細幅Ｓの発熱部５を、基板１に
おける一端面１ａに出来るだけ近付けることが行なわれ
ている。このように、発熱部５を基板１における一端面
１ａに近付けたものを、先端型サーマルプリントヘッド
と言う。但し、図中符号９は発熱抵抗体層を示す。In order to maintain high-speed printability, the recent thermal print head has a space between both electrode films 3 and 4 of the glaze layer 2 formed on the surface of the ceramic substrate 1 as shown in FIGS. 10 and 11. The heat generating portion 5 having the narrow width S in 1 is brought as close as possible to the one end surface 1a of the substrate 1. The one in which the heat generating portion 5 is brought close to the one end surface 1a of the substrate 1 in this manner is called a tip thermal print head. However, reference numeral 9 in the drawing indicates a heating resistor layer.

ところで、前記基板１の裏面には、当該基板１の補強を
兼ねた金属製の放熱板６を、当該放熱板６における一端
面６ａが前記基板１における一端面１ａと略同一平面状
に揃うように接着剤７を介して貼着することにより、前
記基板１における発熱部５から放熱板６への放熱性を確
保するように構成するものである。By the way, on the back surface of the substrate 1, a metal heat radiating plate 6 also serving as a reinforcement of the substrate 1 is arranged so that one end face 6a of the heat radiating plate 6 is substantially flush with the one end face 1a of the substrate 1. It is configured to secure the heat dissipation from the heat generating portion 5 in the substrate 1 to the heat dissipation plate 6 by sticking it to the heat dissipation plate 6 via the adhesive 7.

しかし、基板１における発熱部５から放熱板６への放熱
性を確保することのために、基板１の裏面に放熱板６
を、当該放熱板６における一端面６ａが基板１における
一端面と略同一平面状に揃うように接着剤７を介して貼
着するに際しては、この貼設に使用する接着剤７のうち
余分のものが、基板１における一端面１ａから外側には
み出し、基板１における端面１ａには、接着剤の盛上り
部７ａが必然的に形成されることになり、該接着剤の盛
上り部７ａが基板１の一部になり、当該盛上り部７ａの
表面が、実質的に基板１の一端面を構成することにな
り、その結果、基板１における発熱部５の位置は、前記
接着剤の盛上り部７ａの厚さ（ｌ）の分だけ基板１の先
端から内側に入った形態になり、換言すると、基板１の
端面から発熱部５までの距離（Ｌ）は、前記接着剤の盛
上り部７ａの厚さ（ｌ）の分だけ（Ｌ′）に増大するこ
とになるから、一端面１ａに対するリボンテープＡの引
きはがし角度θは、高速印字に最も好ましい２０度より
も大きくなり、高速印字に適合しなくなるのであった。However, in order to secure heat dissipation from the heat generating portion 5 in the substrate 1 to the heat dissipation plate 6, the heat dissipation plate 6 is provided on the back surface of the substrate 1.
Is adhered via the adhesive 7 so that the one end surface 6a of the heat dissipation plate 6 and the one end surface of the substrate 1 are substantially flush with each other. However, the protrusions 7a of the adhesive are inevitably formed on the end face 1a of the substrate 1, and the protrusions 7a of the adhesive are formed on the substrate 1. 1 and the surface of the raised portion 7a substantially constitutes one end face of the substrate 1, and as a result, the position of the heat generating portion 5 on the substrate 1 is raised by the raised portion of the adhesive. The thickness (l) of the portion 7a is inside from the tip of the substrate 1. In other words, the distance (L) from the end face of the substrate 1 to the heat generating portion 5 is equal to the rising portion of the adhesive. Since it will be increased to (L ') by the thickness (l) of 7a, The peeling angle θ of the ribbon tape A for 1a, larger than most preferred 20 degrees for high-speed printing was of longer complying with high-speed printing.

本発明は、この問題、基板の裏面に、放熱板を、当該放
熱板における一端面が前記基板における一端面と略同一
平面状に揃うように貼着することによって、基板におけ
る発熱部から放熱板への放熱性を確保する場合におい
て、接着剤のはみ出しによって発熱部が内側に入った形
態になるのを、確実に回避乃至は低減できるようにする
ことを目的とするものである。The present invention solves this problem by attaching a heat dissipation plate to the back surface of the substrate so that one end surface of the heat dissipation plate is substantially flush with the one end surface of the substrate so that the heat dissipation part can be removed from the heat generation part of the substrate. It is an object of the present invention to surely avoid or reduce the case where the heat generating portion enters the inside due to the protrusion of the adhesive in the case of ensuring the heat dissipation to the inside.

