JPS60127108A - Method of machining hole of ceramic not baked by electron beam - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method of drilling holes in green ceramics using an electron beam, and particularly to a method of drilling holes at high speed using beam deflection.

[Background of the invention]

Conventionally, holes in unfired ceramics (hereinafter referred to as green ceramics) have been formed by drilling or press punching. Among these, drilling is only applied to drilling small holes where the hole diameter is approximately 0.3 mm or more due to wear and tear on the drill. In addition, press punching has less tool wear than drilling and can achieve higher processing speeds, so it is used for drilling holes in various types of circuit boards, including computer circuit boards. However, in the next-generation computer board, the hole size machined into Green JTOYO is approximately 0.01 mm.
Since the diameter of the green sheet is small, the pitch between the diameters is small, and the number of holes is tens of thousands, there is a problem that the green sheet sag due to the accumulation of plastic deformation during processing, resulting in poor pitch dimensions. Furthermore, since the tool becomes thinner, there is a serious problem in that the tool is more likely to break due to non-uniformity of the material or poor adjustment of the machine. The biggest drawback is that with punching, holes can only be formed at specific points determined by the mounting position of the punch and the movement of the green sheet conveyance jig.

Electron beam machining is a non-contact machining method that does not cause sag in the green sheet, can drill holes at any point, and can perform high-speed machining. When relying solely on positioning using a fixed jig, the machining speed was limited by the moving speed of the jig, and there was a problem in that high-speed hole machining, which takes advantage of the high-speed controllability of the electron beam, was not possible.

OBJECTS OF THE INVENTION (1) An object of the present invention is to provide a method for increasing the speed of drilling holes in a clean ceramic sheet using an electron beam by deflecting the beam.

[Summary of the invention]

After applying the necessary current value to the electromagnetic deflection coil to deflect and move the beam to a predetermined position, a waiting time is provided for the beam settling time determined by the time constant of the coil and the deflection distance.
After the waiting time has elapsed, the process of forming a hole in the material by irradiating the beam a predetermined number of times in a predetermined time is immediately repeated over the beam deflection range, thereby forming a certain area (block) only by beam deflection. It is characterized by drilling holes, then moving to the next block using a moving jig and repeating the same process.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic configuration diagram of an apparatus used for drilling holes in an alumina green sheet according to this embodiment.

In the figure, 1 is a cathode, 2 is a grid electrode, 6 is an anode, 4
is an electromagnetic lens, 5 is a deflection coil, 6 is an XY table, 7 is
1 is a position detection device, 8 is an electric motor, 9 is a workpiece, 10 is a beam output control device, 11 is a Hupukas control device, 12 is a beam deflection control device, 13 is a table control device, 14 is an interface circuit, 15 is a computer, 16 is an input/output typewriter.

When processing a green sheet using this device, in this example, one block of holes is made up of n5' holes (n rows x rows), and is processed by deflection movement of the beam, and each block movement is performed using an XY table. By doing this, we tried to speed up the process.

FIG. 2 is a diagram showing a beam deflection trajectory. In the figure 1
7 is the boolean positioning point and the initial position of the beam. White circles such as 18 and 20 indicate the drilling positions.
Arrows such as 1.22 indicate the beam deflection traces for the entire block, respectively.

After initially positioning the beam at position 17, a command is given from the computer 15 to the beam deflection control device 12 shown in FIG. The hole is machined by irradiating a pulse, but the pulse is not irradiated immediately after deflection, and a slight waiting period is provided. The reason for this is due to the time constant of the deflection coil. That is, since the deflection coil has a delay, a finite time is required to deflect the target distance as shown in FIG. In the figure, 25 is a time response curve of the coil, and 24 is a target value.

Deflection distance target value 1. Accurate positioning will not be possible unless a waiting time is provided for the time T determined by the allowable error e at that time.

After repeating the above process and drilling holes for one block as shown in FIG. 2, the beam passes through the trajectory 22 and reaches the initial position 17.
I'll return it to. After this, move the XY table to position it at a distance of L+p in the vertical or horizontal direction, and then
By repeating the process shown in FIG. 2 again, a wide range of processing is performed. Figure 4 shows this situation. In FIG. 4, reference numeral 25 denotes a green sheet to be processed, which is a block pattern that is positioned and processed using only the beam deflection as explained in FIG.

When drilling a hole in a green sheet using the method described above, the processing speed is 10 times or more higher than when processing using only a normal XY table while mechanically positioning the hole.

For example, when attempting to process 40,000 holes with a diameter of 150 μmφ using a 05 dragon pitch, the pulse width is 5 with a beam current of 2 tnA.
5 beam pulses of 0 μs with a duty factor of 10
A hole is formed by irradiation. The time required for this is approximately 2.5,718, and the positioning time due to table J is approximately 201:hy+3. Therefore, it takes about 2.3 hours to drill 40,000 holes using the conventional method. - In the method invented by Rikiki, if the beam waiting time is 5 ms, it takes 7.5 mS to process one hole. If the area to be processed by beam deflection is 8×8=64, one block takes Q, 48 seconds.

Even including table movement time, processing 40,000 points is about 1.
It has 0 degree of decentralization and can be extremely fast. In this example, 8×8=64 holes were machined by beam deflection, but this number should be freely changed depending on the allowable range of large inclination due to deflection and the distance between the workpiece and the coil. Also, the hole processing conditions and beam waiting time should be changed depending on the characteristics of the electron optical system and the time constant of the coil.

Furthermore, although this embodiment shows the case where holes are drilled at equal pitches in a lattice pattern, the present method can of course be applied to the case where holes are drilled at arbitrary positions.

〔Effect of the invention〕

According to the present invention, in drilling a hole in a green sheet, (1) high-speed processing that is 10 times or more faster than the conventional technology is possible.

(2) Holes can be drilled in any position.

There are effects such as

[Brief explanation of drawings]

Fig. 1 is a schematic configuration diagram of the equipment used for processing, Fig. 2 is a diagram showing a situation where positioning processing is performed only by beam deflection,
FIG. 6 is a diagram showing the time response of the deflection coil, and FIG. 4 is a conceptual diagram when drilling a large number of holes according to the present invention. DESCRIPTION OF SYMBOLS 1... Cathode, 2... Grid, 6... Anode, 4... Lens, 5... Deflection coil, 6... XY table, 10...
・Beam control device, 11・Focus control device 12
- Deflection control device, 13 Table control device, 14...
interface, 15 computer, 18, 20
Hole processing position, 19, 21, 22...Beam deflection locus, 23...Time response curve of deflection coil, 24.Target deflection distance, 25...Green sheet, - Patent attorney Akira Takahashi 1st figure Zaki E 3 Closed

Claims (1)

[Claims] 1. In an electron beam processing machine equipped with a beam pulsing function and a beam deflection coil, after applying the current value necessary to deflect the beam to a predetermined position to the deflection coil, the time constant and deflection of the coil are determined. A waiting time is provided for the beam settling time determined by the distance l, and after the waiting time has elapsed, a hole is formed in the material by immediately irradiating a beam pulse of a predetermined length a predetermined number of times, and this process can be used to deflect the beam. An electronic device characterized by forming a plurality of holes by repeating the process over the entire range, then positioning it at another position using a mechanical moving jig, and then repeating the hole forming process by beam deflection positioning. A method of drilling holes in the top 2 mics of unfired wood using a beam.