JPS60115389A - Laser working device - Google Patents
Laser working deviceInfo
- Publication number
- JPS60115389A JPS60115389A JP58223306A JP22330683A JPS60115389A JP S60115389 A JPS60115389 A JP S60115389A JP 58223306 A JP58223306 A JP 58223306A JP 22330683 A JP22330683 A JP 22330683A JP S60115389 A JPS60115389 A JP S60115389A
- Authority
- JP
- Japan
- Prior art keywords
- speed
- laser
- attenuator
- laser light
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はレーザ加工装置に係り、特に表面熱処理を行う
装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a laser processing apparatus, and particularly to an apparatus for performing surface heat treatment.
レーザ光を例えば電磁鋼板の表面に鋼板の結晶組織の細
分化を生ぜしめる照射を行い鉄損を減少させる加工が実
用化されつつある。このような表面熱処理加工には、通
常Nd : YAGロッドを連続励起し、高速なQスイ
ッチパルスを発生するYAGレーザが用いられている。Processing that reduces core loss by irradiating the surface of an electrical steel sheet with, for example, a laser beam that causes the crystal structure of the steel sheet to become finely divided is being put into practical use. Such surface heat treatment usually uses a YAG laser that continuously excites the Nd:YAG rod and generates high-speed Q-switch pulses.
ところで、Qスイッチパルスの繰り返し速度はQスイッ
チの電気的駆動周波数で設定されるが、この周波数が1
0 KHz以上になると、レーザ光であるパルス出力が
不安定になることが観測されており、そのようなレーザ
光を使って表面熱処理を行うと、照射部にはレーザパル
ス毎に異なる熱が人や、不均一な熱処理しか実現されな
い欠点があり、また10KHz以下の比較的安定な出力
領域では表面処理速度が制限され非能率になってし・壕
う不都合があった。一方、加工条件によって、レーザ光
の照射パワーを変えた9゜照射スポットの間隔を変化さ
せねばならない場合にはパルスの発振繰り返し率を大幅
に変える必要がある。照射加工条件の最適化をはかるに
当ってレーザ発振出力の安定化は実験的にレーザロッド
の光励起条件で狭い範囲にあることが判明し、広範囲の
出力条件下での安定化が困難であり、この点が実用上の
欠点となっている。By the way, the repetition rate of the Q switch pulse is set by the electrical drive frequency of the Q switch, but if this frequency is 1
It has been observed that the pulse output of laser light becomes unstable when the frequency exceeds 0 KHz, and when surface heat treatment is performed using such laser light, the irradiated area receives different heat depending on the laser pulse. In addition, in a relatively stable output range of 10 KHz or less, the surface treatment speed is limited, resulting in inefficiency. On the other hand, if it is necessary to change the interval between 9° irradiation spots by changing the irradiation power of the laser beam depending on processing conditions, it is necessary to significantly change the pulse oscillation repetition rate. When trying to optimize the irradiation processing conditions, it was experimentally found that the laser oscillation output was stabilized within a narrow range depending on the optical excitation conditions of the laser rod, and it was difficult to stabilize it under a wide range of output conditions. This point is a practical drawback.
本発明はパルス繰り返し速度を大幅に変化しても安定な
レーザ出力で加工できる装置を提供することを目的とす
る。An object of the present invention is to provide an apparatus that can perform processing with stable laser output even if the pulse repetition rate is changed significantly.
レーザ光のエネルギを制御する減衰器を設け。 An attenuator is installed to control the energy of the laser beam.
被加工物の移動速度に比例して制御されたパルス繰り返
し速度に比例して上記減衰器によりレーザ光のエネルギ
を調整することにより、被加工物の照射条件の変化に対
応して安定なレーザ出力で加工が行えるようにしたもの
である。By adjusting the laser beam energy using the above attenuator in proportion to the pulse repetition rate, which is controlled in proportion to the moving speed of the workpiece, stable laser output can be achieved in response to changes in the irradiation conditions of the workpiece. It is designed so that processing can be performed with.