〔問題点を解決するための手段〕[Means for solving problems]

この目的を達成するため本発明は、基板の表面に形成し
たグレーズ層における発熱部を、前記基板における一端
面に近接した部位に位置する一方、前記基板の裏面に、
放熱板を、当該放熱板における一端面が前記基板におけ
る一端面と略同一平面状に揃うように接着剤を介して貼
着して成るサーマルプリントヘッドにおいて、前記基板
における一端面及び前記放熱板における一端面のうちい
ずれか一方又は両方に、細幅溝を、当該細幅溝が前記基
板と前記放熱板との接合面に沿って延びるように刻設す
ると言う構成にしたものである。In order to achieve this object, the present invention, the heating portion in the glaze layer formed on the surface of the substrate, while being located at a site close to one end surface of the substrate, on the back surface of the substrate,
In a thermal print head, wherein a heat sink is attached via an adhesive so that one end face of the heat sink is substantially flush with one end face of the substrate, one end face of the substrate and the heat sink plate A narrow groove is formed in one or both of the one end faces so that the narrow groove extends along the joint surface between the substrate and the heat dissipation plate.

〔発明の作用・効果〕[Operation and effect of invention]

このように、基板における一端面及び前記放熱板におけ
る一端面のうちいずれか一方又は両方に、細幅溝を、前
記基板と前記放熱板との接合面に沿って延びるように刻
設することにより、基板の裏面に放熱板を接着剤を介し
て貼着するに際して使用した接着剤のうち余分のものが
基板における一端面に向ってはみ出そうとしても、この
余分の接着剤は、前記細幅溝内にはみ出し、当該細幅溝
内に充満することになるから、余分の接着剤が基板にお
ける一端面から外側にはみ出すことを、確実に防止乃至
は少なくすることができるのである。Thus, by engraving the narrow groove on one or both of the one end surface of the substrate and the one end surface of the heat dissipation plate so as to extend along the joint surface between the substrate and the heat dissipation plate. , Even if an excess of the adhesive used when the heat sink is attached to the back surface of the substrate via the adhesive is squeezed out toward one end face of the substrate, the excess adhesive is Since it protrudes inward and fills the narrow groove, it is possible to reliably prevent or reduce excess adhesive from protruding outward from one end surface of the substrate.

従って、本発明によると、基板における発熱部から放熱
板への放熱性を損なうことなく、基板における一端面か
ら発熱部までの距離が、基板に対して放熱板を接着する
ための接着剤のはみ出しによって増大することを確実に
回避乃至は低減することができ、延いては、一端面に対
するリボンテープの引きはがし角度を、前記従来の場合
よりも小さくでき、より高速印字に適合することができ
る効果を有する。Therefore, according to the present invention, the distance from the one end surface of the substrate to the heat generating portion is the protrusion of the adhesive for bonding the heat sink to the substrate without impairing the heat dissipation from the heat generating portion of the substrate to the heat sink. It is possible to reliably avoid or reduce the increase due to the above, and further, the peeling angle of the ribbon tape with respect to the one end face can be made smaller than in the conventional case, and it is possible to adapt to higher speed printing. Have.

〔実施例〕〔Example〕

以下、本発明の実施例を、図面（第１図及び第２図）に
ついて説明する。Embodiments of the present invention will be described below with reference to the drawings (FIGS. 1 and 2).

この図において符号は、セラミック製の基板を、符号２
は、該基板１の表面のうち当該基板１における一端面１
ａに隣接した部位に形成したグレーズ層を各々示し、こ
のグレーズ層２のうち両電極膜３，４の間の部分が細幅
（Ｓ）の発熱部５に構成されている。なお、図中符号９
は発熱抵抗体層を示す。In this figure, the reference numeral 2 indicates a ceramic substrate.
Is one end surface 1 of the substrate 1 on the surface of the substrate 1.
Each of the glaze layers formed in a portion adjacent to a is shown, and a portion of the glaze layer 2 between the electrode films 3 and 4 is configured as a heat generating portion 5 having a narrow width (S). Incidentally, reference numeral 9 in the drawing
Indicates a heating resistor layer.

