JPS60136013A - Manufacture of thin film magnetic head - Google Patents

Abstract

PURPOSE:To improve magnetic recording and reproducing efficiency by performing etching by irradiating a step part formed with a thin film coil constitution part with an ion beam at the slant angle of an area side where a magnetic gap part is expected to be constituted, and specifying the thickness of the magnetic gap part of an upper magnetic layer. CONSTITUTION:The upper magnetic film 27 consisting of amorphous material such as Fe-Si and Co-Zr is adhered by sputtering and vapor deposition onto the substrate 21 on which a lower magnetic film 22 and the 2nd insulating layer 26 are formed. In this case, the film thickness of the upper magnetic film 27 is at least 4.3mum when the slant angle theta of the step part A consisting of the gap formation part 23 and the 2nd insulating layer 26 is about 45 deg.. The upper magnetic film 27 is irradiated with an Ar ion beam at the slant angle theta=45 deg. of one of step parts A and B formed of the constitution part of a thin film coil 25, for example, the step part A where the magnetic gap part D is expected to be formed and the etching is carried out so that the film thickness of the upper magnetic film 27 in said expected area from the base of the step part A is equal to the thickness of the lower magnetic film 22.

Description

Detailed Description of the Invention (8) Technical Field of the Invention The present invention relates to a method of manufacturing a thin film magnetic head, and in particular, the shape of the upper magnetic pole of the thin film magnetic head is thickened at the sloped part of the thin film coil made of a conductor and an insulating layer. The present invention relates to a manufacturing method that improves magnetic recording/reproduction efficiency by forming a tip portion to a predetermined thickness.

tb+ Technology Background In order to achieve higher recording density and faster transfer speeds for magnetic heads on magnetic disks, their shapes are becoming smaller and smaller, and there is a trend toward higher precision. Compact thin-film magnetic heads that have a steep head magnetic field distribution and are capable of high-density recording are being put into practical use, and various types have already been proposed.

(C1 Prior Art and Problems By the way, in order to form the above-mentioned thin film magnetic head, conventionally, the top view of FIG. 1 and the main part sectional view of FIG. 2 along the IT-H' cutting line of FIG. As shown, a lower magnetic layer 2 made of Co--Zr amorphous or the like is first deposited on a glass substrate 1 made of borosilicate glass, also called Pyrex glass, by sputtering or the like, and then patterned into a predetermined pattern by photolithography. Next, a gap forming layer 3 such as S+02 and a first insulating layer 4 are deposited on the lower magnetic layer 2, and a conductor layer made of Cu or the like is further formed on the surface of the first insulating layer 4. After being deposited by a sputtering method or the like, the conductor layer is patterned into a thin film coil 5 by a photolithography technique.
A second insulating layer 6 is deposited on the first insulating layer 4 containing . Next, this upper magnetic N7
The lower magnetic layer 2 and the upper magnetic layer 7 are patterned into a predetermined pattern shape by photolithography.
are connected at the rear and formed into a U-shape in terms of a magnetic circuit via the gear knob forming layer 3.

However, as mentioned above, stamp coverage (s) during film formation
When a groove is formed on the thin film magnetic head using the groove method or the like, the film thickness of the step-shaped portion shown by A and B in the figure of the upper magnetic M7 in the formed thin film magnetic head is This results in the disadvantage that the film thickness is inevitably thinner than that of other parts, especially the part C of the surface facing the magnetic recording medium. By the time a sufficiently steep magnetic field is generated at the tip of the gear, the magnetic field is saturated at the thin step portions A and B of the upper magnetic layer 7, and the magnetic resistance increases. As a result, there was a drawback that recording efficiency decreased.

(d) Purpose of the Invention In order to eliminate the above-mentioned conventional drawbacks, the present invention aims to irradiate the upper magnetic layer disposed on the thin film coil component with an ion beam for ion etching from a direction equivalent to the inclination angle of the stepped portion. Irradiation and ion etching are performed to form a film thicker at the stepped portion and other portions than at the tip of the gear, thereby preventing magnetic saturation at the stepped portion and thereby reducing the gap. It is an object of the present invention to provide a method for manufacturing a novel thin-film magnetic head that can generate a sufficiently steep magnetic field at the tip.

According to the present invention, a lower magnetic layer is formed on a substrate in a predetermined pattern, and then a thin film coil and an insulating layer are formed on the lower magnetic layer via a gap layer and an insulating layer. In the method for manufacturing a thin film magnetic head, the method includes sequentially laminating a top magnetic layer and patterning the top magnetic layer into a predetermined pattern, in which a thin film coil component formed by a thin film coil component is applied to the deposited top magnetic layer. Etching is performed by irradiating an ion beam for ion etching along the inclination angle of the step portion on the side where the magnetic gear portion is to be formed, so that the thickness of the magnetic gap portion of the upper magnetic layer is formed to a required thickness. This is achieved by providing a method for manufacturing a thin film magnetic head characterized by the following.

(fl Embodiments of the Invention Below, embodiments of the present invention will be described in detail with reference to the drawings.

Figure 3~! @ Figure 6 is a cross-sectional view of a main part showing an embodiment of a method for manufacturing a thin film magnetic head according to the present invention in the order of steps.

