JPS60121729A - 半導体樹脂封止金型 - Google Patents
半導体樹脂封止金型Info
- Publication number
- JPS60121729A JPS60121729A JP22970683A JP22970683A JPS60121729A JP S60121729 A JPS60121729 A JP S60121729A JP 22970683 A JP22970683 A JP 22970683A JP 22970683 A JP22970683 A JP 22970683A JP S60121729 A JPS60121729 A JP S60121729A
- Authority
- JP
- Japan
- Prior art keywords
- runner
- resin
- pressure means
- mold
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
- B29C33/0066—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel with a subdivided channel for feeding the material to a plurality of locations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/006—Degassing moulding material or draining off gas during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22970683A JPS60121729A (ja) | 1983-12-05 | 1983-12-05 | 半導体樹脂封止金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22970683A JPS60121729A (ja) | 1983-12-05 | 1983-12-05 | 半導体樹脂封止金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60121729A true JPS60121729A (ja) | 1985-06-29 |
JPH0426214B2 JPH0426214B2 (enrdf_load_stackoverflow) | 1992-05-06 |
Family
ID=16896418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22970683A Granted JPS60121729A (ja) | 1983-12-05 | 1983-12-05 | 半導体樹脂封止金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60121729A (enrdf_load_stackoverflow) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037400U (enrdf_load_stackoverflow) * | 1973-07-26 | 1975-04-18 | ||
JPS5351256A (en) * | 1976-10-22 | 1978-05-10 | Hitachi Ltd | Mold for forming resin |
-
1983
- 1983-12-05 JP JP22970683A patent/JPS60121729A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037400U (enrdf_load_stackoverflow) * | 1973-07-26 | 1975-04-18 | ||
JPS5351256A (en) * | 1976-10-22 | 1978-05-10 | Hitachi Ltd | Mold for forming resin |
Also Published As
Publication number | Publication date |
---|---|
JPH0426214B2 (enrdf_load_stackoverflow) | 1992-05-06 |
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