JPS60120025A - 成形装置 - Google Patents

成形装置

Info

Publication number
JPS60120025A
JPS60120025A JP58226934A JP22693483A JPS60120025A JP S60120025 A JPS60120025 A JP S60120025A JP 58226934 A JP58226934 A JP 58226934A JP 22693483 A JP22693483 A JP 22693483A JP S60120025 A JPS60120025 A JP S60120025A
Authority
JP
Japan
Prior art keywords
molding
sound wave
molding material
mold
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58226934A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410412B2 (enrdf_load_stackoverflow
Inventor
Kiyoshi Inoue
潔 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP58226934A priority Critical patent/JPS60120025A/ja
Publication of JPS60120025A publication Critical patent/JPS60120025A/ja
Publication of JPH0410412B2 publication Critical patent/JPH0410412B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/768Detecting defective moulding conditions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP58226934A 1983-12-02 1983-12-02 成形装置 Granted JPS60120025A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58226934A JPS60120025A (ja) 1983-12-02 1983-12-02 成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58226934A JPS60120025A (ja) 1983-12-02 1983-12-02 成形装置

Publications (2)

Publication Number Publication Date
JPS60120025A true JPS60120025A (ja) 1985-06-27
JPH0410412B2 JPH0410412B2 (enrdf_load_stackoverflow) 1992-02-25

Family

ID=16852894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58226934A Granted JPS60120025A (ja) 1983-12-02 1983-12-02 成形装置

Country Status (1)

Country Link
JP (1) JPS60120025A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4723899A (en) * 1984-11-12 1988-02-09 Michio Osada Molding apparatus for enclosing semiconductor chips with resin
JPS63111025A (ja) * 1986-10-30 1988-05-16 Ube Ind Ltd 射出条件のモニタ方法
JP2013529148A (ja) * 2010-06-07 2013-07-18 ゾイテ、ウルリッヒ 射出成形プロセスを監視かつ最適化するための方法および装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5549983A (en) * 1978-10-02 1980-04-11 Shinko Electric Co Ltd Transistor inverter
JPS5561363A (en) * 1978-10-26 1980-05-09 Nl Industries Inc Projection ram control
JPS58215319A (ja) * 1982-06-10 1983-12-14 Hitachi Ltd 圧縮成形金型
JPS59138427A (ja) * 1983-01-31 1984-08-08 Hitachi Ltd 射出圧縮成形金型
JPS60247511A (ja) * 1984-05-23 1985-12-07 Mitsukazu Hori 金型内のプラスチツクの検出法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5549983A (en) * 1978-10-02 1980-04-11 Shinko Electric Co Ltd Transistor inverter
JPS5561363A (en) * 1978-10-26 1980-05-09 Nl Industries Inc Projection ram control
JPS58215319A (ja) * 1982-06-10 1983-12-14 Hitachi Ltd 圧縮成形金型
JPS59138427A (ja) * 1983-01-31 1984-08-08 Hitachi Ltd 射出圧縮成形金型
JPS60247511A (ja) * 1984-05-23 1985-12-07 Mitsukazu Hori 金型内のプラスチツクの検出法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4723899A (en) * 1984-11-12 1988-02-09 Michio Osada Molding apparatus for enclosing semiconductor chips with resin
JPS63111025A (ja) * 1986-10-30 1988-05-16 Ube Ind Ltd 射出条件のモニタ方法
JP2013529148A (ja) * 2010-06-07 2013-07-18 ゾイテ、ウルリッヒ 射出成形プロセスを監視かつ最適化するための方法および装置

Also Published As

Publication number Publication date
JPH0410412B2 (enrdf_load_stackoverflow) 1992-02-25

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