JPS60113450A - 外部リ−ド端子の接合構造 - Google Patents
外部リ−ド端子の接合構造Info
- Publication number
- JPS60113450A JPS60113450A JP58221785A JP22178583A JPS60113450A JP S60113450 A JPS60113450 A JP S60113450A JP 58221785 A JP58221785 A JP 58221785A JP 22178583 A JP22178583 A JP 22178583A JP S60113450 A JPS60113450 A JP S60113450A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead terminal
- external lead
- layer
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H10W70/657—
-
- H10W90/754—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58221785A JPS60113450A (ja) | 1983-11-24 | 1983-11-24 | 外部リ−ド端子の接合構造 |
| DE19843442809 DE3442809A1 (de) | 1983-11-24 | 1984-11-23 | Verbundstruktur eines externen leitungsanschlusses und verfahren zur herstellung desselben |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58221785A JPS60113450A (ja) | 1983-11-24 | 1983-11-24 | 外部リ−ド端子の接合構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60113450A true JPS60113450A (ja) | 1985-06-19 |
Family
ID=16772161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58221785A Pending JPS60113450A (ja) | 1983-11-24 | 1983-11-24 | 外部リ−ド端子の接合構造 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS60113450A (cg-RX-API-DMAC10.html) |
| DE (1) | DE3442809A1 (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61244057A (ja) * | 1985-04-22 | 1986-10-30 | Ngk Spark Plug Co Ltd | 端子接続構造およびその接続方法 |
-
1983
- 1983-11-24 JP JP58221785A patent/JPS60113450A/ja active Pending
-
1984
- 1984-11-23 DE DE19843442809 patent/DE3442809A1/de active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61244057A (ja) * | 1985-04-22 | 1986-10-30 | Ngk Spark Plug Co Ltd | 端子接続構造およびその接続方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3442809A1 (de) | 1985-06-05 |
| DE3442809C2 (cg-RX-API-DMAC10.html) | 1993-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4577056A (en) | Hermetically sealed metal package | |
| US4839716A (en) | Semiconductor packaging | |
| US4656499A (en) | Hermetically sealed semiconductor casing | |
| US4784974A (en) | Method of making a hermetically sealed semiconductor casing | |
| US4266090A (en) | All metal flat package | |
| JPH03225854A (ja) | 半導体デバイス及びその製造方法 | |
| US5055911A (en) | Semiconductor device package utilizing a solder flow prevention wall | |
| JPS60113450A (ja) | 外部リ−ド端子の接合構造 | |
| JP2750248B2 (ja) | 半導体素子収納用パッケージ | |
| JPS5933851A (ja) | 気密封止半導体容器 | |
| JPS5936425B2 (ja) | 中間層を有するリ−ドフレ−ム構造 | |
| JP2883235B2 (ja) | 半導体素子収納用パッケージ | |
| JP3716186B2 (ja) | 光半導体素子収納用パッケージ | |
| JP2750232B2 (ja) | 電子部品収納用パッケージ | |
| JP2873105B2 (ja) | 半導体素子収納用パッケージ | |
| JP2670208B2 (ja) | 半導体素子収納用パッケージ | |
| JP2813072B2 (ja) | 半導体素子収納用パッケージ | |
| JPS635238Y2 (cg-RX-API-DMAC10.html) | ||
| JP2710893B2 (ja) | リード付き電子部品 | |
| JPH0341475Y2 (cg-RX-API-DMAC10.html) | ||
| JP2685159B2 (ja) | 電子部品収納用パッケージ | |
| JP2813073B2 (ja) | 半導体素子収納用パッケージ | |
| JP2784094B2 (ja) | 半導体素子収納用パッケージ | |
| JP3020783B2 (ja) | 半導体素子収納用パッケージ | |
| JP3176246B2 (ja) | 半導体素子収納用パッケージ |