JPS59218796A - Device for mounting electronic part on flexible printed board - Google Patents
Device for mounting electronic part on flexible printed boardInfo
- Publication number
- JPS59218796A JPS59218796A JP9235484A JP9235484A JPS59218796A JP S59218796 A JPS59218796 A JP S59218796A JP 9235484 A JP9235484 A JP 9235484A JP 9235484 A JP9235484 A JP 9235484A JP S59218796 A JPS59218796 A JP S59218796A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- circuit board
- printed circuit
- electronic component
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はフレキシブルプリント基板への電子部品の取付
装置に関し、特にフレキシブルプリント基板へのチップ
部品の仮保持を容易に行なえるようにしたものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for attaching electronic components to a flexible printed circuit board, and particularly to an apparatus that can easily temporarily hold chip components on a flexible printed circuit board.
”！ｆ、従来のフレキシブルプリント基板への電子部品
の取付けは第１図に示すように、導箔１゜２が形成され
たフレキシブルプリント基板３に紫外線硬化型接着剤４
を塗布し、電子部品５を載せて前記接着剤４ＶＣ紫外線
をあてて硬化させることにより電子部品５を仮保持し、
その状態で半田デツプすることにより電子部品５の両端
部の端子部とフレキシブルプリント基板３の導箔１，２
とを半田付け６．了しているものであった１、しかしな
がら、この従来の取付は方法は電子部品５の仮保持のた
めに高価な接着剤を用いており、また接着剤の塗布作業
が必要でるるため非常に高価になっているとともに作業
性も悪いものであった。``!f, As shown in Figure 1, the conventional method of attaching electronic components to a flexible printed circuit board is to apply an ultraviolet curing adhesive 4 to a flexible printed circuit board 3 on which a conductive foil 1.2 is formed.
The electronic component 5 is temporarily held by applying the adhesive, placing the electronic component 5 thereon, and curing the adhesive by applying 4VC ultraviolet rays,
By soldering in this state, the terminals at both ends of the electronic component 5 and the conductive foils 1 and 2 of the flexible printed circuit board 3 are connected.
6. Solder the and. However, this conventional mounting method uses an expensive adhesive to temporarily hold the electronic component 5, and is very difficult to install because it requires adhesive application. In addition to being expensive, the workability was also poor.
本発明はこのような従来の欠点を解消するようにしたも
ので、以下その一実施例について第２図〜第４図を用い
て説明する。The present invention has been made to eliminate such conventional drawbacks, and one embodiment thereof will be described below with reference to FIGS. 2 to 4.
８はフレキシブルプリント基板でるり、該基板８には孔
９が設けられ、かつその孔９の対向する両縁に突起部１
０ａ、・１０ｂが形成σれている。Reference numeral 8 denotes a flexible printed circuit board, and the board 8 is provided with a hole 9, and protrusions 1 are provided on opposite edges of the hole 9.
0a and 10b are formed σ.
１１，１２Ｊｊフレキシブルプリント基板８上に形成さ
れた導箔で、その各導箔１１，１２の端部は前記孔９の
両縁に形成された突起部１０′ａ、、１０ｂの先端まで
それぞれ延長されている。11, 12Jj Guide foils formed on the flexible printed circuit board 8, the ends of each of which guide foils 11, 12 extend to the tips of protrusions 10'a, 10b formed on both edges of the hole 9, respectively. has been done.
１、ｌｊ前前記フレフシプルプリント基板８導箔１１．
１２間に接続１れる電子部品で、その両端部には端子部
１３１Ｌ、１３ｂが形成されており、かつその端子部１
３ａ、１３ｂの端面ニは溝１３Ｃ，１３ｄが形成σれて
いる。」−肥端子部品１３はフレキシブルプリント基板
８に対して孔９部に挿入され、そしてその電子部品１３
の溝１３Ｃ５１３ｄに突起部１ｏａ、１０ｔ）が嵌入式
れることにより仮保持される。1. Before lj, the flexible printed circuit board 8 conductive foil 11.
