JPS60121754A - Bending device for lead - Google Patents

Bending device for lead

Info

Publication number
JPS60121754A
JPS60121754A JP23660284A JP23660284A JPS60121754A JP S60121754 A JPS60121754 A JP S60121754A JP 23660284 A JP23660284 A JP 23660284A JP 23660284 A JP23660284 A JP 23660284A JP S60121754 A JPS60121754 A JP S60121754A
Authority
JP
Japan
Prior art keywords
lead
section
bending
package
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23660284A
Other languages
Japanese (ja)
Inventor
Kazuhisa Takashima
高島　一壽
Toshio Kanno
利夫 管野
Michio Tanimoto
道夫 谷本
Shunichiro Fujioka
俊一郎 藤岡
Shunei Uematsu
俊英 植松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP23660284A priority Critical patent/JPS60121754A/en
Publication of JPS60121754A publication Critical patent/JPS60121754A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4896—Mechanical treatment, e.g. cutting, bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the damage of a sealing medium for a glass layer, etc. in a package section by bending a lead by pushing down an end section outer than a bending corresponding section in the lead. CONSTITUTION:A lead frame 21 is placed on a support mold 22 and a punching bottom force 24. A punching top force 26 is lowered, and a lead 25 is cut from a section in the vicinity of an outer frame 23 in the frame 21 by edges in the lower sections of both side edges of a punching edge section in the top force 26 and the bottom force 24. The lead is bent slowly from the outer end sections of the lead 25 by further lowering the top force 26. The lead 25 is bent positively without clamping the punching bottom force or the lead 25 because stress concentrates in a section, to which a small hole 27 is formed, in the lead 25 at that time. According to such a device, a glass outflow section 31 flowing out of a package section 20 is not damaged because it is not clamped. Airtightness is not also deteriorated because the lead section in the small hole 27 section in the lead 25 is bent before a glass layer in the package section 20 is cracked.

Description

【発明の詳細な説明】 本発明はガラスセラミックパッケージ型半導体装置等の
ＤＩＬパッケージにおけるリードの折り曲げ装置に関す
る。たとえば、ローラ等を用いたＤＩＬタイプパッケー
ジのリード折り曲げ装置については、実開昭５０−１３
０６６０に示めされている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead bending device in a DIL package such as a glass ceramic package type semiconductor device. For example, regarding lead bending equipment for DIL type packages using rollers etc.,
0660.

従来、例えばガラスセラミックパッケージ型半導体装置
（以下単忙半導体装置と称する。）忙あっては、バクケ
ージ部を形作るセラミック板からなるキャップとベース
はリードを間に挾み、かつガラス層を介して接着されて
いる。このガラス層は外力に対して弱く簡単にクラック
を発生してしまう。このため、組立にあっては、あらか
じめリード部分が曲折したリードフレームを用いている
。Conventionally, for example, in a glass-ceramic packaged semiconductor device (hereinafter referred to as a single packaged semiconductor device), a cap and a base made of ceramic plates forming the back cage part were bonded together with leads sandwiched between them. has been done. This glass layer is weak against external forces and easily cracks. For this reason, during assembly, a lead frame whose lead portions are bent in advance is used.

しかし、曲折したリードフレームは取扱に（く、かつ各
部に剛性がないことから変形し易い欠点がある。したが
って、組立の自動化が図り忙くぃ。However, bent lead frames are difficult to handle, and their parts lack rigidity, making them easily deformed.Therefore, efforts are being made to automate assembly.

そこで、リードの折り曲がり相当部がガラス層にクラッ
クを生じる外力よりも小さな外力で簡単に折れ曲がるよ
うにしておくことによって、平坦（フラット）なり一ド
フレームを用い、組立の自動化を図る方法が本出願人に
よって提案されている。すなわち、第４図で示すように
、１対の平行に延びる外枠１と、これら外枠１を結ぶ１
対の内枠２と、外枠１の内側から外枠１と内枠２で形成
される枠の中央部に向かって内枠２と平行に延びるリー
ド３とからなるリードフレーム４にあって、あらかじめ
リード３のｖｉ曲相当部に小孔５を設けておく。そｌ−
で、自動組立が終了し、主要部をセラミックのベースと
キャップからなるパッケージ部６で封止した後、同図で
示すように、鎖線部でリード３を切断してリード３を外
枠１から分離し、その後リード３を小孔５部分で一方向
に折り曲げる。Therefore, the most effective method is to automate the assembly by using a flat frame by making the bending part of the lead easily bend with an external force that is smaller than the external force that would cause cracks in the glass layer. Proposed by the applicant. That is, as shown in FIG. 4, a pair of outer frames 1 extending in parallel and a line 1 connecting these outer frames
A lead frame 4 includes a pair of inner frames 2 and a lead 3 extending parallel to the inner frame 2 from the inside of the outer frame 1 toward the center of the frame formed by the outer frame 1 and the inner frame 2, A small hole 5 is provided in advance in a portion of the reed 3 corresponding to the vi song. Sol-
After the automatic assembly is completed and the main part is sealed with a package part 6 consisting of a ceramic base and a cap, the leads 3 are cut along the chain lines and removed from the outer frame 1, as shown in the figure. After separating, the lead 3 is bent in one direction at the small hole 5 portion.

