JPS6040199B2 - How to solder chip parts - Google Patents
How to solder chip partsInfo
- Publication number
- JPS6040199B2 JPS6040199B2 JP14269480A JP14269480A JPS6040199B2 JP S6040199 B2 JPS6040199 B2 JP S6040199B2 JP 14269480 A JP14269480 A JP 14269480A JP 14269480 A JP14269480 A JP 14269480A JP S6040199 B2 JPS6040199 B2 JP S6040199B2
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- printed circuit
- chip
- hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明はプリント基板の貫通孔にチップ部品を挿入して
、該チップ部品をプリント基板の導電パターンに半田付
けする方法に関し、特に、チップ部品を傷つけることが
なく、信頼性を向上し、また、プリント基板の高い加工
精度が要求されず、生産性が向上する上に、チップ部品
の取り替えの可能なものを提供するにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of inserting a chip component into a through hole of a printed circuit board and soldering the chip component to a conductive pattern of the printed circuit board, and in particular, a method that does not damage the chip component and is reliable. It is an object of the present invention to provide a device which improves productivity, does not require high processing precision of printed circuit boards, improves productivity, and allows chip parts to be replaced.
近年、プリント基板に、リードレスの小型電気部品であ
る、いわゆるチップ抵抗やチップコンデンサー等のチッ
プ部品を取付ける構造が多く使用されるようになって来
た。In recent years, structures in which chip components such as so-called chip resistors and chip capacitors, which are small leadless electrical components, are attached to printed circuit boards have been increasingly used.
そして、実装密度を向上するために、プリント基板の縦
方向に貫通孔を設け、この貫通孔内にチップ部品を挿入
し、プリント基板に設けた導電パターンにチップ部品の
電極部を半田付けするものがあるが、従来におけるこの
種の実装方法を第1図、及び第2図によって説明すると
、第1図において、1は両端に電極部la,laを備え
たチップ部品、2,3はリベット等の固定部材4によっ
て背中合せに組み合わされたプリント基板、2a,3a
はプIJント基板2,3の表面に設けられた導電パター
ン、5は両プリント基板2,3に設けられた貫通孔で、
この貫通孔5の一方の開□近傍には突出部6が形成され
ていて、この突出部6においてはチップ部品1の大きさ
より若干小さい開口となっている。In order to improve packaging density, a through hole is provided in the vertical direction of the printed circuit board, a chip component is inserted into this through hole, and the electrode part of the chip component is soldered to the conductive pattern provided on the printed circuit board. However, the conventional mounting method of this type will be explained with reference to FIGS. 1 and 2. In FIG. Printed circuit boards 2a, 3a combined back to back by fixing member 4 of
5 is a conductive pattern provided on the surface of printed circuit boards 2 and 3, and 5 is a through hole provided in both printed circuit boards 2 and 3.
A protrusion 6 is formed near one opening of the through hole 5, and the protrusion 6 has an opening slightly smaller than the size of the chip component 1.
そして、貫通孔5に矢印方向よりチップ部品1を挿入し
て圧入すると、チップ部品1は突出部6に引つかかって
仮止めされた状態となり、この仮止め状態で、チップ部
品1の電極部la,laと導電パターン2a,3aとを
半田付けするものである。Then, when the chip component 1 is inserted and press-fitted into the through hole 5 from the direction of the arrow, the chip component 1 is caught on the protrusion 6 and temporarily fixed, and in this temporarily fixed state, the electrode part la of the chip component 1 , la and the conductive patterns 2a, 3a are soldered.
しかし、このような方法においては、突出部6によって
チップ部品1の側面を削ってしまい、傷がつき、信頼性
の低下を招き、また、突出部6が大きいとチップ部品1
の傷を大きくし、更に、突出部6が4・さし、とチップ
部品1の仮止めが不充分となって抜け落ち、極めて精度
の高い加工が必要で、生産性が悪いという欠点があった
。However, in such a method, the side surface of the chip component 1 is scraped by the protrusion 6, causing scratches and lowering reliability, and if the protrusion 6 is large, the chip component 1
In addition, the protruding portion 6 was insufficiently temporarily secured to the chip component 1 and fell off, which required extremely high precision machining, resulting in poor productivity. .
