JPH0422022B2 - - Google Patents
Info
- Publication number
- JPH0422022B2 JPH0422022B2 JP58234223A JP23422383A JPH0422022B2 JP H0422022 B2 JPH0422022 B2 JP H0422022B2 JP 58234223 A JP58234223 A JP 58234223A JP 23422383 A JP23422383 A JP 23422383A JP H0422022 B2 JPH0422022 B2 JP H0422022B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- fins
- semiconductor
- heat
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W40/774—
-
- H10W90/724—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58234223A JPS60126852A (ja) | 1983-12-14 | 1983-12-14 | 半導体冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58234223A JPS60126852A (ja) | 1983-12-14 | 1983-12-14 | 半導体冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60126852A JPS60126852A (ja) | 1985-07-06 |
| JPH0422022B2 true JPH0422022B2 (enExample) | 1992-04-15 |
Family
ID=16967622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58234223A Granted JPS60126852A (ja) | 1983-12-14 | 1983-12-14 | 半導体冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60126852A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5052481A (en) * | 1988-05-26 | 1991-10-01 | International Business Machines Corporation | High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology |
| KR920008251B1 (ko) * | 1988-09-26 | 1992-09-25 | 가부시기가이샤 히다찌세이사꾸쇼 | 전자디바이스의 냉각장치 |
| JP2001053205A (ja) * | 1999-08-05 | 2001-02-23 | Hitachi Ltd | マルチチップモジュールの封止冷却装置 |
| KR101147731B1 (ko) | 2004-06-03 | 2012-05-25 | 엘지전자 주식회사 | 디엘피 프로젝터의 dmd 칩의 냉각 구조 |
-
1983
- 1983-12-14 JP JP58234223A patent/JPS60126852A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60126852A (ja) | 1985-07-06 |
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