ところで、この方法におけるリードの折り曲げは、従来
、レジンモールド型半導体装置においてリードを折り曲
げる第５図で示す装置を用いて行なうことが考えられる
。すなわち、このリード折曲装置は、パッケージ部６を
支持する下型７および上型８と、この上型８の両側に設
けられる折曲上型９と、この折曲上型９０両側に設けら
ねる切断下型１０とからなっている。前記折曲上型９の
外側端縁は切断下型１０と対となって切断上型を兼ね、
折曲上型９の下降によってリード３を切断する。また、
前記下型７および上型８の周縁は突条部１１．１２を有
し、これらの突条部１１．１２によってパッケージ部６
から突出するり一ド３の付は根部分をクランプする。そ
して、このリード折曲装置では、下型７および切断下型
ｌｏ上にパッケージが終了したリードフレーム４を載置
した後、上型８を下降させて、リード３をクランプする
。つぎに折曲上型９を下降させることによって切断下型
１０と折曲上型９とでリード３を切断するとともに、さ
らに下降する折曲上型９によってリード３を下降させ、
クランプ部分の外縁部のリードの小孔５部分で折り曲げ
を行なう。Incidentally, the bending of the leads in this method may be conventionally carried out using the apparatus shown in FIG. 5, which bends the leads in a resin molded semiconductor device. That is, this lead bending device includes a lower die 7 and an upper die 8 that support the package part 6, a bending upper die 9 provided on both sides of the upper die 8, and a bending upper die 9 provided on both sides of the bending upper die 90. It consists of a lower cutting die 10. The outer edge of the bending upper mold 9 pairs with the cutting lower mold 10 and also serves as the cutting upper mold,
The lead 3 is cut by lowering the upper bending mold 9. Also,
The peripheral edges of the lower mold 7 and the upper mold 8 have protrusions 11.12, and these protrusions 11.12 allow the package part 6 to be
The part of the hinge 3 protruding from the base clamps the root part. In this lead bending device, after the packaged lead frame 4 is placed on the lower die 7 and the cutting lower die lo, the upper die 8 is lowered and the leads 3 are clamped. Next, by lowering the upper bending die 9, the lower cutting die 10 and the upper bending die 9 cut the lead 3, and the upper bending die 9 is further lowered to lower the lead 3.
The lead is bent at the small hole 5 at the outer edge of the clamp part.

しかし、このリード折曲装置ではり一ド３の付は根部分
をクランプするが、ガラスセラミックパッケージでは、
ペースとキャップを接着するガラス層が第５図で示すよ
うに外方に流れ出し、流出部１３を形作ることが多い。However, in this lead bending device, the root part of the adhesive 3 is clamped, but in the glass ceramic package,
The glass layer bonding the paste and cap often flows outwardly, forming an outflow section 13, as shown in FIG.

この結果、下型７゜上型８の突条部１１．１２でリード
３をクランプする際、この流出部１３をもクランプする
ため、流出部は割れてしまう。また、この割れによって
クラックがパッケージ部６内部のガラス層に延びること
から、半導体装置の気密性が低下する。As a result, when the lead 3 is clamped by the protrusions 11 and 12 of the lower die 7° and the upper die 8, this outflow portion 13 is also clamped, resulting in the outflow portion being cracked. Furthermore, this crack extends to the glass layer inside the package portion 6, thereby reducing the airtightness of the semiconductor device.

したがって、本発明の目的は、パッケージ部のガラス層
等の封止材を破損させることなくリードを折り曲げる装
置を提供することＫある。Therefore, an object of the present invention is to provide an apparatus for bending leads without damaging the sealing material such as the glass layer of the package portion.

このような目的を達成するために本発明の一実施例は、
パッケージ部をその下面で支えるとともに、リードの応
力集中を起こして曲がる曲折相当部よりも外端部を押し
下げることによってリードを折り曲げるものであって、
以下実施例により本発明を説明する。In order to achieve this purpose, one embodiment of the present invention is as follows:
The package part is supported on the lower surface thereof, and the leads are bent by pushing down the outer ends of the leads below the bending part that causes stress concentration in the leads and bends.
The present invention will be explained below with reference to Examples.