また、符号６は、ダイキャスト等にて製作された金属製
の放熱板を示し、この放熱板６を、前記基板１の裏面に
対して、当該放熱板６における一端面６ａが前記基板１
における一端面１ａと略同一平面状に揃うように接着剤
７にて貼着するに際し、前記基板１の裏面のうち当該基
板１における一端面１ａの部位に、当該一端面１ａに沿
って延びる細幅溝８を刻設しておくのである。Further, reference numeral 6 denotes a metal radiator plate manufactured by die casting or the like. This radiator plate 6 is arranged on the back surface of the substrate 1 such that one end surface 6a of the radiator plate 6 is the substrate 1
When the adhesive 7 is attached so as to be substantially flush with the one end surface 1a of the substrate 1, a thin portion extending along the one end surface 1a is located at a position of the one end surface 1a of the substrate 1 on the back surface of the substrate 1. The width groove 8 is engraved.

すると、基板１と放熱板６との接合面に挟まれた接着剤
７のうち余分のものが基板１における一端面１ａに向っ
てはみ出そうとしても、この余分の接着剤は、前記細幅
溝８内にはみ出し、当該細幅溝８内に充満することによ
り、余分の接着剤が一端面１ａから外側に突出状にはみ
出すことを確実に低減乃至は防止できるから、基板１に
おける一端面１ａから発熱部５までの距離（Ｌ）が増大
することはなく、一端面１ａに対するリボンテープＡの
引きはがし角度θ１を、第２図（Ｂ）に示すように高速
印字に最も好ましい約２０度にすることができるのであ
る。Then, even if an excess of the adhesive 7 sandwiched between the joint surfaces of the substrate 1 and the heat dissipation plate 6 tries to protrude toward the one end surface 1a of the substrate 1, the excess adhesive is not covered by the narrow groove. By protruding into the narrow groove 8 and filling the narrow groove 8, it is possible to reliably reduce or prevent the excess adhesive from protruding outward from the one end face 1a. Therefore, from the one end face 1a of the substrate 1. The distance (L) to the heat generating part 5 does not increase, and the peeling angle θ1 of the ribbon tape A with respect to the one end face 1a is set to about 20 degrees which is most preferable for high speed printing as shown in FIG. 2 (B). It is possible.

そして、このように基板１の裏面のうち当該基板１にお
ける一端面１ａの部位に、先端部端面１ａに沿って延び
る細幅溝８を刻設するには、以下に延べる方法を採用す
るのが好ましい。Then, in order to engrave the narrow groove 8 extending along the tip end face 1a in the portion of the one end face 1a of the substrate 1 on the back face of the substrate 1 in this way, the following method is adopted. Is preferred.

すなわち、前記基板１は、第６図（Ａ）に示すように、
当該基板１における幅寸法（Ｗ）より広幅寸法のセラミ
ック板１０の上面に、帯状のグレーズ層２０を塗着形成
し、このセラミックス板１０を、前記グレーズ層２０の
長手方向に延びる線２０ａに沿って回転式カッターＣに
よる切削加工にて、余分の耳片１′を第６図（Ｂ）に示
すように切断・除去することによって製作されるもので
ある。That is, the substrate 1 is, as shown in FIG.
A strip-shaped glaze layer 20 is formed by coating on the upper surface of a ceramic plate 10 having a width larger than the width (W) of the substrate 1, and the ceramic plate 10 is formed along a line 20a extending in the longitudinal direction of the glaze layer 20. It is manufactured by cutting and removing the extra ear piece 1'as shown in FIG. 6 (B) by cutting with the rotary cutter C.

