JPS60128623A - Wafer processing jig - Google Patents
Wafer processing jigInfo
- Publication number
- JPS60128623A JPS60128623A JP23711383A JP23711383A JPS60128623A JP S60128623 A JPS60128623 A JP S60128623A JP 23711383 A JP23711383 A JP 23711383A JP 23711383 A JP23711383 A JP 23711383A JP S60128623 A JPS60128623 A JP S60128623A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- protective film
- processing jig
- fluororesin
- retaining grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 239000010453 quartz Substances 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 22
- 238000011109 contamination Methods 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 35
- 241000257465 Echinoidea Species 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000011086 high cleaning Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 241001070941 Castanea Species 0.000 description 1
- 235000014036 Castanea Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、基板処理治具に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a substrate processing jig.
従来、略円板形の半導体ウェハ（以下、単にウェハと記
す。）を保持する治具として、フッ素樹脂で形成された
基板処理治具が使用されている。而して、この基板処理
治具は、強度を向上するために複雑な構造を有している
。このため、表面積が大きくなシ、洗浄液や純水洗浄で
の洗浄効率が悪い。その結果、このような基板処理治具
を使用すると、ウニ・・の汚染を招く問題があった。Conventionally, a substrate processing jig made of fluororesin has been used as a jig for holding a substantially disk-shaped semiconductor wafer (hereinafter simply referred to as a wafer). Therefore, this substrate processing jig has a complicated structure in order to improve its strength. Therefore, the surface area is large and cleaning efficiency with cleaning liquid or pure water is poor. As a result, when such a substrate processing jig is used, there is a problem of contamination with sea urchins.
この問題を解消するために、洗浄効率が高くしかも強度
も高い石英からなる基板処理治具が使用されている。し
かしながら、この基板処理治具は、石英の硬度が高いた
め、ウェノ１を出入れする際にウェハのエッヂ部分が欠
は易い。その結果、この欠けだ微粒子がウェノへに付着
して汚染を起こすと共に、ウェハの欠けによって製造歩
留シが低下する問題があった。In order to solve this problem, a substrate processing jig made of quartz, which has high cleaning efficiency and high strength, is used. However, since the quartz in this substrate processing jig has high hardness, the edge portion of the wafer is easily chipped when the wafer 1 is taken in and out. As a result, these chipped particles adhere to the wafer and cause contamination, and the manufacturing yield is reduced due to chipping of the wafer.
本発明は、洗浄効果が高く、しかもウェハの欠けを防止
してウェハの汚染をなくすと共に製造歩留シの向上を達
成した基板処理治具を提供することをその目的とするも
のである。SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing jig that has a high cleaning effect, prevents chipping of wafers, eliminates wafer contamination, and improves manufacturing yield.
本発明は、ウェハを保持するだめのウェノ）支詩情及び
ウェハ側部支持溝の表面領域にフッ素樹脂からなる保護
膜を形成すると共に、その材質として石英を採用したこ
とによシ、洗浄効果が高く、しかもウェハの欠けを防止
してウェノ・の汚染をなくすと共に、製造歩留シの向上
を達成した基板処理治具である。The present invention provides a cleaning effect by forming a protective film made of fluororesin on the surface area of the wafer support groove and the wafer side support groove, and using quartz as the material. This is a substrate processing jig that is expensive, prevents wafer chipping, eliminates wafer contamination, and improves manufacturing yield.
以下、本発明の実施例について図面を参照して説明する
。Embodiments of the present invention will be described below with reference to the drawings.