以下、本発明を実施例を示す図面に基いて説明する。 Hereinafter, the present invention will be explained based on drawings showing examples.
t41図は本発明の一実施例を示すもので、レーザ発振
部(1)と、とのレーザ発振部(1)から放出されるレ
ーザ光(L)を走査する走査部(2)と、被加工物(3
)を移動させる移動部(4)と、上記レーザ発振部(1
)の発振パルスおよびレーザ光のエネルギ強度を制御す
る制御部(5)および上記レーザ光(L)のエネルギ強
度を変化させる減衰器(6)とで構成されている。Figure t41 shows an embodiment of the present invention, which includes a laser oscillation section (1), a scanning section (2) that scans the laser beam (L) emitted from the laser oscillation section (1), and a scanning section (2) that scans the laser beam (L) emitted from the laser oscillation section (1). Processed product (3
) and a moving unit (4) that moves the laser oscillation unit (1).
) and an attenuator (6) that changes the energy intensity of the laser beam (L).
上記レーザ発振部(1)は集光反射鏡(7)内にNd
、 YAG等からなるレーザロット責8)と、このレー
ザロッド′ を両側から励起する形に配置された励起ラ
ンプ(9a)、 (9b)とを収納し、レーザロッド(
8)の軸線上に配置された光共振器鏡(10a)、 (
1ob)内に、例えば超音波式のQスイッチ素子(11
)を設けた固体レーザ見損装置からなっている。なおα
3は励起ランプ(8a)、 (8b)用の電源である。The laser oscillation section (1) has Nd inside the condensing reflector (7).
, YAG, etc., and excitation lamps (9a) and (9b) arranged to excite this laser rod from both sides.
8), an optical resonator mirror (10a) arranged on the axis of (
For example, an ultrasonic Q-switch element (11
) consists of a solid-state laser blinding device. Note that α
3 is a power source for the excitation lamps (8a) and (8b).
走査部(2)はレーザ光(L)を被加工物(3)の方向
へ偏向し一定振幅で振動する可変光学系(13と上記偏
向され一定振幅で振動するレーザ光(La )の光路上
に設けられる集光レンズ(14Jとで構成されている。The scanning unit (2) deflects the laser beam (L) in the direction of the workpiece (3) and is connected to a variable optical system (13) that vibrates with a constant amplitude and on the optical path of the deflected laser beam (La) that vibrates with a constant amplitude. It consists of a condensing lens (14J) provided in the
また移動部(4)は被加工物(3)を載せ矢印方向に移
動させるために駆動部(1最で回転される多数の移動ロ
ーラ(IIと上記移動の速度を検出する速度検出器(1
7)を備えている。制御部(5)は速度検出器Q7)の
検出信号を入力して制御信号を出力する信号制御部(1
樟と、この信号制御部(由からの出力信号によりQスイ
ッチ素子aυの繰り返し速度を変化させる速度−周波数
変換器(IIおよびドライバ(噂と、同じく信号制御部
霞からの出力信号によ如減衰器(6)を駆動する駆動部
(21)とで構成されている。なお、減衰器(6)は一
方の光共振器鏡(10b)と可変光学系(131との間
に設けられ、角度の変化によって透過率が変化したり、
透過率が異なる部分をもつような例えばガラス製の円板
体のような周知のものからなっている。In addition, the moving part (4) includes a drive part (1) to move the workpiece (3) in the direction of the arrow, a large number of moving rollers (II), and a speed detector (1) that detects the speed of the movement.
7). The control unit (5) is a signal control unit (1) that inputs the detection signal of the speed detector Q7) and outputs a control signal.
Camphor, a speed-frequency converter (II) that changes the repetition rate of the Q-switch element aυ by the output signal from this signal control section (Yu), and a driver (rumored that it also attenuates by the output signal from the signal control section Kasumi) The attenuator (6) is provided between one optical resonator mirror (10b) and the variable optical system (131), and the attenuator (6) is provided between one optical resonator mirror (10b) and the variable optical system (131), and Transmittance changes due to changes in
It is made of a well-known material such as a glass disk having portions with different transmittances.