また、第2図は他の従来例があって、2枚のプリント基
板2,3が、両基板間にはされた接着剤シート7によっ
て取付けられると共に、両プリント基板2,3に設けら
れた貫通孔5内に接着剤シート7の一部がかれ込んだ状
態にし、この貫通孔5にチップ部品1を挿入した状態で
加熱し、この接着剤シート7を融解してチップ部品1を
固定した後、チップ部品1の電極部la,laと導電パ
ターン2a,3aとを半田付けするものである。In addition, FIG. 2 shows another conventional example in which two printed circuit boards 2 and 3 are attached by an adhesive sheet 7 placed between both boards, and also provided on both printed circuit boards 2 and 3. A portion of the adhesive sheet 7 was inserted into the through hole 5, and the chip component 1 was heated while being inserted into the through hole 5 to melt the adhesive sheet 7 and fix the chip component 1. Thereafter, the electrode portions la, la of the chip component 1 and the conductive patterns 2a, 3a are soldered.
そして、このような方法においては、前記従来のような
チップ部品1に傷とつけることがないが接着剤シート7
という比較的高価な部材を必要とする上に、接着剤シー
ト7で固定されたチップ部品1は、組立後の検査によっ
て不良と判明した際の交換が不可能となり、歩蟹りが悪
いという欠点があった。本発明はかかる欠点を解消した
チップ部品の半田付け方法を提供するものであって、以
下、本発明を従来例と同一部品は同一番号を用いて、第
3図Aから第3図Cにおいて説明する。In such a method, the chip component 1 is not damaged as in the conventional method, but the adhesive sheet 7 is not damaged.
In addition, the chip component 1 fixed with the adhesive sheet 7 cannot be replaced if it is found to be defective by post-assembly inspection, resulting in poor performance. was there. The present invention provides a method for soldering chip components that eliminates such drawbacks, and the present invention will be described below with reference to FIGS. 3A to 3C, using the same numbers for the same components as in the conventional example. do.
第3図Aは、2枚のプリント基板2,3が背中合せにリ
ベット等の固定部材4によって組み合わされた断面を示
し、両プリント基板2,3に設けられた貫通孔5・・・
・・・・・・は、チップ部品1と傷つけず、チップ部品
1が容易に挿入できる程度の大きさで形成されている。FIG. 3A shows a cross section in which two printed circuit boards 2 and 3 are assembled back to back with a fixing member 4 such as a rivet, and through holes 5... provided in both printed circuit boards 2 and 3 are shown.
. . . are formed to have a size that allows the chip component 1 to be easily inserted without damaging the chip component 1.
次に、組み合わされた両プリント基板2,3は、第3図
Bのように、支持台8に設置され、しかる後、貫通孔5
に矢印方向よりチップ部品1と挿入して、チップ部品1
の一端を支持台8の面8aに当援させる。この時、チッ
プ部品1の両端が、両プリント基板2,3面から外方に
均等に突出させるように支持台8の面8aを設定しても
よいし、第3図Bにおいて、チップ部品1の一端がプリ
ント基板2面からわずかに突出するように面8aを設定
してもよい。Next, both the combined printed circuit boards 2 and 3 are installed on the support stand 8 as shown in FIG. 3B, and then the through holes 5
Insert chip component 1 from the direction of the arrow into the
One end of the support base 8 is placed against the surface 8a of the support base 8. At this time, the surface 8a of the support base 8 may be set so that both ends of the chip component 1 protrude evenly outward from the surfaces of both printed circuit boards 2 and 3. The surface 8a may be set so that one end of the surface 8a slightly protrudes from the surface of the printed circuit board 2.
次に「第3図Cに示すように、支持台8と反対側からゴ
ム等から成る磁石保持部材9をプリント基板2に被せる
。Next, as shown in FIG. 3C, a magnet holding member 9 made of rubber or the like is placed over the printed circuit board 2 from the side opposite to the support base 8.
すると、チップ部品1の亀極都la,laは鉄製のキャ
ップを被せたり、あるいはニッケルメッキを施すことに
よって形成されていて、磁性体から構成されているため
に、電極部laが磁石保持部材9に吸収された状態とな
って、チップ部品1が仮止めされる。Then, since the caps la and la of the chip component 1 are formed by covering them with iron caps or by applying nickel plating, and are made of a magnetic material, the electrode parts la are attached to the magnet holding member 9. In this state, the chip component 1 is temporarily fixed.
