JPS6040199B2 - How to solder chip parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of inserting a chip component into a through hole of a printed circuit board and soldering the chip component to a conductive pattern of the printed circuit board, and in particular, a method that does not damage the chip component and is reliable. It is an object of the present invention to provide a device which improves productivity, does not require high processing precision of printed circuit boards, improves productivity, and allows chip parts to be replaced.

In recent years, structures in which chip components such as so-called chip resistors and chip capacitors, which are small leadless electrical components, are attached to printed circuit boards have been increasingly used.

In order to improve packaging density, a through hole is provided in the vertical direction of the printed circuit board, a chip component is inserted into this through hole, and the electrode part of the chip component is soldered to the conductive pattern provided on the printed circuit board. However, the conventional mounting method of this type will be explained with reference to FIGS. 1 and 2. In FIG. Printed circuit boards 2a, 3a combined back to back by fixing member 4 of
5 is a conductive pattern provided on the surface of printed circuit boards 2 and 3, and 5 is a through hole provided in both printed circuit boards 2 and 3.
A protrusion 6 is formed near one opening of the through hole 5, and the protrusion 6 has an opening slightly smaller than the size of the chip component 1.

Then, when the chip component 1 is inserted and press-fitted into the through hole 5 from the direction of the arrow, the chip component 1 is caught on the protrusion 6 and temporarily fixed, and in this temporarily fixed state, the electrode part la of the chip component 1 , la and the conductive patterns 2a, 3a are soldered.

However, in such a method, the side surface of the chip component 1 is scraped by the protrusion 6, causing scratches and lowering reliability, and if the protrusion 6 is large, the chip component 1
In addition, the protruding portion 6 was insufficiently temporarily secured to the chip component 1 and fell off, which required extremely high precision machining, resulting in poor productivity. .

In addition, FIG. 2 shows another conventional example in which two printed circuit boards 2 and 3 are attached by an adhesive sheet 7 placed between both boards, and also provided on both printed circuit boards 2 and 3. A portion of the adhesive sheet 7 was inserted into the through hole 5, and the chip component 1 was heated while being inserted into the through hole 5 to melt the adhesive sheet 7 and fix the chip component 1. Thereafter, the electrode portions la, la of the chip component 1 and the conductive patterns 2a, 3a are soldered.

In such a method, the chip component 1 is not damaged as in the conventional method, but the adhesive sheet 7 is not damaged.
In addition, the chip component 1 fixed with the adhesive sheet 7 cannot be replaced if it is found to be defective by post-assembly inspection, resulting in poor performance. was there. The present invention provides a method for soldering chip components that eliminates such drawbacks, and the present invention will be described below with reference to FIGS. 3A to 3C, using the same numbers for the same components as in the conventional example. do.

FIG. 3A shows a cross section in which two printed circuit boards 2 and 3 are assembled back to back with a fixing member 4 such as a rivet, and through holes 5... provided in both printed circuit boards 2 and 3 are shown.
. . . are formed to have a size that allows the chip component 1 to be easily inserted without damaging the chip component 1.

Next, both the combined printed circuit boards 2 and 3 are installed on the support stand 8 as shown in FIG. 3B, and then the through holes 5
Insert chip component 1 from the direction of the arrow into the
One end of the support base 8 is placed against the surface 8a of the support base 8. At this time, the surface 8a of the support base 8 may be set so that both ends of the chip component 1 protrude evenly outward from the surfaces of both printed circuit boards 2 and 3. The surface 8a may be set so that one end of the surface 8a slightly protrudes from the surface of the printed circuit board 2.

Next, as shown in FIG. 3C, a magnet holding member 9 made of rubber or the like is placed over the printed circuit board 2 from the side opposite to the support base 8.

Then, since the caps la and la of the chip component 1 are formed by covering them with iron caps or by applying nickel plating, and are made of a magnetic material, the electrode parts la are attached to the magnet holding member 9. In this state, the chip component 1 is temporarily fixed.

(See FIG. 3C) When the magnet holding member 9 is provided with a recess 9a for receiving the chip component 1 as shown in FIG. 3C, the chip component 1 can be positioned accurately. Next, as described above, when the chip component 1 is temporarily fixed with the magnet holding member 9 and soaked in the solder bath 10, the electrode portion la of the chip component 1 and the conductive pattern 3a are soldered. . That is, according to the soldering method of the present invention, since soldering is performed with the chip component 1 temporarily fixed by the magnet holding member 9, the chip component 1 is not press-fitted into the through hole 5, and therefore , there is no need to attach tin to the chip component 1, and no machining precision is required for the through hole 5, improving workability.In addition, the adhesive sheet 7 and other members for holding the chip component are attached. Not only does it improve productivity and make it cheaper, but it also has fewer components in terms of quality, which means fewer problems arise.
In particular, the chip component 1 can be replaced.

[Brief explanation of the drawing]

1 and 2 are sectional views of essential parts showing a conventional soldering method, and FIGS. 3A, B, and C are explanatory views of sectional views of essential parts showing a soldering method of the present invention. 1... Chip parts, la... Electrode part,
2, 3... Printed circuit board, 2a, 3a...
...Conductive pattern, 4...Fixing member, 5...
・Through hole, 8... Support stand, 8a... Surface, 9...
Magnet holding member, 9a... recess, 10... solder bath. O/Zouzai 2zuzai 〆zu

Claims (1)

[Claims] 1 Lay two printed circuit boards with conductive patterns on top of each other so that the conductive patterns are on the outside, insert a chip component into the through hole provided in the printed circuit board, and connect the electrode part of the chip component with the conductive pattern. In the method of soldering, the through hole is made so that the chip component can be fitted loosely therein, a support is provided at a predetermined position from one surface of the printed circuit board, and the chip component is soldered from the other surface of the printed circuit board. A step in which the chip component is inserted into the through hole and supported by a support base so that a part of the chip component protrudes from the through hole; and a step in which a magnet holding member is stacked on the printed circuit board and the chip component is held by the magnet holding member. A method for soldering chip parts, which comprises the steps of: and soldering the electrode part of the chip part and the conductive pattern while holding the chip part with a magnet holding member.