JPS60131971U - Grounding structure of printed circuit board - Google Patents
Grounding structure of printed circuit boardInfo
- Publication number
- JPS60131971U JPS60131971U JP1984020335U JP2033584U JPS60131971U JP S60131971 U JPS60131971 U JP S60131971U JP 1984020335 U JP1984020335 U JP 1984020335U JP 2033584 U JP2033584 U JP 2033584U JP S60131971 U JPS60131971 U JP S60131971U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductive
- grounding structure
- elastic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示すプリント基板の接地構造の横断面
図、第2図は本考案の1実施例を示すプリント基板の接
地構造の横断面図である。
4・・・・・・留め具、8・・・・・・フレーム、9・
・・・・・支柱、10・・・・・・導電層、11・・・
・・・プリント基板、12・・・・・・導電パターン、
13・・・・・・導電弾性体。FIG. 1 is a cross-sectional view of a grounding structure for a printed circuit board showing a conventional example, and FIG. 2 is a cross-sectional view of a grounding structure for a printed circuit board showing an embodiment of the present invention. 4... Fastener, 8... Frame, 9.
...Strut, 10...Conductive layer, 11...
...Printed circuit board, 12... Conductive pattern,
13... Conductive elastic body.
Claims (1)
チの留め具で挟着されたプリント基板とから成るプリン
ト基板の取付構造において、前記支柱に装着された導電
弾性体と、前記合成樹脂フレームに設けた導電層と、前
記プリント基板に設けた導電パターンとから成り、該導
電パターンと前記導電層とを前記導電弾性体で押圧し電
気的に接触するようにしたことを特徴とするプリント基
板の接地構造。A printed circuit board mounting structure consisting of a synthetic resin frame having a support and a printed circuit board clamped to the support with a one-touch fastener, wherein a conductive elastic body attached to the support and a conductive elastic body provided on the synthetic resin frame are provided. A grounding structure for a printed circuit board, comprising a conductive layer and a conductive pattern provided on the printed circuit board, the conductive pattern and the conductive layer being pressed together by the conductive elastic body so as to be in electrical contact with each other. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984020335U JPS60131971U (en) | 1984-02-14 | 1984-02-14 | Grounding structure of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984020335U JPS60131971U (en) | 1984-02-14 | 1984-02-14 | Grounding structure of printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60131971U true JPS60131971U (en) | 1985-09-03 |
JPH0127256Y2 JPH0127256Y2 (en) | 1989-08-15 |
Family
ID=30510722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984020335U Granted JPS60131971U (en) | 1984-02-14 | 1984-02-14 | Grounding structure of printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60131971U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010097871A1 (en) * | 2009-02-26 | 2010-09-02 | パナソニック株式会社 | Circuit board module and electronic device provided with same |
-
1984
- 1984-02-14 JP JP1984020335U patent/JPS60131971U/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010097871A1 (en) * | 2009-02-26 | 2010-09-02 | パナソニック株式会社 | Circuit board module and electronic device provided with same |
JP2010198427A (en) * | 2009-02-26 | 2010-09-09 | Panasonic Corp | Circuit board module and electronic apparatus including the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0127256Y2 (en) | 1989-08-15 |
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