JPH0410412B2 - - Google Patents
Info
- Publication number
- JPH0410412B2 JPH0410412B2 JP58226934A JP22693483A JPH0410412B2 JP H0410412 B2 JPH0410412 B2 JP H0410412B2 JP 58226934 A JP58226934 A JP 58226934A JP 22693483 A JP22693483 A JP 22693483A JP H0410412 B2 JPH0410412 B2 JP H0410412B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- molding material
- cylinder
- mold
- detection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/768—Detecting defective moulding conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58226934A JPS60120025A (ja) | 1983-12-02 | 1983-12-02 | 成形装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58226934A JPS60120025A (ja) | 1983-12-02 | 1983-12-02 | 成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60120025A JPS60120025A (ja) | 1985-06-27 |
| JPH0410412B2 true JPH0410412B2 (enrdf_load_stackoverflow) | 1992-02-25 |
Family
ID=16852894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58226934A Granted JPS60120025A (ja) | 1983-12-02 | 1983-12-02 | 成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60120025A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4723899A (en) * | 1984-11-12 | 1988-02-09 | Michio Osada | Molding apparatus for enclosing semiconductor chips with resin |
| JPS63111025A (ja) * | 1986-10-30 | 1988-05-16 | Ube Ind Ltd | 射出条件のモニタ方法 |
| DE202010007655U1 (de) * | 2010-06-07 | 2011-09-08 | Ulrich Seuthe | Vorrichtung zur Überwachung und Optimierung von Spritzgießprozessen |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5915272B2 (ja) * | 1978-10-02 | 1984-04-09 | 神鋼電機株式会社 | トランジスタインバ−タ |
| US4252176A (en) * | 1978-10-26 | 1981-02-24 | Nl Industries, Inc. | Injection ram control |
| JPS58215319A (ja) * | 1982-06-10 | 1983-12-14 | Hitachi Ltd | 圧縮成形金型 |
| JPS59138427A (ja) * | 1983-01-31 | 1984-08-08 | Hitachi Ltd | 射出圧縮成形金型 |
| JPS60247511A (ja) * | 1984-05-23 | 1985-12-07 | Mitsukazu Hori | 金型内のプラスチツクの検出法 |
-
1983
- 1983-12-02 JP JP58226934A patent/JPS60120025A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60120025A (ja) | 1985-06-27 |
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