JPS5853891A - Method of producing high density circuit using chip parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION This invention utilizes chip components to achieve the desired results. The present invention relates to a method for manufacturing a circuit.

Recently, the number of circuits that use chip components for both consumer and industrial applications has increased rapidly, and various improvements have been made to the mounting methods. Most of the circuit boards used are combined with chip components and conventional Discly-F components. The main reason for this is the rounding of parts that have not yet been made into chips. It is thought that these parts will eventually change to chip-shaped parts that can be bonded face-down, but in reality, chip parts 1 and discrete parts 2 are used together, as shown in FIGS. 1 to 3.

First of all, in Figure 1, there are 2 discreet F parts between 10 chip parts.
9, a chip component 1 is placed on one side of a board 30 on a discrete component 20, and is soldered to a circuit pattern 4.

In FIG. 2, a chip component 1 and a discrete component 2 are mounted on one side of a substrate 30, respectively. Furthermore, in order to achieve high density, FIG. 3 is a so-called double-sided circuit board in which the circuit pattern 4 is formed on the back side of one circuit board 3', and the chip component l is placed on both the front and back sides of the -f9 discrete circuit board. The component 2 is inserted from the surface and soldered to the circuit pattern 4. Note that 5 indicates solder and 6 indicates adhesive.

However, each of these has the following drawbacks. In other words, in the case of FIGS. 1 and 2, the chip component 1 is fixed to the circuit pattern 4 with an adhesive 6, and the lands of the pattern 4 are bonded by a dipping method in which the chip component 1 is immersed in a solder bath after death, or by a reflow soldering method. and component terminals! I! Further, the discrete component 2 is inserted into the gap between the chip component 1, and the lead wire and the land of the pattern 4 are soldered by the dip method. Therefore, the chip component 1 is subjected to two heating steps, which reduces the reliability of the chip component 1.

In this case, 1@ causes chip component 1 and discrete component 2.
It is also theoretically possible to solder the In other words, it is sufficient to fix the chip component 1 with adhesive 6, insert the discrete component 2 before and after it with an insert machine, and immerse it in a solder bath, but when inserting the discrete component 2 with the insert machine, the impact and perturbation are Since the chip component 1 may peel off or fall, it is difficult to make it next month.

In the case of Fig. 3, the chip component 1 is mounted on one double-sided circuit board 3.
', and the discrete component 2 must be inserted into the hole and connected. Therefore, it is very difficult to simultaneously fix the front and back chip components 1 with adhesive 6 and then solder them at the same time, so first fix the chip components 1 on the front surface with adhesive 6, and then Solder, then attach the chip components on the back side in the same way as on the front side, and finally insert the discrete component 2 and dip the lead wire side in the solder bath to solder. I'm taking it. As a result, if the chip component 1 on the first surface is subjected to 3@ heating steps, the reliability of the chip component 1 will be significantly reduced.

Originally, the main body and terminal of chip parts are integrated, so when soldering, the heat is quickly transferred to the main body, and the coefficient of thermal expansion is also considerably different from that of the board, so as the number of times that heat is applied increases, the parts deteriorate. Reliability decreases, so the key point is how to mount as many chip components as possible at high density without applying too much heat.

Therefore, an object of the present invention is to make a high vBf circuit by making full use of the characteristics of chip components, and to improve the reliability of chip components by reducing the number of times heat is applied to the chip components. An object of the present invention is to provide a method for manufacturing a high-density circuit.

An embodiment of this invention will be explained with reference to FIG.

Namely, glass epoxy, boliide, phenol,
After attaching the chip component 10 to the pattern 9 side of two single-sided circuit boards 7.8 made of Cefmic or the like using a conventional method such as the diddeso V-da method or the flow soldering method (No. 45!i!1ml , (bl) The other surface 71 and surface 8 of the chip component 10 that are not mounted are bonded and connected together with adhesive, etc., and 111!
4 As shown in FIG. 1cl, the chip component 10 appears to be mounted on both sides of one upper board. The same reference numerals as in FIGS. 1 to 3 are used for the solder and adhesive of the chip component 10.

[Launching of the substrates 7 and 8] In addition to the adhesive 11, through-holes may be provided in front of the double-sided tape and integration may be performed by soldering. Also, the thickness of the substrate 7.8 is such that the substrate 7 is thin (for example, O1t■), and the substrate 8 is thick (for example, 14).
■) It is advantageous in terms of cost if formed. When bonded and integrated, the board needs to have a certain level of strength if the discrete components 12 are then inserted using an automatic insertion machine as shown in FIG. That is, when used together with the discrete component 12, one of the substrates 7 and 8 needs to be somewhat thick (1.0 to 2.01-).

On the other hand, if the discrete component 12 is not used together with φ, the board 7
．． 8 may be of thin substrate, i.e. 0.5~0,
1 TSS epoxy glass substrate! Friend can also be used with flexible circuit boards. In this case, the device can be made smaller and thinner. In this way, when the chip components 10 are individually mounted and the 92 boards 7 and 8 are bonded together, they can be integrated as if they were one double-sided board, making it possible to implement high-density mounting and to Since heat is applied to the component only once, the reliability of the chip component can be improved.

Also, even when used together with the discrete component 12, the heat applied to the chip component is the same 111! Compared to the case shown in Fig. 3, which requires mounting y times, this is fewer than 2 times, and 10 chip parts are mounted.
This will improve the reliability of the system.

The purpose of electrical connection of the circuits on the substrates 7 and 8 can be easily achieved by providing through holes and connecting with solder or lead wires.

As described above, the method for manufacturing a Tomodakane circuit using chip components of the present invention involves bonding two single-sided chip-mounted circuit boards together to form a single piece, so the reliability of the chip components is not reduced. This has the effect that a high-density circuit configuration can be formed, and that it is also possible to easily mount a combination of chip components and dixyy-) components.

[Brief explanation of drawings]

1 to 3 are sectional views of conventional circuits, FIG. 4 is a process diagram of an embodiment of the present invention, and FIG. 5 is a sectional view of an embodiment of the present invention. 7.8-...Substrate, 1G...Chip parts, 12...
discrete parts

Claims (1)

[Claims] (IJ) Two circuit boards each having a circuit pattern formed on one side are prepared, and chip-shaped parts are face-down bonded to the two circuit boards to create a first and second chip-mounted circuit board. , a method for manufacturing a high-density circuit using chip components, characterized in that the surfaces on which the chip components of these chip component-mounted circuit boards are mounted are connected together. (2) The twelfth and second The chip component-mounted circuit boards have different thicknesses from each other. A method for manufacturing a high-density circuit using chip components according to claim 11. (3) The first and second chip component-mounted circuit boards have through-hole Claim No. 11 (9) is a method for manufacturing a high-density circuit using a chip component according to Claim (21), in which the holes are electrically and mechanically connected by soldering. and a method for manufacturing a high-density circuit using a chip component according to claim 111, (2) or (3), in which discrete components are mounted on a $2 chip component-mounted circuit board. .