JPS60124046U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS60124046U
JPS60124046U JP1984011840U JP1184084U JPS60124046U JP S60124046 U JPS60124046 U JP S60124046U JP 1984011840 U JP1984011840 U JP 1984011840U JP 1184084 U JP1184084 U JP 1184084U JP S60124046 U JPS60124046 U JP S60124046U
Authority
JP
Japan
Prior art keywords
metal plate
semiconductor element
semiconductor equipment
utility
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984011840U
Other languages
Japanese (ja)
Inventor
広治 古里
木崎　清治
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP1984011840U priority Critical patent/JPS60124046U/en
Publication of JPS60124046U publication Critical patent/JPS60124046U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来構造図、第２図は本考案の原理説明図、第
３図、第４図は本考案の実施例図である。 図において１．１’、１″　１　ｍは電極金属板（端子
板）１ａ、１ｂは案内部（凹状溝）、２，２−１．２−
２．２−３．２−４は半導体素子（チップ）、３．３−
１．３−２．３−３は接続金属　　−板（接続板）、４
はモールド樹脂である。FIG. 1 is a conventional structural diagram, FIG. 2 is a diagram explaining the principle of the present invention, and FIGS. 3 and 4 are illustrations of an embodiment of the present invention. In the figure, 1.1', 1'' 1 m is the electrode metal plate (terminal plate) 1a, 1b is the guide part (concave groove), 2,2-1.2-
2.2-3.2-4 is a semiconductor element (chip), 3.3-
1.3-2.3-3 is connecting metal - plate (connecting plate), 4
is mold resin.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）電極金属板上に半導体素子を固着し、これらを接
続金属板により接続した半導体装置において、前記電極
金属板の少（とも半導体素子固着部に案内部を設けたこ
とを特徴とする半導体装置。(1) A semiconductor device in which a semiconductor element is fixed on an electrode metal plate and these are connected by a connecting metal plate, characterized in that a guide part is provided at least in the semiconductor element fixed part of the electrode metal plate. Device. （２）電極金属板の接続金属板接続部に案内部を設けた
ことを特徴とする実用新案登録請求の範囲第（１）項記
載の半導体装置。(2) The semiconductor device according to claim (1), which is a registered utility model, characterized in that a guide portion is provided at the connecting portion of the connecting metal plate of the electrode metal plate. （３）　　案内部が半導体素子の形状に応じた凹状溝で
あることを特徴とする実用新案登録請求の範囲第（１）
項記載の半導体装置。(3) Utility model registration claim No. (1) characterized in that the guide portion is a concave groove corresponding to the shape of the semiconductor element
1. Semiconductor device described in Section 1.
JP1984011840U 1984-01-31 1984-01-31 semiconductor equipment Pending JPS60124046U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984011840U JPS60124046U (en) 1984-01-31 1984-01-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984011840U JPS60124046U (en) 1984-01-31 1984-01-31 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS60124046U true JPS60124046U (en) 1985-08-21

Family

ID=30494338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984011840U Pending JPS60124046U (en) 1984-01-31 1984-01-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS60124046U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513010B2 (en) * 1974-03-06 1980-04-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513010B2 (en) * 1974-03-06 1980-04-05

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