This is an electronic component that is connected between 12 and 12, and has terminal portions 131L and 13b formed at both ends thereof, and the terminal portion 1
Grooves 13C and 13d are formed on the end surfaces of 3a and 13b. "-The terminal component 13 is inserted into the hole 9 of the flexible printed circuit board 8, and the electronic component 13 is inserted into the hole 9 of the flexible printed circuit board 8.
The protrusions 1oa, 10t) are fitted into the grooves 13C513d, thereby temporarily holding them.
すなわち、フレキシブルプリント基板８の孔９に対して
電子部品１３を突起部１０ａ、１０ｂを撓わ捷せながら
挿入し、そして溝１３Ｃ，１３ｄが突起部１０＆、１０
ｂと一致するとその突起部１０！Ｌ、１０ｂが溝１３０
，１３ｄＶｃ挿入され−これにより電子部品１３が仮保
持される。That is, the electronic component 13 is inserted into the hole 9 of the flexible printed circuit board 8 while bending and twisting the protrusions 10a and 10b, and the grooves 13C and 13d are aligned with the protrusions 10&, 10.
If it matches b, the protrusion 10! L, 10b is the groove 130
, 13dVc are inserted, and the electronic component 13 is thereby temporarily held.
上記のようにして電子部品１３が仮保持されたフレキシ
ブルプリント基板８を半田デツプすると、第４図に示す
ように端子部１３ａと導箔１１が半田付け１４され、ま
た端子部１３ｂと導箔１２が半田イ」け１６されてその
電子部品１３はフレキシブルプリント基板８に確実に接
続され、取付けられる。When the flexible printed circuit board 8 on which the electronic component 13 is temporarily held as described above is soldered, the terminal portion 13a and the conductive foil 11 are soldered 14, and the terminal portion 13b and the conductive foil 12 are soldered 14, as shown in FIG. The electronic component 13 is reliably connected and attached to the flexible printed circuit board 8 by soldering 16.
第６図は他の実施例における電子部品１３の形状を示す
もので、溝１３Ｃ，１３ｄとして端面の中心から放射状
に複数個設けたもので、これによってもフレキシブルプ
リント基板の孔に同様に仮保持することができるもので
ある。FIG. 6 shows the shape of the electronic component 13 in another embodiment, in which a plurality of grooves 13C and 13d are provided radially from the center of the end face, and this also temporarily holds the electronic component 13 in the hole of the flexible printed circuit board. It is something that can be done.
捷た、第６図は両面銅箔１１ａ、１１ｂ、１２ａ、１２
ｂが設けられたフレキシブルプリント基板８を用いた場
合であり、両面半田デツプすることにより両面において
電子部品１３の端子部１３ａ＋１３ｂと銅箔１１ａ〜１
２ｂを半田付け１４ａ、１４ｂ、１６ａ、１５ｂされ、
これニヨれば電子部品１３の接続および取付は強度がて
らに強くなるものである。Figure 6 shows double-sided copper foils 11a, 11b, 12a, 12.
This is a case where a flexible printed circuit board 8 is used, and by soldering on both sides, the terminal parts 13a+13b of the electronic component 13 and the copper foils 11a to 11 are bonded on both sides.
2b are soldered 14a, 14b, 16a, 15b,
If this is done, the strength of the connection and attachment of the electronic component 13 will be significantly increased.