第１図１ａｌ　、　ｌｂｌは本発明の半導体装置におけ
るリードの折り曲げ装置の一実施例を示す。同図ｔａ＋
にはリード切断折曲装置の概略が示されている。すなわ
ち、パッケージ部２０を中央に有するリードフレーム２
１のパッケージ部２０を支持する支え型２２と、リード
フレーム２１の外枠２３を支える打抜下型２４と、この
打抜下型２４に対応し、リードフレーム２１のリード２
５を外枠２３の付は根部分で切断する打抜上型２６とか
らなっている。また、前記打抜上型２６はリード２５を
リード２５に設けた小孔２７部分で折り曲げる折曲上型
をも兼ねている。前記小孔２７は各リード２５に１個ず
つ設けられるとともに、共通のリード列にあっては一直
線状に配設されている。また、前記打抜上型２６の打抜
刃部２８は内方に向かうにしたがって徐々に短かくなる
とともに、打抜刃部２８の内壁面はそれぞれのり一ド２
５の小孔２７の中心よりもわずか外方に位置している。FIGS. 1A and 1B show an embodiment of a lead bending device in a semiconductor device of the present invention. Same figure ta+
A lead cutting and bending device is schematically shown in FIG. That is, the lead frame 2 has the package part 20 in the center.
1, a supporting die 22 supporting the package part 20 of the lead frame 21; a punching lower die 24 supporting the outer frame 23 of the lead frame 21;
The outer frame 23 is attached to a punching upper die 26 for cutting the outer frame 5 at the root portion. Further, the punching upper mold 26 also serves as a bending upper mold for bending the lead 25 at a small hole 27 provided in the lead 25. One small hole 27 is provided for each lead 25, and they are arranged in a straight line in a common lead row. Further, the punching blade portion 28 of the punching upper mold 26 becomes gradually shorter as it goes inward, and the inner wall surface of the punching blade portion 28 is
It is located slightly outward from the center of the small hole 27 of No. 5.

これは、リード２５を折り曲げた線にリード２５の折曲
状態を一定にするためである。This is to keep the bending state of the lead 25 constant along the bending line of the lead 25.

つぎに、切断折曲について説明する。まず、第１図１ａ
ｌで示すように、支え型２２および打抜下型２４−ヒに
リードフレーム２１を載置する。この際、リードフレー
ム２１は打抜下型２４の両性側縁の突出するガイドＨ１
ｔ　２９　、３０によって位置決めさ第１る。そこで、
杓抜上型２６を下降させて打抜上型２６の打抜刃部２８
の両側縁下部の刃と打抜下型２４とによってリード２５
をリードフレーム２１の外枠２３近傍から切断する。そ
の後、同図（ｂｌで示すように、さらに打抜上型２６を
下降させることによってリード２５の外端部から徐々に
折り曲げを行なう。この際、リード２５は小孔２７を設
けた部分において応力集中を生じることから、折曲下型
あるいはリードをクランプしていなくとも確実に折り曲
がる。Next, cutting and bending will be explained. First, Figure 1 1a
As shown by 1, the lead frame 21 is placed on the support mold 22 and the lower punching mold 24-H. At this time, the lead frame 21 is connected to the guide H1 protruding from both side edges of the lower punching die 24.
The first position is determined by t 29 , 30. Therefore,
The punching blade portion 28 of the upper punching die 26 is lowered to remove the upper die 26.
A lead 25 is formed by the blades at the lower part of both sides of the edge and the lower punching die 24.
is cut from the vicinity of the outer frame 23 of the lead frame 21. Thereafter, as shown in FIG. Since concentration occurs, the bending can be ensured even if the lower mold or lead is not clamped.

日のような実施例によれば、パッケージ部２゜から流出
したガラス流出部３１は締付けられることはないので破
損はしない。また、リード２５の小孔２７部（応力集中
部）でのリード部分はパッケージ部２０のガラス層にク
ラックが入る前に折れ曲がってしまうので、気密性の低
下も生じない。According to this embodiment, the glass outflow portion 31 that has flowed out from the package portion 2° is not tightened and is therefore not damaged. Further, since the lead portion of the lead 25 at the small hole 27 portion (stress concentration portion) is bent before the glass layer of the package portion 20 is cracked, the airtightness does not deteriorate.

