JPS60124062U - Metal-based laminate for circuit boards - Google Patents

Metal-based laminate for circuit boards

Info

Publication number
JPS60124062U
JPS60124062U JP1211884U JP1211884U JPS60124062U JP S60124062 U JPS60124062 U JP S60124062U JP 1211884 U JP1211884 U JP 1211884U JP 1211884 U JP1211884 U JP 1211884U JP S60124062 U JPS60124062 U JP S60124062U
Authority
JP
Japan
Prior art keywords
metal
circuit boards
based laminate
metal base
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1211884U
Other languages
Japanese (ja)
Inventor
川嶋 三郎
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP1211884U priority Critical patent/JPS60124062U/en
Publication of JPS60124062U publication Critical patent/JPS60124062U/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る回路基板用金属ベース積層板の一
実施例を概念的に示す断面図、第2図及び第3図は、そ
れぞれ、金属ベース材における透孔又はスリット等の構
成例を概念的に示す平面図である。 1・・・導電箔、2・・・接着剤、3・・・金属ベース
材、   −4・・・透孔又はスリット、4A・・・円
孔、4B・・・スリット、4C・・・切れ目。
FIG. 1 is a cross-sectional view conceptually showing an embodiment of a metal base laminate for circuit boards according to the present invention, and FIGS. 2 and 3 are examples of configurations of through holes, slits, etc. in the metal base material, respectively. FIG. DESCRIPTION OF SYMBOLS 1... Conductive foil, 2... Adhesive, 3... Metal base material, -4... Through hole or slit, 4A... Circular hole, 4B... Slit, 4C... Cut .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電箔を接着剤を介して金属ベース材に接着してなる回
路基板用金属ベース積層板において、前記金属ベース材
に透孔又はスリット若しくは切れ目を形成したことを特
徴とする回路基板用金属ベース積層板−′
A metal base laminate for a circuit board formed by adhering a conductive foil to a metal base material via an adhesive, characterized in that a through hole, slit, or cut is formed in the metal base material. board-′
JP1211884U 1984-01-31 1984-01-31 Metal-based laminate for circuit boards Pending JPS60124062U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1211884U JPS60124062U (en) 1984-01-31 1984-01-31 Metal-based laminate for circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1211884U JPS60124062U (en) 1984-01-31 1984-01-31 Metal-based laminate for circuit boards

Publications (1)

Publication Number Publication Date
JPS60124062U true JPS60124062U (en) 1985-08-21

Family

ID=30494876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1211884U Pending JPS60124062U (en) 1984-01-31 1984-01-31 Metal-based laminate for circuit boards

Country Status (1)

Country Link
JP (1) JPS60124062U (en)

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