JPS60116235U - semiconductor manufacturing equipment - Google Patents
semiconductor manufacturing equipmentInfo
- Publication number
- JPS60116235U JPS60116235U JP293084U JP293084U JPS60116235U JP S60116235 U JPS60116235 U JP S60116235U JP 293084 U JP293084 U JP 293084U JP 293084 U JP293084 U JP 293084U JP S60116235 U JPS60116235 U JP S60116235U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- manufacturing equipment
- solvent
- nozzle
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来の半導体製造装置（液塗布装置
）の−例を示す側面図及び平面図、第３図及び第４図は
本考案の一実施例を示す各動作状態の要部断面側面図、
第５図６１第３図における部分拡大斜視図である。
１・・・・・・単導体ウェーハ、６・曲・ノズル、７・
・曲溶剤蒸気室、９・・・・・・塗布液、１０・・・・
・・液吹出口、１２・・・・・・溶剤（アルコール）。
第３図
第５図1 and 2 are a side view and a plan view showing an example of a conventional semiconductor manufacturing apparatus (liquid coating apparatus), and FIGS. 3 and 4 are main points of each operating state showing an embodiment of the present invention. Sectional side view,
Figure 5 61 is a partially enlarged perspective view of Figure 3; 1... Single conductor wafer, 6. Curved nozzle, 7.
- Flexible solvent vapor chamber, 9... Coating liquid, 10...
...Liquid outlet, 12...Solvent (alcohol). Figure 3 Figure 5
Claims (1)
ェーハ上に供給して全面塗布する装置において前記ノズ
ルを少なくともその先端の液吹出口が液吹出作業中断時
に前記溶剤の蒸気雰囲気中に晒されるよう溶剤蒸気室に
出入り可能に設置し、たことを特徴とする半導体製造装
置。In an apparatus for supplying a coating liquid containing a solvent such as alcohol from a nozzle onto a semiconductor wafer to coat the entire surface, the nozzle is supplied with a solvent such that at least the liquid outlet at the tip of the nozzle is exposed to the vapor atmosphere of the solvent when the liquid blowing operation is interrupted. Semiconductor manufacturing equipment characterized by being installed in a steam room so that it can be accessed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP293084U JPS60116235U (en) | 1984-01-12 | 1984-01-12 | semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP293084U JPS60116235U (en) | 1984-01-12 | 1984-01-12 | semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60116235U true JPS60116235U (en) | 1985-08-06 |
Family
ID=30477069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP293084U Pending JPS60116235U (en) | 1984-01-12 | 1984-01-12 | semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116235U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226668A (en) * | 1988-07-13 | 1990-01-29 | Hitachi Ltd | Coating apparatus |
| JP2017103368A (en) * | 2015-12-02 | 2017-06-08 | 東京エレクトロン株式会社 | Coating liquid supply device, coating method and storage medium |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57135066A (en) * | 1981-02-14 | 1982-08-20 | Tatsumo Kk | Rotary applying machine |
-
1984
- 1984-01-12 JP JP293084U patent/JPS60116235U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57135066A (en) * | 1981-02-14 | 1982-08-20 | Tatsumo Kk | Rotary applying machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226668A (en) * | 1988-07-13 | 1990-01-29 | Hitachi Ltd | Coating apparatus |
| JP2017103368A (en) * | 2015-12-02 | 2017-06-08 | 東京エレクトロン株式会社 | Coating liquid supply device, coating method and storage medium |
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