JPS60126852A - 半導体冷却装置 - Google Patents

半導体冷却装置

Info

Publication number
JPS60126852A
JPS60126852A JP58234223A JP23422383A JPS60126852A JP S60126852 A JPS60126852 A JP S60126852A JP 58234223 A JP58234223 A JP 58234223A JP 23422383 A JP23422383 A JP 23422383A JP S60126852 A JPS60126852 A JP S60126852A
Authority
JP
Japan
Prior art keywords
heat sink
fins
semiconductor
sections
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58234223A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422022B2 (enExample
Inventor
Asao Nishimura
西村　朝雄
Tatsuji Sakamoto
坂本　達事
Takahiro Oguro
崇弘 大黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58234223A priority Critical patent/JPS60126852A/ja
Publication of JPS60126852A publication Critical patent/JPS60126852A/ja
Publication of JPH0422022B2 publication Critical patent/JPH0422022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/774—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58234223A 1983-12-14 1983-12-14 半導体冷却装置 Granted JPS60126852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58234223A JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58234223A JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Publications (2)

Publication Number Publication Date
JPS60126852A true JPS60126852A (ja) 1985-07-06
JPH0422022B2 JPH0422022B2 (enExample) 1992-04-15

Family

ID=16967622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58234223A Granted JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Country Status (1)

Country Link
JP (1) JPS60126852A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
US5126829A (en) * 1988-09-26 1992-06-30 Hitachi, Ltd. Cooling apparatus for electronic device
US6528878B1 (en) * 1999-08-05 2003-03-04 Hitachi, Ltd. Device for sealing and cooling multi-chip modules
KR101147731B1 (ko) 2004-06-03 2012-05-25 엘지전자 주식회사 디엘피 프로젝터의 ｄｍｄ 칩의 냉각 구조

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
US5126829A (en) * 1988-09-26 1992-06-30 Hitachi, Ltd. Cooling apparatus for electronic device
US6528878B1 (en) * 1999-08-05 2003-03-04 Hitachi, Ltd. Device for sealing and cooling multi-chip modules
US6890799B2 (en) * 1999-08-05 2005-05-10 Hitachi, Ltd. Device for sealing and cooling multi-chip modules
KR101147731B1 (ko) 2004-06-03 2012-05-25 엘지전자 주식회사 디엘피 프로젝터의 ｄｍｄ 칩의 냉각 구조

Also Published As

Publication number Publication date
JPH0422022B2 (enExample) 1992-04-15

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