本発明は以上のようにフレキシブルプリント基板への電
子部品の仮保持がその電子部品をフレキシブルプリント
基板に設けた孔に挿入させることによシ簡単に行なえ、
従来のような接着剤やその塗布作業を要しないため作業
性よく仮保持することができるものであり、そして半田
付けにより電子部品のフレキシブルプリント基板への接
続と数例けが確実に行なわれるもので、その実用性は大
である０
４、図ｉＭｉ （Ｄ 丁７５ ＄１説明第１図は従来例
を示す側断面図、第２図は本発明の一実施例を示すフレ
キシブルプリント基板の要部斜視図、第３図は同電子部
品の斜視図、第４図に同電子部品の取付は状態を示す側
断面図、第６図は電子部品の他のｆｌｌを示す斜視図、
第６図は他の例における電子部品の取付は状態の側断面
図である。As described above, the present invention can easily temporarily hold an electronic component on a flexible printed circuit board by inserting the electronic component into a hole provided in the flexible printed circuit board.
Since it does not require adhesive or its application work as in the past, it can be temporarily held with good workability, and the soldering ensures the connection of electronic components to the flexible printed circuit board and prevents injury in some cases. , its practicality is great. FIG. 3 is a perspective view of the electronic component, FIG. 4 is a side sectional view showing how the electronic component is installed, and FIG. 6 is a perspective view showing another part of the electronic component.
FIG. 6 is a side sectional view showing how electronic components are mounted in another example.
８・・・・・・フレキシブルプリント基板、９・・・・
・・孔、１０ａ、１０ｂ・・・・・・突起部、１１．１
２・・・・・・導箔、１３・・・・・・電子部品、１３
ａ、１３１）・・・・・・端子部、１３Ｃ，１３ｄ・・
・・・・溝、１４．１５・・・・・半田付け。8...Flexible printed circuit board, 9...
...hole, 10a, 10b...protrusion, 11.1
2... Conductive foil, 13... Electronic component, 13
a, 131)...Terminal section, 13C, 13d...
...Groove, 14.15...Soldering.
代理人の氏名 弁理士 中 尾 敏 男 ほか１名区
Ｓ
区 ■９
− 悸除
法
、 ｐ ′″
派 松 派
４４３−Name of agent: Patent attorney Toshio Nakao and 1 other person Ward S Ward ■9 - Exclusion law, p''' school Matsu school 443-
Claims (1)
の対向する縁部にそれぞれ突起部を設け、かつ導箔を前
記突起部の先端部までそれぞれ設け、−万両端部に端子
部が形成された電子部品の両端面に溝をそれぞれ設け、
前記電子部品の前記フレキシブルプリント基板の孔にそ
の孔縁の突起部を撓わませながら挿入し、該電子部品の
溝にその突起部が嵌入することによりフレキシブルプリ
ント基板に電子部品を仮保持し、電子部品の両端子部を
銅箔に半田付けしてなるフレキシブルプリント基板への
電子部品の取付装置。A flexible printed circuit board is provided with a hole, a protrusion is provided on each of the opposite edges of the hole, and a conductive foil is provided up to the tip of each of the protrusions, and - 10,000 is provided in the electronic component in which terminal portions are formed at both ends. Grooves are provided on both end faces,
Inserting the electronic component into the hole of the flexible printed circuit board while bending the protrusion on the edge of the hole, and temporarily holding the electronic component on the flexible printed circuit board by fitting the protrusion into the groove of the electronic component; A device for attaching electronic components to a flexible printed circuit board, in which both terminals of electronic components are soldered to copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9235484A JPS59218796A (en) | 1984-05-09 | 1984-05-09 | Device for mounting electronic part on flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9235484A JPS59218796A (en) | 1984-05-09 | 1984-05-09 | Device for mounting electronic part on flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59218796A true JPS59218796A (en) | 1984-12-10 |
Family
ID=14052063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9235484A Pending JPS59218796A (en) | 1984-05-09 | 1984-05-09 | Device for mounting electronic part on flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59218796A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63104306A (en) * | 1986-10-21 | 1988-05-09 | 松下電器産業株式会社 | Method of soldering fine pitch resistance network |
-
1984
- 1984-05-09 JP JP9235484A patent/JPS59218796A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63104306A (en) * | 1986-10-21 | 1988-05-09 | 松下電器産業株式会社 | Method of soldering fine pitch resistance network |
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