JPS60124893A - Dip soldering method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (al) Technical Field of the Invention The present invention relates to a dip soldering method for various components mounted on a printed wiring board, and in particular to a dip soldering method for simultaneously soldering non-solvent resistant components. is about the method.

Technical Background In recent years, there has been a trend toward automating the process of mounting components onto printed wiring boards, even down to the soldering process. However, the components mounted on the printed wiring board include those that can be dip soldered and those that cannot be dip soldered, such as non-solvent resistant components or contactable components. Therefore, dip soldering (;
In order to mount parts that can be mounted with a dip, parts that cannot be soldered with a dip half are manually soldered separately, resulting in poor work efficiency.
There is a strong demand for the development of a dip soldering method that allows parts that cannot be soldered at the same time to be soldered.

(c) Problems with the prior art Figure 1 shows the conventional dip soldering method (al is a cross-sectional view of one component inserted into a printed circuit board with a non-cold resistant agent ↑, and (h) is a cross-sectional view of soldering A cross-sectional view of the shallow depth (cl is a cross-sectional view of a through hole where no components are mounted.

Insert the terminals 4 of the non-solvent resistant parts 3 corresponding to the through holes 1 and 2 formed on the printed wiring board 1, and
After inserting, apply flux 5 to the surface to be subjected to solder dipping, and perform solder dipping in a "14" solder dip tank (not shown). Flux 5 rises along the There is a problem that it adheres to the main body and deteriorates the performance of the component 3.Therefore, if solder dipping is performed without inserting the non-solvent resistant component 3 into the through-hole 2, the through-hole 2 will be damaged due to capillary action. Since the solder rises and the component 3 cannot be inserted, the solder had to be removed with a solder sucker 6.
The figure shows a fa that prevents solder from adhering to the through holes.
t is a cross-sectional view, and (b) is a cross-sectional view of manual soldering. After inserting the non-solder terminal 8 into the through-hole 2 formed in the printed wiring board 1, or performing solder dipping with tape 7 or the like adhered to the dip surface of the through-hole 2, the non-solder terminal 8 is Then, the tape 7 is removed (as shown in BL, the terminal 4 of the non-solvent resistant component 3 is inserted into the through hole 2, and the solder 10 is bonded with the soldering iron 9. Therefore, there is a problem that work efficiency is poor. was there.

fd) Purpose of the Invention In view of the above-mentioned conventional problems, the present invention provides a method for simultaneously performing soldering by interposing a sheet-like member to which solder does not adhere between a non-solvent resistant component among mounted components and a printed wiring board. It is intended to provide a novel dip soldering method.

(el) Structure of the Invention In order to achieve the above-mentioned object, the present invention provides a sheet-like portion between a non-solvent resistant component and a printed wiring board among components mounted on a printed wiring board, to which solder does not adhere. This is accomplished by dip-soldering the printed wiring board after intervening the moon.

(fl Example of the invention: Dip soldering according to the present invention with reference to the drawings below)
An example of the method will be described in detail.

FIG. 3 is a cross-sectional view of a non-solvent resistant component inserted into a printed wiring board, and (b) is an enlarged view of the through-hole portion, for explaining an embodiment of the dip soldering LJ method according to the present invention. 3 is a cross-sectional view. In FIG. 3, the dip soldering G'J method of the present invention is equipped with a printed wiring board, through holes, non-solvent resistant parts, terminals, etc., as in FIG. The feature is that a sheet-shaped member 11 to which solder does not adhere is interposed between the solvent-resistant component and the printed wiring board.Therefore, parts other than the sheet-shaped member 11 are designated by the same reference numerals as in FIG. Therefore, the explanation of these parts will be omitted here. The sheet-like member 11 that characterizes the present invention is formed by forming Mylar tape or the like slightly larger in area than the non-solvent resistant part 3.
and the printed wiring board, so that the flux 5 and the solder 10 rise along the terminal 4 during solder dipping.

In this embodiment, the non-solvent resistant component 3 has been described as a component that cannot be soldered, but the same effect can be obtained for contact mechanical components such as connectors.

Further, although the sheet-like member 11 has been described as a Mylar tape, it is not limited to Mylar, and may be a high temperature resistant insulating sheet.

fg) Effects of the Invention As is clear from the above explanation, the dip soldering method according to the present invention improves work efficiency compared to the conventional dip soldering method, and also improves the automation of soldering dips. It is extremely advantageous when applied to

[Brief explanation of drawings]

Figure 1 is a cross-sectional view of a non-solvent resistant component inserted into a printed wiring board, (bl is a cross-sectional view of the component after soldering, and (C) is a cross-sectional view of the component after soldering) to explain the conventional dip soldering method. Figure 2 is a cross-sectional view of a through-hole that is not mounted with solder attached to the through-ball (al is a cross-sectional view,
(b) is a cross-sectional view of manual soldering. FIG. 3 is a cross-sectional view of a non-solvent resistant component inserted into a printed wiring board, and FIG. 3 (b) is an enlarged cross-sectional view of a through-hole part, for the purpose of explaining an embodiment of the dip soldering method according to the present invention. It is a diagram. In the figure, ■ is a printed wiring board, 2 is a through hole, 3 is a non-solvent resistant component, 4 is a terminal, 5 is a flux, 6 is a solder absorber, 7 is tape, 8 is a non-solder terminal, 9 is solder Reference numeral 10 indicates solder, and 11 indicates a sheet-like member.

Claims (1)

[Claims] A sheet-like member to which solder does not adhere is interposed between a non-solvent resistant component among the components mounted on the printed wiring board and the printed wiring board, and then the printed wiring board is dip soldered. Dip soldering is the method.