JPS60130885A - Electronic part mounting method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of mounting leaded electronic components on a printed circuit board.

Structure of a conventional example and its problems FIG. 1 shows an example of an electronic component with leads that is tabbed as a band-shaped component assembly. 1 is an electronic component with a lead, and 1a is a main body of the electronic component 1 with a lead (hereinafter referred to as the component main body).

1b and 1C are lead wires of electronic component 1 with leads, 2.3
is a tape on which lead (=1@electronic electron 1) is taped.

FIG. 2 is an explanatory diagram showing a conventional leaded electronic component mounting method. 4 is a printed circuit board, 4a.

4b is a hole into which the lead wires 1b and 1c of the lead-handed electronic component 1 are inserted; 5 is a clinch claw for cutting and bending the lead wires 1b and 1C; and 6 is a clinch base opposing the clinch claw.

Conventionally, when mounting an electronic component 1 with leads on a printed circuit board 4, as shown in FIG. Line 1b.

The tip of 1C was cut by the clinch claw 6 and the clinch base 6, and was mounted and fixed by bending it 6 in the entry direction.

However, in the above mounting method, the clinch claw 5 and the clinch base 6 are placed close to the bottom surface of the printed circuit board 4.
is located, the mounting interval Bi of the leaded electronic component 1 is
It has to be wider than the area occupied by the clinch claws 5 and the clinch base 6, and has the disadvantage that the mounting density cannot be increased further.

For this reason, recently, in order to increase the packaging density,
As shown in FIG. 3, instead of using a lead-handed electronic component, a method is used in which a chip component 7 without a lead wire is mounted on a printed circuit board 4 with an adhesive 8. Here 7a,y
b is the electrode of the chip component 7, 9a and 9b are the electrodes 7a and 7b
This is the land for wiring on the printed circuit board 4 that comes into contact with this land.

However, such a chip component 7 has the disadvantage that it is more expensive than the electronic component 1 with leads.

OBJECTS OF THE INVENTION In view of the above drawbacks, the present invention provides an electronic component mounting method that enables high-density mounting of leaded electronic components, which are cheaper than chip components, on a printed circuit board.

Structure of the Invention The present invention includes a fixing agent application process in which an electronic component fixing agent is applied in advance to a predetermined position of a printed circuit board on which a leaded electronic component is mounted, and a process of cutting and forming the lead wire of the leaded electronic component to a predetermined length. The fixing agent consists of a molding mounting process in which it is mounted in a predetermined position on a printed circuit board coated with a fixing agent, and a fixing process in which electronic components with leads are securely fixed. , there is no need to cut or bend the lead wire after installation or insertion,
The packaging density of leaded electronic components can be increased, which is extremely beneficial.

DESCRIPTION OF EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings.

FIG. 4 shows a state in which an axial type lead-handed power component is mounted by the electronic component mounting method in the first embodiment of the present invention. In FIG. 4, 4 is a printed circuit board, and 1o is a mounting position of the component body 1a of the printed circuit board 4. The mounting method uses adhesive 1 as an electronic component fixing agent.
1f: Fixing agent application 1-: After applying the fixing agent to the mounting position 1o of the printed circuit board 4, the leaded electronic component 1 is attached to the hole 4a of the printed circuit board 4 by the molding and mounting process so that the tips 1d and 1e of the lead wires 1b and 1C are connected to the holes 4a of the printed circuit board 4. , 4b, the lead wires 1b, 1 reach the back surface 4C of the printed circuit board 4.
C is cut and formed and inserted into the insertion holes 4a and 4b of the printed circuit board 4, and as a fixing process, the adhesive 11 is cured and the back surface 4C of the printed circuit board 4 is soldered 4 times. 9a,
9b is a land for wiring, and 12 is solder.

As described above, according to the embodiment of the wood brush 1, since the leaded electronic component 1 is fixed with the adhesive 11, it is necessary to bend the tip of the lead wire on the back surface 4C of the printed circuit board 4 and fix it. Since there is no leaded electronic component 1, the packaging density of the leaded electronic component 1 can be increased, which is advantageous.