そこで、前記線２０ａに沿っての切断に際して、第７図
〜第９図に示すように先づグレーズ層２０を細幅（ｔ）
の回転式カッターＣ１にてセラミック板１０の上面側か
ら切削加工し、次いで、前記線２０ａと同じ箇所におけ
るセラミック板１０を、前記回転式カッター９より広幅
（Ｔ）の回転式カッターＣ２にてセラミック板１０の下
面側から切削加工することにより（この場合、先ずセラ
ミック板１０を、広幅（Ｔ）の回転式カッターＣ２にて
切断加工のち、細幅（ｔ）の回転式カッターＣ１にて切
断加工するようにしても良い）、余分の耳片１′を切断
・除去するようにすれば、基板１を製作するときにおい
て、同時にこの基板１の裏面に広幅のカッターＣ２にて
前記細幅溝８を刻設することができるのである。Therefore, when cutting along the line 20a, the glaze layer 20 is first narrowed (t) as shown in FIGS.
The ceramic plate 10 is cut from the upper surface side of the ceramic plate 10 with the rotary cutter C1 of FIG. By cutting from the lower surface side of the plate 10 (in this case, the ceramic plate 10 is first cut by the wide-width (T) rotary cutter C2 and then cut by the narrow-width (t) rotary cutter C1. However, if the extra ear piece 1'is cut and removed, at the same time when the substrate 1 is manufactured, the narrow groove 8 is formed on the back surface of the substrate 1 by the wide cutter C2. Can be engraved.

また、前記セラミックス板１０とグレーズ層２０とは、
硬さが可成り相違するものであるから、予めグレーズ層
２０を形成したセラミック板１０を、第６図に示すよう
に、一つの回転式カッターＣによる切削加工にて切断す
るに際し、その切削切断の条件を比較的軟らかいグレー
ズ層２０の切削切断に合せて設定すると、硬いセラミッ
ク板１０の切断面に凹凸ができることになり、さりと
て、切削切断の条件を硬いセラミック板の切削切断に合
せると、軟らかいグレーズ層２０の切断面に欠けが発生
することになるが、予めグレーズ層２０を形成したセラ
ミック板１０の切削切断に、前記第７図〜第９図に示し
た二段式の切削切断の方法を採用すると、細幅（ｔ）の
回転式カッターＣ１による切削切断の条件は、グレーズ
層２０を切削切断に適合するものに、広幅（Ｔ）の回転
式カッターＣ２による切削切断の条件は、グレーズ層よ
りも硬い材質のセラミックの切削切断に適合するものに
することができるから、セラミック板の切断面及びグレ
ーズ層の切断面を、凹凸や欠けのない平滑な面に仕上げ
ることができるのである。Further, the ceramic plate 10 and the glaze layer 20 are
Since the hardness is considerably different, when cutting the ceramic plate 10 on which the glaze layer 20 is formed in advance by cutting with a single rotary cutter C, as shown in FIG. If the condition (1) is set in accordance with the cutting of the relatively soft glaze layer 20, unevenness will be formed on the cut surface of the hard ceramic plate 10, and if the conditions of cutting are matched with the cutting of the hard ceramic plate, it will be soft. Although chipping will occur on the cut surface of the glaze layer 20, the two-step cutting method shown in FIGS. 7 to 9 is used for cutting the ceramic plate 10 on which the glaze layer 20 is formed in advance. Is adopted, the conditions of cutting and cutting by the rotary cutter C1 having a narrow width (t) are those which are suitable for the cutting and cutting of the glaze layer 20 and the rotary cutter C2 having a wide width (T). The cutting conditions can be adapted to the cutting of the ceramic material harder than the glaze layer, so the cutting surface of the ceramic plate and the cutting surface of the glaze layer should be smooth with no irregularities or chips. It can be finished.

なお、上記実施例は、細幅溝８を、基板１側に設けた場
合を示したが、この細幅溝８は、第３図に示すように、
放熱板６における一端面６ａに設けたり、或いは、第４
図に示すように、基板１における一端面１ａと放熱板６
における一端面６ａとの両方に跨って設けても良く、ま
た、基板１における一端面１ａ及び放熱板６における一
端面６ａのうちいずれか一方又は両方に設ける細幅溝８
の形状は、第５図に示すように、三角形状に成形しても
良いのである。In the above embodiment, the narrow groove 8 is provided on the substrate 1 side, but the narrow groove 8 is, as shown in FIG.
It is provided on one end surface 6a of the heat dissipation plate 6, or the fourth
As shown in the figure, one end surface 1 a of the substrate 1 and the heat dissipation plate 6
May be provided so as to straddle both of the one end surface 6a of the substrate 1 and the one end surface 1a of the substrate 1 and the one end surface 6a of the heat dissipation plate 6 or both of the narrow grooves 8 provided.
The shape may be formed in a triangular shape as shown in FIG.