なお、本発明は前記実施例に限定されない。すなわち、
第２図に示すように、リードフレームから既に打ち抜き
を行ない、パッケージ部４ｏとこラットな状態のり一ド
４１とからなる半導体装置４２に対し、パッケージ部４
ｏの下面を支える支え型４３と、リード４１の応力集中
部よりも外方の外端部４４を押し下げる折曲型４５とに
よって折り曲げを行なってもよい。この際、前記折曲型
４５の折曲刃４６の内壁面の位置および下降位置によっ
て折曲状態のり一ド４１の形状が決定される。Note that the present invention is not limited to the above embodiments. That is,
As shown in FIG. 2, for a semiconductor device 42 which has already been punched out from a lead frame and consists of a package part 4o and a flat glue 41, a package part 4
The bending may be performed using a support mold 43 that supports the lower surface of the lead 41 and a bending mold 45 that presses down the outer end portion 44 of the lead 41 that is located outside the stress concentration portion. At this time, the shape of the glue 41 in the bent state is determined by the position of the inner wall surface and the lowered position of the bending blade 46 of the bending die 45.

また、リードを折り曲げる際、リードと折曲刃との間に
生じる摩擦によって、リードを介してガラス層に多く力
が加わらないようにするため、第３図（示すように、ロ
ーラ５ｏをリード５１に接触させて折り曲げるようにし
てもよい。これらのローラ５０は上下に移動する折曲型
５２の２つの突片５３，５４にビン５５を介して回転可
能に固定されるとともに、パッケージ部５６から突出す
るり−ド５１の応力集中を起こす位置の外側、すなわち
外端部に臨むような位置にある。なお、５７はパッケー
ジ部５６の下面を支える支え型である。In addition, when bending the reed, in order to prevent a large amount of force from being applied to the glass layer through the reed due to the friction generated between the reed and the bending blade, the roller 5o is These rollers 50 are rotatably fixed to two protrusions 53 and 54 of a bending mold 52 that moves up and down via a bin 55, and are also bent from a package part 56. It is located outside the position where stress concentration occurs on the protruding lead 51, that is, at a position facing the outer end.Note that 57 is a supporting mold that supports the lower surface of the package part 56.

また、本発明では、パッケージ部を上下面でクランプす
るようにしてもよい。Further, in the present invention, the package portion may be clamped at the upper and lower surfaces.

さらに、本発明では、パッケージ部に対してリードを移
動させているが、リードに対してパッケージ部を移動さ
せるようにしてもよい。Further, in the present invention, the leads are moved relative to the package portion, but the package portion may be moved relative to the leads.

以上のように、本発明のガラスセラミックパッケージ型
半導体装置におけるリードの折り曲げ装置によねば、簡
単にリードの折り曲げが行なえるとともＫ、応力集中部
から正確に折り曲げられる。As described above, according to the lead bending device for a glass-ceramic packaged semiconductor device of the present invention, the leads can be easily bent, and the leads can be accurately bent starting from the stress concentration area.

また、本発明によれば、パッケージ部から突出するガラ
ス流出部（ガラス層）を破損させることもないので、ガ
ラス層にクラック等の伊傷も発生せず、気密性の良好な
ガラスセラミックパッケージ型の半導体装置を得ること
ができ、歩留の向上。Further, according to the present invention, the glass outflow part (glass layer) protruding from the package part is not damaged, so no damage such as cracks occurs in the glass layer, and a glass ceramic package type with good airtightness is achieved. It is possible to obtain semiconductor devices and improve yield.