A second embodiment of the present invention will be described below with reference to the drawings. FIG. 6 shows a state in which an axial leaded electronic component is mounted by the electronic component mounting method according to the second embodiment of the present invention. The mounting method is to apply an adhesive 11 as an electronic component fixing agent to the mounting position 10 of the printed circuit board 4 in a fixing agent application process, and then to attach the electronic component 1 to the lead wire 1b,
It is cut and formed so that the tips 1d and 1e of 1C come into contact with the wiring lands 9a and 9b on the top surface of the printed circuit board 4 and mounted at the mounting position 10, and as a fixing process, the adhesive 11 is cured and the lead wires 1b and 1c and land 9a.

This is to perform half 14"4"j of 9b.

As described above, according to the embodiment of Mizui 2, in addition to the same effects as the first embodiment, the lead wires 1b and 1c do not come out on the back surface 4C of the printed circuit board 4, so the circuit configuration on the front and back sides of the printed circuit board 4 is It has the advantage of being able to separate

A third embodiment of the present invention will be described below with reference to the drawings. FIG. 6 shows a state in which an axial leaded electronic component is mounted by the electronic component mounting method according to the third embodiment of the present invention. The mounting method is to apply adhesive 11 as an electronic component fixing agent to the mounting position 13 of the printed circuit board 4, which has a groove formed so that the leaded electronic component 10 and the component body 1a are positioned in the fixing agent coating step 11. After that, the lead-handed electronic component 1 is cut and formed in a molding and mounting process so that the lead wires 1b and 1C come into contact with the wiring lands 9a and 9b on the top surface of the printed circuit board 4, and mounted at the mounting position 13, and then a fixing process is carried out. As a step, the adhesive 11 is cured and the lead wires 1a, 1b and the lands 9a, 9b are soldered to size.

As described above, according to the third embodiment of Sui-Tei, in addition to the effects of the first and second embodiments, the leaded electronic component 10 component body 1
It has the advantage that positioning of point a is possible.

A fourth embodiment of the present invention will be described below with reference to the drawings. FIG. 7 shows a state in which an axial leaded electronic component is mounted by the electronic component mounting method according to the fourth embodiment of the present invention.The lead wire 1b of the leaded electronic component 1 on the board 4 is shown in FIG.

After printing on the lands 9a and 9b for wiring in place of the holes 4a and 4b into which the wires 1C are inserted, a molding and mounting process is performed to attach the lead-handed electronic component 1 to the lead wires 1b, the tips 1d of the 1C,
1e is the hole 4a of the printed circuit board 4.

4b, the lead wires 1b and 1c are cut and formed to such an extent that they reach the back surface 4C of the printed circuit board 4, and then hardened.

As described above, according to the embodiment of Mizui 4, since the electronic component 1 with the leads f1η a; Since there is no need to bend and fix at 4C, the mounting density of the lead-handed electronic component 1 can be increased, which is advantageous.0 A sixth embodiment of the present invention will be described below with reference to the drawings. FIG. 8 shows printed wiring lands 9a and 9b on the upper surface of a lint board 4, showing a state in which an axial lead (=J) electronic component 1 is mounted using the electronic component mounting method according to the fifth embodiment of the present invention. After that, the leaded electronic component 1 is assembled by a molding and mounting process so that the leading ends 1d and 1e of the lead wires 1b and 1C are attached to the wiring land 9a on the upper surface of the printed circuit board 4.

It is cut and formed so as to be in contact with the wafer 9b and mounted at a mounting position of 1.degree.

As described above, according to the embodiment of Mizuo 6, in addition to the same effect as the fourth embodiment, the lead wires 1b and 1c do not come out on the back surface 4C of the printed circuit board 4, so that the circuits on the front and back sides of the printed circuit board 4 are It has the advantage that the configuration can be changed in minutes.