【図面の簡単な説明】[Brief description of drawings]

第１図は本発明の実施例を示す斜視図、第２図は第１図
にII−II視拡大断面図で、第２図（Ａ）は基板に対して
放熱板を接着する前の状態、第２図（Ｂ）は接着後の状
態を示す、第３図、第４図及び第５図は本発明の別の実
施例を示す拡大断面図、第６図及び第７図はセラミック
板を切削切断している状態を示す斜視図、第８図は第７
図のVIII−VIII視拡大断面図、第９図は第８図のIX−IX
視断面図、第１０図及び第１１図は従来のサーマルプリ
ントヘッドを示す図で、第１０図は斜視図、第１１図は
第１０図のＸＩ−ＸＩ視拡大断面図である。 １……基板、１ａ……基板の一端面、２……グレーズ
層、３，４……電極膜、５……発熱部、６……放熱板、
６ａ……放熱板の一端面、７……接着剤、８……細幅
溝。1 is a perspective view showing an embodiment of the present invention, FIG. 2 is an enlarged sectional view taken along line II-II in FIG. 1, and FIG. 2 (A) is a state before a heat sink is bonded to a substrate. FIG. 2 (B) shows a state after adhesion. FIGS. 3, 4, and 5 are enlarged sectional views showing another embodiment of the present invention, and FIGS. 6 and 7 are ceramic plates. FIG. 8 is a perspective view showing a state of cutting and cutting
Figure VIII-VIII enlarged sectional view, Figure 9 is IX-IX in Figure 8.
FIG. 10 is a view showing a conventional thermal print head, FIG. 10 is a perspective view, and FIG. 11 is an enlarged cross-sectional view taken along line XI-XI of FIG. 1 ... Substrate, 1a ... One end surface of the substrate, 2 ... Glaze layer, 3,4 ... Electrode film, 5 ... Heat generating part, 6 ... Radiating plate,
6a ... One end face of heat sink, 7 ... Adhesive, 8 ... Narrow groove.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】基板の表面に形成したグレーズ層における
発熱部を、前記基板における一端面に近接した部位に位
置する一方、前記基板の裏面に、放熱板を、当該放熱板
における一端面が前記基板における一端面と略同一平面
状に揃うように接着剤を介して貼着して成るサーマルプ
リントヘッドにおいて、前記基板における一端面及び前
記放熱板における一端面のうちいずれか一方又は両方
に、細幅溝を、当該細幅溝が前記基板と前記放熱板との
接合面に沿って延びるように刻設したことを特徴とする
サーマルプリントヘッド。1. A heat generating portion in a glaze layer formed on the surface of a substrate is located at a position close to one end surface of the substrate, while a heat radiating plate is provided on the back surface of the substrate, and one end surface of the heat radiating plate is In a thermal print head formed by adhering via an adhesive so as to be substantially coplanar with one end surface of a substrate, one or both of one end surface of the substrate and one end surface of the heat dissipation plate may be thinned. A thermal print head, wherein a width groove is formed such that the narrow groove extends along a joint surface between the substrate and the heat dissipation plate.
JP62087850A 1987-04-09 1987-04-09 Thermal print head Expired - Fee Related JPH0611545B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62087850A JPH0611545B2 (en) 1987-04-09 1987-04-09 Thermal print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62087850A JPH0611545B2 (en) 1987-04-09 1987-04-09 Thermal print head

Publications (2)

Publication Number Publication Date
JPS63252756A JPS63252756A (en) 1988-10-19
JPH0611545B2 true JPH0611545B2 (en) 1994-02-16

Family

ID=13926361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62087850A Expired - Fee Related JPH0611545B2 (en) 1987-04-09 1987-04-09 Thermal print head

Country Status (1)

Country Link
JP (1) JPH0611545B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW243426B (en) * 1991-01-30 1995-03-21 Rohm Co Ltd

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938052U (en) * 1982-08-31 1984-03-10 ロ−ム株式会社 Thermal print head heat sink
JPS61181735U (en) * 1985-05-02 1986-11-13

Also Published As

Publication number Publication date
JPS63252756A (en) 1988-10-19

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