JPH0422022B2 - - Google Patents

Info

Publication number
JPH0422022B2
JPH0422022B2 JP58234223A JP23422383A JPH0422022B2 JP H0422022 B2 JPH0422022 B2 JP H0422022B2 JP 58234223 A JP58234223 A JP 58234223A JP 23422383 A JP23422383 A JP 23422383A JP H0422022 B2 JPH0422022 B2 JP H0422022B2
Authority
JP
Japan
Prior art keywords
heat sink
fins
semiconductor
heat
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58234223A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60126852A (ja
Inventor
Asao Nishimura
Tatsuji Sakamoto
Takahiro Ooguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58234223A priority Critical patent/JPS60126852A/ja
Publication of JPS60126852A publication Critical patent/JPS60126852A/ja
Publication of JPH0422022B2 publication Critical patent/JPH0422022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/774
    • H10W90/724

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58234223A 1983-12-14 1983-12-14 半導体冷却装置 Granted JPS60126852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58234223A JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58234223A JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Publications (2)

Publication Number Publication Date
JPS60126852A JPS60126852A (ja) 1985-07-06
JPH0422022B2 true JPH0422022B2 (enExample) 1992-04-15

Family

ID=16967622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58234223A Granted JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Country Status (1)

Country Link
JP (1) JPS60126852A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
KR920008251B1 (ko) * 1988-09-26 1992-09-25 가부시기가이샤 히다찌세이사꾸쇼 전자디바이스의 냉각장치
JP2001053205A (ja) * 1999-08-05 2001-02-23 Hitachi Ltd マルチチップモジュールの封止冷却装置
KR101147731B1 (ko) 2004-06-03 2012-05-25 엘지전자 주식회사 디엘피 프로젝터의 dmd 칩의 냉각 구조

Also Published As

Publication number Publication date
JPS60126852A (ja) 1985-07-06

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