A sixth embodiment of the present invention will be described below with reference to the drawings. FIG. 9 shows a state in which an axial leaded electronic component is mounted by the electronic component mounting method according to the sixth embodiment of the present invention. The mounting method is to print Hirata cream==≠14 as an electronic component fixing agent on the wiring lands 9a and 9b on the upper surface of the printed circuit board 4 through a fixing agent coating process. Here, the printed circuit board 4 is positioned so that the electronic component 10 with leads 10 and the component body 1a are positioned? 1// has a machined mounting position 15. Next, the electronic component 1 with leads is cut and molded in a molding and mounting process so that the lead wires 1b and 1C are in contact with the wiring lands 9a and 9b on the top surface of the printed circuit board 4, and as described above, the electronic component 1 with leads is molded. According to the fourth
゜In addition to the effects of the sixth embodiment, leaded electronic component 10
This has the advantage that the component main body 1a can be positioned.

In this embodiment, an axial type leaded electronic component as shown in FIG. 1 is used as the lead-handed electronic component 1 as a band-shaped component assembly, but a radial type leaded electronic component as shown in FIG. 10 is also used. However, similar electronic component mounting methods are possible.

Effects of the Invention As described in Section 2, the present invention includes a fixing agent application step of applying an electronic component fixing agent in advance to a predetermined position of a printed circuit board on which a leaded electronic component is mounted, and a fixing agent application process for attaching a lead wire of an electronic component with a lead. It consists of a molding and mounting process in which the parts are cut to a predetermined length and mounted in a predetermined position on a printed circuit board that has been coated with a fixing agent, and a fixing process in which lead-bearing electronic components are securely fixed. Since there is no need to cut or bend the lead wires after mounting or inserting the electronic components in order to fix them, the packaging density of the lead-sensitive electronic components can be increased, which is extremely beneficial.

[Brief explanation of the drawing]

Figure 1 is a plan view showing an axial leaded electronic component taped as a band-shaped component assembly, Figure 2 is a front view showing a conventional lead-handed electronic component mounting method, and Figure 3 is a conventional chip component mounting method. 4 is a front view showing the electronic component mounting method of the first embodiment of the present invention. FIG. 6 is a front view showing the second embodiment of the present invention. 7 is a front view showing the fourth embodiment of the present invention, FIG. 8 is a front view showing the fifth embodiment of the present invention, and FIG. 9 is a front view showing the fifth embodiment of the present invention. FIG. 10 is a front view showing a sixth embodiment of the invention, and a plan view showing a radial-type grid-shaped electronic component taped as a band-shaped component assembly. 1...Electronic parts with lead wires, 1a...Parts body, 1b, 1C...Lead wires, 1d, 1e...
...Tip, 4 Printed circuit board, 4a, 4b...
Hole, 4c... - Back side, 9a, 9b... Land for wiring, 1°15. Mounting position. Name of agent: Patent attorney Toshio Nakao (1st person)
Figure 1 Figure 2: Figure 3 Figure 4 Figure 5 Figure 6

Claims (5)

[Claims] (1) A fixing agent application step in which an electronic component fixing agent is applied in advance to a predetermined position of a printed circuit board on which a leaded electronic component is mounted, and the lead wire of the leaded electronic component is cut and formed into a predetermined length, An electronic device comprising a molding and mounting step of mounting the leaded electronic component at a predetermined position on the printed circuit board coated with a fixing agent by a fixing agent application step, and a fixing step of reliably fixing the leaded electronic component. Component mounting method. (2) The electronic component mounting method according to claim 1, which comprises a fixing agent application step using an adhesive as a fixing agent, and a fixing step of curing the adhesive and soldering the lead wires. (3) Fixed sharpening using cream solder as a fixing agent. 2. The electronic component mounting method according to claim 1, comprising a step of ``coating'' and a step of performing cream solder reflow as a fixing step. (4) The horizontal printed circuit board has an opening hole, and the lead wire of the lead-equipped electronic component is mounted so as to be inserted into the opening hole of the printed circuit board. The electronic component mounting method according to item 2 or 3. (5) Claim 1, wherein the pick-up printed circuit board has a groove for positioning the electronic component with the lead.
The electronic component mounting method according to item 2, 3, or 4.