製造原価低減も図れる。Manufacturing costs can also be reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第１図１８１　、　ｌｂｌは本発明のガラスセラミック
パッケージ型半導体装置におけるリードの折曲装置の一
実施例を示す動作図、第２図および第３図は他の実施例
を示す動作説明図、第４図は半完成状態の半導体装置の
平面図、第５図は従来の方法によるリードの折り曲げ方
法の動作説明図である。 １・・・外枠、２・・・内枠、３・・・リード、４・・
・リードフレーム、５・・・小孔、６・・・パッケージ
部、７・・・下型、８・・・上型、９・・・折曲上型、
１０・・・切断下型、１１．１２・・・突条部、１３・
・・流出部、２０・・・パッケージ部、２１・・・リー
ドフレーム、２２・・・支え型、２３・・・外枠、２４
・・・打抜下型、２５・・・リード、２６・・・打抜上
型、２７・・・小孔、２８・・・打抜刃部、２９．３０
・・・ガイド部、３１・・・ガラス流出部、４０・・・
パッケージ部、４１・・・リード、４２・・・半導体装
置、４３・・・支え型、４４・・・外端部、４５・・・
折曲型、４６・・・折曲刃、５０・・・ローラ、５１・
・・リード、５２・・・折曲型、５３．５４・・・突片
、５５・・°ピン、５６・・・パッケージ部、５７・・
・支え型。 第　１　図 第　２　図　第　３　同 第　４　図 第　５　図181, lbl is an operation diagram showing one embodiment of the lead bending device in the glass ceramic package type semiconductor device of the present invention, FIGS. 2 and 3 are operation explanatory diagrams showing other embodiments, and FIGS. FIG. 4 is a plan view of a semiconductor device in a semi-finished state, and FIG. 5 is an explanatory diagram of the operation of a conventional lead bending method. 1...outer frame, 2...inner frame, 3...lead, 4...
・Lead frame, 5... Small hole, 6... Package part, 7... Lower die, 8... Upper die, 9... Bent upper die,
10... Cutting lower mold, 11.12... Protrusion portion, 13.
...Outflow part, 20...Package part, 21...Lead frame, 22...Support type, 23...Outer frame, 24
... Punching lower die, 25... Lead, 26... Punching upper die, 27... Small hole, 28... Punching blade part, 29.30
...Guide part, 31...Glass outflow part, 40...
Package portion, 41...Lead, 42...Semiconductor device, 43...Support type, 44...Outer end portion, 45...
Bending type, 46...Bending blade, 50...Roller, 51.
...Lead, 52...Bending type, 53.54...Protrusion piece, 55...° pin, 56...Package part, 57...
・Support type. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

【特許請求の範囲】 １、封止体の両端に複数のリードが突出した電子部品の
リード折り曲げ装置であって、 （ａｌ　電子部品を載置するための載置台と（ｂｌ　！
Ｊ−ド端部に押圧力を加えた後、除々に内側に押圧力を
加えてリードを所望の形状にするための傾斜面を有する
抑圧体と （ｃｌ　上記載置台と抑圧体の垂直位置を制御するため
の駆動機構と よりなることを特徴とするリード折り曲げ装置。 ２、封止体の両端に複数のリードが突出した電子部品の
リード折り曲げ装置であって。 ｌａｌ　電子部品を載置するための載置台とｆｂｌ　Ｉ
Ｊ−ドのほぼ中央部に押圧力を加えてリードを所望の形
状に加工するための一対のローラとＪｃｌ　上記載Ｉｆ
”７台と一対のローラの垂直位置を制御するための駆動
機構と よりなることをｌＦケ徴とするリード折り曲げ装置。[Scope of Claims] 1. A lead bending device for electronic components having a plurality of leads protruding from both ends of a sealed body, comprising: (al) a mounting table for mounting electronic components; and (bl!).
After applying a pressing force to the end of the J-shaped lead, a pressing force is gradually applied inward to form a desired shape of the lead. A lead bending device characterized by comprising a drive mechanism for control. 2. A lead bending device for electronic components in which a plurality of leads protrude from both ends of a sealing body. lal For placing electronic components. The mounting table and fbl I
A pair of rollers and Jcl for processing the lead into a desired shape by applying a pressing force to approximately the center of the J-de.
``A lead bending device characterized by seven units and a drive mechanism for controlling the vertical position of a pair of rollers.
JP23660284A 1984-11-12 1984-11-12 Bending device for lead Pending JPS60121754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23660284A JPS60121754A (en) 1984-11-12 1984-11-12 Bending device for lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23660284A JPS60121754A (en) 1984-11-12 1984-11-12 Bending device for lead

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1711177A Division JPS53102670A (en) 1977-02-21 1977-02-21 Lead bending method for glass ceramic package type semiconductor device

Publications (1)

Publication Number Publication Date
JPS60121754A true JPS60121754A (en) 1985-06-29

Family

ID=17003074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23660284A Pending JPS60121754A (en) 1984-11-12 1984-11-12 Bending device for lead

Country Status (1)

Country Link
JP (1) JPS60121754A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01262023A (en) * 1988-04-13 1989-10-18 Nippon Inter Electronics Corp Working device for terminal
CN103706730A (en) * 2013-12-20 2014-04-09 河北汉光重工有限责任公司 Integrated block pin forming tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949107A (en) * 1972-09-18 1974-05-13
JPS509267A (en) * 1973-05-30 1975-01-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949107A (en) * 1972-09-18 1974-05-13
JPS509267A (en) * 1973-05-30 1975-01-30

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01262023A (en) * 1988-04-13 1989-10-18 Nippon Inter Electronics Corp Working device for terminal
CN103706730A (en) * 2013-12-20 2014-04-09 河北汉光重工有限责任公司 Integrated block pin forming tool
CN103706730B (en) * 2013-12-20 2015-08-12 河北汉光重工有限责任公司 A kind of integrated pin shaping jig

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