第１図は、本発明の一実施例の正面図、第２図は、同実
施例の要部拡大図である。この基板処理治具は、略方形
の枠体からなる基台１部分と、この基台１上に立設され
た２枚の側壁２とを有している。基台１及び側壁２は、
共に石英で形成されている。基台１を構成する枠体の対
向する２辺部３には、所定間隔でウェハ支持溝４が形成
されている。ウェハ支持溝４の表面領域には、第２図に
示す如く、フッ素樹脂からなる保護＠５が形成されてい
る。側壁２は、このウェハ支持溝４を形成した２辺部３
上に夫々立設されている。側壁２には、ウェハ６の側縁
部を保持するためのウェハ側部支持溝７がウニ・・支持
溝４の上方にこれと対応してスリット状に開口されてい
る。ウェハ側部支持溝７の表面領域には、フッ素樹脂か
らなる保護膜５が形成されている。つまり、ウニ・・６
を保持するためにウェハ６と接触する領域であるウェハ
支持溝４及びウェハ側部支持溝７の表面領域は、全てフ
ッ素樹脂からなる保護膜５で覆われている。このため、
この基板処理治具Ｌ１によれば、ウェハ６の出入操作の
際に、ウェハ６の周縁部に欠けが発生するのを、保護膜
５０弾性によって防止することができる。しかも、石英
を素材に採用しているので、強度が陥く、構造を簡単な
ものにすることができる。このため、洗浄効果を高める
ことができる。その結果、ウェハ６の汚染を防止すると
共に１欠けの発生を阻止して製造歩留）を高めることが
できるものである。FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is an enlarged view of essential parts of the embodiment. This substrate processing jig has a base 1 portion made of a substantially rectangular frame, and two side walls 2 erected on the base 1. The base 1 and side wall 2 are
Both are made of quartz. Wafer support grooves 4 are formed at predetermined intervals on two opposing sides 3 of the frame that constitutes the base 1 . As shown in FIG. 2, a protection layer 5 made of fluororesin is formed in the surface area of the wafer support groove 4. As shown in FIG. The side wall 2 has two side portions 3 in which the wafer support groove 4 is formed.
They are placed on top of each other. In the side wall 2, a wafer side support groove 7 for holding the side edge of the wafer 6 is opened above the sea urchin support groove 4 in the form of a slit corresponding thereto. A protective film 5 made of fluororesin is formed on the surface area of the wafer side support groove 7 . In other words, sea urchin...6
The surface areas of the wafer support groove 4 and the wafer side support groove 7, which are areas that come into contact with the wafer 6 to hold the wafer 6, are all covered with a protective film 5 made of fluororesin. For this reason,
According to this substrate processing jig L1, the elasticity of the protective film 50 can prevent the occurrence of chipping at the peripheral edge of the wafer 6 when the wafer 6 is moved in and out. Moreover, since quartz is used as the material, the structure can be simplified without sacrificing strength. Therefore, the cleaning effect can be enhanced. As a result, it is possible to prevent contamination of the wafer 6 and also to prevent the occurrence of chipping, thereby increasing the manufacturing yield.
因みに、実施例の基板処理治具１０に出入れしたウェハ
６の表面における微粒子９の付着度合を、レーザ一式微
粒子計数装置で調べたところ、第３図囚に示す如く、０
．５μ以上の微粒子９は、４５個計数された。これと比
較するために従来の基板処理治具に出入したウエノ１１
について、同様の実験を行ったところ、同図（Ｂ）に示
す如く、０，５μ以上の微粒子９は、約２倍の９１個付
着していることが判った。Incidentally, when the degree of adhesion of particles 9 on the surface of the wafer 6 taken in and out of the substrate processing jig 10 of the embodiment was examined using a laser set particle counting device, as shown in FIG. 3, it was found to be 0.
．． 45 fine particles 9 with a size of 5μ or more were counted. For comparison, Ueno 11 was put in and out of a conventional substrate processing jig.
When a similar experiment was conducted on the same, it was found that 91 fine particles 9 with a size of 0.5 μm or more were attached, which is about twice as many, as shown in FIG.
また、基板処理治具Ｌヱに洗浄処理を施した後に上述と
同様の実験を行ったところ、実施例のものでは第４図（
４）に示す如く、はとんど微粒子９の付着は見られなか
ったが、従来の基板処理治具を用いたものでは約７倍の
数の微粒子９が付着していることが判った・
更に、実施例の基板処理治具１Ｏでは、ウェハ６のエッ
ヂ欠けの発生率はほとんど零であったが、従来の基板処
理治具では、５〜１０係のエッヂ欠は発生率であること
が判った。In addition, when we conducted an experiment similar to the above after cleaning the substrate processing jig L2, we found that the substrate processing jig L2 shown in Fig. 4 (
As shown in 4), hardly any particles 9 were observed to adhere to the substrate, but it was found that approximately seven times as many particles 9 were attached to the substrate using the conventional substrate processing jig. Furthermore, in the substrate processing jig 1O of the embodiment, the occurrence rate of edge defects on the wafer 6 was almost zero, but in the conventional substrate processing jig, the occurrence rate of edge defects of 5 to 10 times was low. understood.
尚、なお、保護膜５は、ウェハ支持溝４及びウェハ側部
支持溝７の表面領域のほかＫも、基Ａｔ ＸＩ、 ＹＣ
布１１賂９の黒面頗偕全面１／ｒ喜虚ｉイ家白い。It should be noted that the protective film 5 has a surface area of the wafer support groove 4 and the wafer side support groove 7, as well as K, of the groups AtXI, YC.