以上の構成の作用について第2図にて説明する。The operation of the above configuration will be explained with reference to FIG.
第2図において同図(a)に示すように、被加工物(3
)が時刻t1の間比較的遅い速度(vl)で移動し1時
刻t、ではより速い、速度■、で移動すると仮定すると
、速度検出器(17)で得た信号を速度−周波数変換器
Qlによって上記それぞれ速度に対応させるために、パ
ルス繰り返し周期は時刻t、の間は低速縁や返し周期T
、とし、時刻t、の間は高速縁9返し周期T、となるよ
うにドライバ(21)によりQスイッチパルスを発生さ
せる。この際励起ランプ(9a)、 (9b) ハパル
ス繰り返し動作の範囲内でパルスが安′定して立ち上が
り、かつピーク出力も安定な出力□となる条件の下で発
振させておく。この安定動作の光ボンピング条件下では
任意のパルス条件と、繰り返し速度条件は任意条件に設
定できないために、減衰器(6)を駆動部(21)によ
り駆動し第2図(c)に示すように時刻t1では透過率
TR1,時刻t、では透過率TR2(ここでTRI >
TR1)となるように減衰量を変化させレーザ光(L
)を透゛過させる。このことにより、可変光学系(13
で走査されるレーザ光(La)は第2図(d)に示すよ
うに被加工物(3)の移動速度に応じた適切なパルス幅
とパルス幅に関係なくほぼ一定の出力パワーとするこ゛
とができる。In Fig. 2, as shown in Fig. 2(a), the workpiece (3
) moves at a relatively slow speed (vl) during time t1, and at time t, moves at a faster speed . In order to correspond to the respective speeds mentioned above, the pulse repetition period is at time t, and the low speed edge and return period T
, and the Q-switch pulse is generated by the driver (21) so that the high-speed edge 9 return period T is obtained during time t. At this time, the excitation lamps (9a) and (9b) are allowed to oscillate under the conditions that the pulse rises stably within the range of Ha-pulse repetitive operation and that the peak output is also a stable output □. Under this optical bombing condition of stable operation, it is not possible to set arbitrary pulse conditions and repetition rate conditions, so the attenuator (6) is driven by the driver (21) as shown in FIG. 2(c). At time t1, the transmittance is TR1, and at time t, the transmittance is TR2 (where TRI >
The amount of attenuation is changed so that the laser beam (L
) to pass through. This allows the variable optical system (13
The laser beam (La) scanned by the laser beam should have an appropriate pulse width depending on the moving speed of the workpiece (3) and an almost constant output power regardless of the pulse width, as shown in Fig. 2(d). I can do it.
以上説明したように、レーザ発振器のQスイッチパルス
出力の各パルス出力を被加工物の移動速度条件に適合し
たパルス繰シ返し速度の範囲内となる条件にし、この条
件下で安定出力が得られるように励起入力、・共振条件
を定めて発振させレーザ光を出力した後、低速パルス繰
り返し条件のレーザ出力を高速パルス繰り返し条件のそ
れに合わせるべく減衰器で調整する構成にしたので、加
工条件が変っても被加工物に対して常に一定のレーザ出
力で加工することができ、安定度の高いレーザ加工が行
えるようになった。したがって例えば半導体材料の表面
にレーザ光を照射してアニール処理やゲッタリングを行
うに当っても広い面積を所望の加工速度で均一処理でき
、また電磁鋼板のレーザ光による熱処理に当っても電磁
鋼板の移動速度に対処して均一な熱処理を行うことがで
きるようになった。As explained above, each pulse output of the Q-switch pulse output of the laser oscillator is set to be within the range of pulse repetition rate that matches the moving speed conditions of the workpiece, and stable output can be obtained under this condition. After setting the excitation input and resonance conditions to oscillate and output the laser beam, the laser output under the low-speed pulse repetition condition is adjusted using an attenuator to match that under the high-speed pulse repetition condition, so that the machining conditions can be changed. It is now possible to process the workpiece with a constant laser output at all times, making it possible to perform highly stable laser processing. Therefore, for example, when performing annealing treatment or gettering by irradiating the surface of a semiconductor material with laser light, a wide area can be processed uniformly at a desired processing speed, and when heat treating an electrical steel sheet with laser light, the electrical steel sheet can be heated. It is now possible to perform uniform heat treatment by adjusting the moving speed of the
なお、減衰器は透過性のものばかりでなく、超音波変調
セル、可変開口板、可変透過率をもったフィルタ、その
他多数の透過穴をもった減光板でもよい。また、可変光
学系は振動式の反射鏡以外に多面体回転鏡でも実施でき
る。Note that the attenuator is not limited to a transmissive one, and may also be an ultrasonic modulation cell, a variable aperture plate, a filter with variable transmittance, or a light attenuation plate having a large number of transmission holes. Further, the variable optical system can be implemented with a polyhedral rotating mirror instead of a vibrating reflecting mirror.