(第3図C参照)そして、第3図Cのように、チップ部
品1を受け入れるための凹部9aを磁石保持部材9に設
けると、チップ部品1の位置決めが正確にできる。次に
、上述のように、磁石保持部材9でチップ部品1が仮止
めされた状態で、ハンダ浴槽10内に浸糟すると、チッ
プ部品1の電極部laと導電パターン3aとが半田付け
される。即ち、本発明の半田付け方法によれば、磁石保
持部材9でチップ部品1を仮止めした状態で半田付けを
行なうものであるため、チップ部品1を貫通孔5に圧入
することがなく、従って、チップ部品1に錫をつけるこ
とがない上に、貫通孔5の加工精度も要求されず、加工
性が向上し、また、接着剤シート7とかチップ部品を保
持するための他の部材を付着することも不必要であるか
ら生産性が向上して安価となるばかりか、品質の面でも
構成部品が少し、ことはそこから発生する問題も少し、
ことに繋がり、チップ部品1の交換も可能である等の特
徴がある。(See FIG. 3C) When the magnet holding member 9 is provided with a recess 9a for receiving the chip component 1 as shown in FIG. 3C, the chip component 1 can be positioned accurately. Next, as described above, when the chip component 1 is temporarily fixed with the magnet holding member 9 and soaked in the solder bath 10, the electrode portion la of the chip component 1 and the conductive pattern 3a are soldered. . That is, according to the soldering method of the present invention, since soldering is performed with the chip component 1 temporarily fixed by the magnet holding member 9, the chip component 1 is not press-fitted into the through hole 5, and therefore , there is no need to attach tin to the chip component 1, and no machining precision is required for the through hole 5, improving workability.In addition, the adhesive sheet 7 and other members for holding the chip component are attached. Not only does it improve productivity and make it cheaper, but it also has fewer components in terms of quality, which means fewer problems arise.
In particular, the chip component 1 can be replaced.
第1図および第2図は従来の半田付け方法を示す要部断
面図、第3図A,B,Cは本発明の半田付け方法を示す
要部断面の説明図である。
1・・・・・・チップ部品、la・・・・・・電極部、
2,3・・・・・・プリント基板、2a,3a・・・・
・・導電パターン、4・・・・・・固定部材、5…・・
・貫通孔、8・・・・・・支持台、8a……面、9……
磁石保持部材、9a……凹部、10・・・・・・ハンダ
浴槽。
オ/図
才2図
才〆図1 and 2 are sectional views of essential parts showing a conventional soldering method, and FIGS. 3A, B, and C are explanatory views of sectional views of essential parts showing a soldering method of the present invention. 1... Chip parts, la... Electrode part,
2, 3... Printed circuit board, 2a, 3a...
...Conductive pattern, 4...Fixing member, 5...
・Through hole, 8... Support stand, 8a... Surface, 9...
Magnet holding member, 9a... recess, 10... solder bath. O/Zouzai 2zuzai 〆zu
Claims (1)
ーンが外側になるように2枚を重ね合わせ、前記プリン
ト基板に設けた貫通孔にチツプ部品を挿通して該チツプ
部品の電極部と導電パターンとを半田付けする方法にお
いて、前記貫通孔はチツプ部品を遊嵌し得るようになし
前記プリント基板の一方の面から所定の位置に支持台を
配設し、プリント基板の他方の面からチツプ部品を貫通
孔に挿入して、貫通孔からチツプ部品の一部が突出する
ようにチツプ部品を支持台で支持する工程と、プリント
基板に磁石保持部材を重ね、磁石保持部材でチツプ部品
を保持する工程と磁石保持部材でチツプ部品を保持した
状態で、チツプ部品の電極部と導電パターンとを半田付
けする工程とから成るチツプ部品の半田付け方法。1 Lay two printed circuit boards with conductive patterns on top of each other so that the conductive patterns are on the outside, insert a chip component into the through hole provided in the printed circuit board, and connect the electrode part of the chip component with the conductive pattern. In the method of soldering, the through hole is made so that the chip component can be fitted loosely therein, a support is provided at a predetermined position from one surface of the printed circuit board, and the chip component is soldered from the other surface of the printed circuit board. A step in which the chip component is inserted into the through hole and supported by a support base so that a part of the chip component protrudes from the through hole; and a step in which a magnet holding member is stacked on the printed circuit board and the chip component is held by the magnet holding member. A method for soldering chip parts, which comprises the steps of: and soldering the electrode part of the chip part and the conductive pattern while holding the chip part with a magnet holding member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14269480A JPS6040199B2 (en) | 1980-10-13 | 1980-10-13 | How to solder chip parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14269480A JPS6040199B2 (en) | 1980-10-13 | 1980-10-13 | How to solder chip parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5766694A JPS5766694A (en) | 1982-04-22 |
JPS6040199B2 true JPS6040199B2 (en) | 1985-09-10 |
Family
ID=15321356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14269480A Expired JPS6040199B2 (en) | 1980-10-13 | 1980-10-13 | How to solder chip parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6040199B2 (en) |
-
1980
- 1980-10-13 JP JP14269480A patent/JPS6040199B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5766694A (en) | 1982-04-22 |
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