Cloth 11 yen 9 black face chestnut all over 1/r Kikui Ii house white.
以上説明した如く、本発明に係る基板処理治具によれば
、洗浄効果が高く、シかもウェハの欠けを防止してウェ
ハの汚染をなくすと共に、′製造歩留りを向上させるこ
とができるものである。As explained above, the substrate processing jig according to the present invention has a high cleaning effect, prevents wafer chipping, eliminates wafer contamination, and improves manufacturing yield. .
第１図は、本発明の一実施例の正面図、第２図は、同実
施例の要部拡大図、第３図（Ａ）及び同図（Ｂ）は、ウ
ェハの欠けによる微粒子の発生状態を示す説明図、第４
図（４）及び同図（Ｂ）は、洗浄後にウニ・・に残存し
た微粒子の状態を示す説明図である。
ｌ・・・基台、２・・・側壁、３・・・２辺部、４・・
・ウェハ支持溝、５・・・保護膜、６・・・ウェハ、７
・・・ウニ・・側部支持溝、９・・・微粒子、１０・・
・基板処理治具、１ノ・・・ウェハ。
出麗人代理人 弁理士 鈴 江 武 彦第１図
第２図
第３図
（Ｂ） （Ａ）
第４図
（Ｂ） （Ａ）Figure 1 is a front view of one embodiment of the present invention, Figure 2 is an enlarged view of the main parts of the same embodiment, and Figures 3 (A) and 3 (B) show generation of fine particles due to chipping of the wafer. Explanatory diagram showing the state, No. 4
Figures (4) and (B) are explanatory diagrams showing the state of fine particles remaining on the sea urchin after washing. l...Base, 2...Side wall, 3...2 sides, 4...
・Wafer support groove, 5...protective film, 6...wafer, 7
...Sea urchin...Side support groove, 9...Fine particles, 10...
・Substrate processing jig, No.1...wafer. Takehiko Suzue, agent for patent attorneys, figure 1, figure 2, figure 3 (B) (A) figure 4 (B) (A)
Claims (1)
持溝をした石英からなる基台と、前記二辺部分に立設さ
れた側壁と、該側壁に前記ウェハ支持溝に対応してスリ
ット状に開口されたウェハ側部支持溝と、該ウェハ側部
支持溝及び前記ウェハ支持溝の表面領域を覆うように形
成されたフッ素樹脂からなる保護膜とを具備することを
特徴とする基板処理治具。A base made of quartz with wafer support grooves formed at predetermined intervals on two opposing sides of a substantially rectangular frame, side walls erected on the two sides, and grooves formed in the side walls corresponding to the wafer support grooves. A substrate comprising: a wafer side support groove opened in the form of a slit; and a protective film made of a fluororesin formed to cover the wafer side support groove and a surface area of the wafer support groove. Processing jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23711383A JPS60128623A (en) | 1983-12-15 | 1983-12-15 | Wafer processing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23711383A JPS60128623A (en) | 1983-12-15 | 1983-12-15 | Wafer processing jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60128623A true JPS60128623A (en) | 1985-07-09 |
Family
ID=17010602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23711383A Pending JPS60128623A (en) | 1983-12-15 | 1983-12-15 | Wafer processing jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60128623A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62265739A (en) * | 1986-05-13 | 1987-11-18 | Tokyo Electron Ltd | Vertical conveying apparatus for wafer |
| EP1213269A1 (en) * | 2000-12-05 | 2002-06-12 | Heraeus Quarzglas GmbH & Co. KG | Fluororesin-coated quartz glass jig and method for producing the same |
| EP1371617A1 (en) * | 2002-05-28 | 2003-12-17 | Heraeus Quarzglas GmbH & Co. KG | Method for producing a quartz glass tank for use in ultrasonic cleaning used for fabricating semiconductor and quartz glass tank obtainable from that method |
-
1983
- 1983-12-15 JP JP23711383A patent/JPS60128623A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62265739A (en) * | 1986-05-13 | 1987-11-18 | Tokyo Electron Ltd | Vertical conveying apparatus for wafer |
| EP1213269A1 (en) * | 2000-12-05 | 2002-06-12 | Heraeus Quarzglas GmbH & Co. KG | Fluororesin-coated quartz glass jig and method for producing the same |
| EP1371617A1 (en) * | 2002-05-28 | 2003-12-17 | Heraeus Quarzglas GmbH & Co. KG | Method for producing a quartz glass tank for use in ultrasonic cleaning used for fabricating semiconductor and quartz glass tank obtainable from that method |
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