第1図は本発明の一実施例を示す構成図、第2図は動作
の説明図である。
(1)・・・レーザ発振部 (2)・・・走査部(4)
・・・移動部 (5)・・・制御部(6)・・・減衰器
代理人 弁理士 則 近 憲 佑
(ほか1名)
+ 1
■l
、−1
に−1
−」
ハ /++/′+ ρ
CO工〕 Q ℃
lFIG. 1 is a configuration diagram showing an embodiment of the present invention, and FIG. 2 is an explanatory diagram of the operation. (1)...Laser oscillation section (2)...Scanning section (4)
...Movement part (5)...Control part (6)...Attenuator agent Patent attorney Noriyuki Chika (and 1 other person) + 1 ■l, -1 to -1 -'' Ha /++/ ′+ ρ CO engineering〕 Q ℃ l
Claims (2)
ーザ発振部と、この固体レーザ発振部から放出されたレ
ーザ光を被加工物上に集光走査する走査部と、上記被加
工物を上記レーザ光忙対して相対的に移動させる移動部
と、この移動部の移動速度に比例的に上記Qスイッチパ
ルスのパルス繰す返し速度を制御する制御部と、上記パ
ルス繰り返し速度に比例して上記レーザ光の出力を調整
する減衰器とを備えることを特徴とするレーザ加工装置
。(1) A solid-state laser oscillation unit having a Q switch for high-speed edge 9-turn pulses, a scanning unit that condenses and scans the laser beam emitted from the solid-state laser oscillation unit onto a workpiece, and a moving part that moves the laser beam relative to the laser beam; a control part that controls the pulse repetition rate of the Q-switch pulse in proportion to the moving speed of the moving part; A laser processing device comprising: an attenuator that adjusts the output of laser light.
なった出力で放出されるレーザ光の高出力側を低出力側
に近接する減衰量に設定されることを特徴とする特許請
求の範囲第1項記載のレーザ加工装置。(2) Claims characterized in that the attenuator is set to an amount of attenuation that brings the high output side of the laser beam emitted at different outputs close to the low output side in response to changes in the pulse repetition rate. The laser processing device according to item 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58223306A JPS60115389A (en) | 1983-11-29 | 1983-11-29 | Laser working device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58223306A JPS60115389A (en) | 1983-11-29 | 1983-11-29 | Laser working device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60115389A true JPS60115389A (en) | 1985-06-21 |
Family
ID=16796078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58223306A Pending JPS60115389A (en) | 1983-11-29 | 1983-11-29 | Laser working device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60115389A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0468117A2 (en) * | 1990-07-26 | 1992-01-29 | Masahiro Seki | Laser beam machining device |
-
1983
- 1983-11-29 JP JP58223306A patent/JPS60115389A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0468117A2 (en) * | 1990-07-26 | 1992-01-29 | Masahiro Seki | Laser beam machining device |
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