First, as shown in FIG. 3, Fe, which is a soft magnetic material with a high saturation magnetic flux density, is placed on a nonmagnetic substrate 21 made of borosilicate glass, also called Pyrex glass, or ceramic.
A lower magnetic film 22 made of an amorphous material such as S1% or Co-Zr is deposited to a thickness of, for example, 3 μm by sputtering, vapor deposition, or ion blating, and then formed into a predetermined pattern using photolithography. .

Next, on the lower magnetic film 22, 5i03, /M! 20
A gap forming layer 23 made of A and the like is deposited to a thickness of, for example, 0.36 to 1 μm by sputtering or the like, and is patterned into a predetermined pattern. Subsequently, a first insulating layer 24 made of an insulating resin such as Resist I-(AZ-1350) or an insulating resin material for IC made of polyimide resin (PIQ) is formed on the surface in a predetermined pattern. Next, C is applied to the surface of the first insulating layer 24.
After a conductor film such as U is laminated to a thickness of about 2 μm by plating or the like, the conductor film is patterned into a predetermined pattern to form a thin film coil 25.

Furthermore, on the first insulating layer 24 including the thin film coil 25, a second insulating layer 26 made of an insulating resin such as a resist (^Z-1350) or an insulating resin material for ICs made of polyimide resin (PIG) is again applied. Deposit and form in a predetermined pattern.

After that, the lower magnetic film 22 to the second insulating film Fi
As shown in FIG. 4, an upper magnetic film 27 made of an amorphous material such as Fe-Si or CO-2r is deposited on the substrate 21 on which the i26 is formed by sputtering, vapor deposition, ion blating, or the like. Form. In this case, the thickness of the upper magnetic film 27 is, for example, the inclination angle θ of the stepped portion A between the gap forming layer 23 and the second insulating layer 26.
When the angle is approximately 45 degrees, a film thickness of at least 4.3 μm is deposited. (Then, the film thickness at the stepped portion is thicker than the film thickness (for example, 3 μm) of the lower magnetic film 22.

Next, as shown in FIG. 5, on the upper magnetic film 27 formed as described above, a region to be formed, for example, a magnetic gap portion, of the step portions A and B formed by the thin film coil 25 constituent parts. An Ar ion beam for ion etching is irradiated from the direction of the inclination angle θ = 45° of the step portion A on the side, as shown by the arrow, from the base of the step portion A to the upper part of the region where the gap portion is to be formed. The thickness of the magnetic film 27 portion is etched to the same thickness as the lower magnetic film 22. As a result, as shown in FIG. 6, the film thickness of the upper magnetic film Il*27 becomes equal to the film thickness of the lower magnetic film 22 near the magnetic gap portion. Also, the film thickness at the step part is thicker than the film thickness at the magnetic gap part because the static ion beam is not irradiated during ion etching, and the film thickness at other parts is equal to or greater than the film thickness at the magnetic gap part. formed to a thickness of

Therefore, the conventional magnetic saturation phenomenon at the stepped portion of the upper magnetic film 27 is eliminated, and it becomes possible to obtain a thin film magnetic node with high magnetic recording and reproducing efficiency.

In addition, in the above ion etching, the other stepped portion B of the upper magnetic film 27 is irradiated with the ion beam from the front, so if the etching becomes excessive, the pattern accuracy of this stepped portion B may be relatively low. Since it is a loose part, it may be partially covered with a resist film.

1g) Effects of the Invention As is clear from the above explanation, according to the method for manufacturing a thin film magnetic head according to the present invention, the thickness of the magnetic gap portion of the upper magnetic layer can be formed to a required thickness, and ,
Since the film thickness at the part (t), especially at the step part, can be made thicker than the predetermined film thickness of the magnetic gap part, the magnetic saturation phenomenon at the step part of the upper magnetic film as in the conventional case can be prevented. It is possible to obtain a thin film magnetic head with excellent magnetic recording/reproducing efficiency. Therefore, it is extremely advantageous in that it can be used in manufacturing various thin Il!! magnetic heads having steps.

[Brief explanation of drawings]

Figure 2 is a top view illustrating a conventional method of manufacturing a thin film magnetic head, Figure 2 is a cross-sectional view of the main part taken along the cutting line nn' shown in Figure 1, and Figures 3 to 6 are the main parts of the main part. 1A and 1B are cross-sectional views of essential parts showing an embodiment of a method for manufacturing a thin-film magnetic head according to the invention in the order of steps; FIG. In the drawing, 21 is a non-magnetic substrate, 22 is a lower magnetic film,
23 is a gap forming layer, 24 is a first insulating layer, 25 is -W
26 is a second insulating layer, and 27 is an upper magnetic film. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Bacteria

Claims (1)

[Claims] After forming the lower magnetic layer in a predetermined pattern on the substrate,
In the method for manufacturing a thin film magnetic head, the method for manufacturing a thin film magnetic head comprises sequentially laminating a thin film coil, an insulating layer and an upper magnetic layer on the lower magnetic layer via a gap layer and an insulating layer, and further patterning the upper magnetic layer into a predetermined pattern shape. The deposited upper magnetic layer is etched by irradiating an ion beam for ion etching along the inclination angle of the step portion formed by the thin film coil component on the side where the magnetic gap portion is planned to be formed, A method of manufacturing a thin film magnetic head, characterized in that the thickness of the magnetic gap portion of the upper magnetic layer is formed to a required thickness.