JPS60112875A - Paste for protective sheet, and surface-protected synthetic resin molded article using the same - Google Patents

Paste for protective sheet, and surface-protected synthetic resin molded article using the same

Info

Publication number
JPS60112875A
JPS60112875A JP58221083A JP22108383A JPS60112875A JP S60112875 A JPS60112875 A JP S60112875A JP 58221083 A JP58221083 A JP 58221083A JP 22108383 A JP22108383 A JP 22108383A JP S60112875 A JPS60112875 A JP S60112875A
Authority
JP
Japan
Prior art keywords
synthetic resin
partially saponified
polyvinyl acetate
protective sheet
resin molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58221083A
Other languages
Japanese (ja)
Inventor
Norihisa Kusakawa
草川 紀久
Suehiro Tayama
田山 末広
Hidenobu Shinohara
篠原 秀伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP58221083A priority Critical patent/JPS60112875A/en
Publication of JPS60112875A publication Critical patent/JPS60112875A/en
Pending legal-status Critical Current

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  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To provide a paste for the bonding of a synthetic resin plate and a protective sheet, having moderate adhesive strength, by adding an acrylic emulsion and a boron compound at a specific ratio to an aqueous solution containing a specific amount of partially saponified polyvinyl acetate. CONSTITUTION:The objective paste can be produced by adding (A) an acrylic emulsion and (B) a boron compound to (C) an aqueous solution containing 3- 15(wt)% partially saponified polyvinyl acetate. The amounts of the components A and B are 1-200% and 0.01-20% based on the solid component of the partially saponified polyvinyl acetate in the component C. The paste is applied to a synthetic resin plate, a protective sheet is attached thereto, and the laminate is formed to a desired form to obtain a formed product of a surface-protected synthetic resin. EFFECT:The surface-protected synthetic resin plate manufactured by the use of the objective paste is free from optical strain in thermal drawing process, and surface roughening and cracking in bending under heating.

Description

【発明の詳細な説明】 (イ)技術分野 本発明は、表面保護シート用糊剤及びそれを用いた表面
保護合成樹脂成形品に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to a glue for surface protection sheets and a surface protection synthetic resin molded product using the same.

(ロ)従来技術 合成樹脂は軽くて、加工しやすい等の性質を有している
ために、その特性を生かして種々の用途に広く使用され
ている。しかし、合成樹脂は表面が軟かいために、その
成形品を輸送、保管または成形加工する等の各段階で無
用の傷がつき易く、商品価値を低減せしめる欠点を有し
ている。
(B) Prior Art Synthetic resins have properties such as being light and easy to process, so they are widely used in a variety of applications by taking advantage of these properties. However, since the synthetic resin has a soft surface, the molded product is easily damaged by unnecessary scratches during transportation, storage, molding, etc., and has the drawback of reducing its commercial value.

この表面保護のために、通審クラフト紙の如き紙状シー
トを水溶性糊剤、例えばポリビニルアセテート部分ケン
化物水l容液、でんぷん糊なとで樹脂板に貼り付けるか
、天然コム等の粘着剤を塗布した感圧性保護紙を圧着す
るか、あるいは感圧接着性若しくは感熱接着性合成高分
子保護フィルムを貼りイ」りているのが現状である。
To protect the surface, a paper-like sheet such as kraft paper is pasted on the resin board with a water-soluble glue, such as a 1 volume solution of partially saponified polyvinyl acetate, or starch glue, or an adhesive such as natural com is used to protect the surface. At present, pressure-sensitive protective paper coated with a chemical agent is pressure-bonded, or a pressure-sensitive adhesive or heat-sensitive synthetic polymer protective film is pasted.

しかし、高分子フィルムや天然ゴム等を用いた感圧性保
護シー)・は接着力が強いためサイズの大きい物を取り
扱う場合剥離作業性が悪く、剥離時に合成樹脂板か4(
シミし、表面にごみ等を吸着しやすくなり、またこのた
め成形加」二時に表面が傷つく等のトラブルを生じ易く
、また価格も高い。
However, pressure-sensitive protective sheets (made of polymer films, natural rubber, etc.) have strong adhesion, so when handling large objects, peeling is difficult.
It stains and tends to attract dust and the like to the surface, and as a result, problems such as damage to the surface during molding are likely to occur, and the price is high.

一方、水l容性糊剤を用いたクラフト紙の如き紙状シー
トて被覆する場合は前述の高分子フィルムや天然コj1
を用いた場合のようなトラブルは避けられ価格も安いと
いう利点がある。
On the other hand, when covering with a paper-like sheet such as kraft paper using a water-soluble adhesive, the above-mentioned polymer film or natural
It has the advantage of avoiding the troubles that would occur when using , and being cheaper.

その反面、糊剤の接着力が弱すぎたり、保護ソートを合
成樹脂板より剥離した際に合成樹脂板表面に保護ソート
の…iJVや糊剤の皮膜が付着残留(以下、「糊残り」
と称する。、契 したりすることがある。$1j1残り
のある場合は、これを水或いはアルコール類で十分に洗
い落とすことが必要になり、洗い落としが不完全の状態
で樹脂板を加熱成形すると、その汚染部分が樹脂板の平
滑性、透明性を損ない、加熱成形後に水或いはアルコー
ル類で洗浄してももはや汚染は消えなくなり樹脂板の表
面を研摩する必要がでてくる。また接着剤などにより汚
染されている樹脂板をそのままスクリーン印刷又は写真
印刷等の印刷を施すと汚染部は印刷インキと樹脂板との
接着性か不良となりその部分は容易に脱落する事がある
。 、 また、接着力が弱ずきると合成樹脂板の輸送過程におい
て保護紙が剥離して合成樹脂板に傷か入ったり、シート
の製造後の切断時においてシートのエツジ部の保護紙か
剥離し、そごに切断時に発生ずる切粉が入りシートの保
管中に押し傷をつけることになりその商品価値を大きく
損なうことになる。従って、保護シートに塗るべき糊剤
は剥離したとき合成樹脂板上に糊残りを生しさせないこ
と、適度な接着強度を右することが必要である。
On the other hand, if the adhesive strength of the glue is too weak, or if the protective sort is peeled off from the synthetic resin board, a film of the protective sort, iJV, or glue may remain on the surface of the synthetic resin board (hereinafter referred to as "adhesive residue").
It is called. , and may make a contract. $1j1 If there is any remaining residue, it is necessary to thoroughly wash it off with water or alcohol. If the resin plate is heated and molded with incomplete washing, the contaminated area will affect the smoothness and transparency of the resin plate. Even if washed with water or alcohol after hot molding, the contamination will no longer disappear, and the surface of the resin plate will need to be polished. Furthermore, if a resin plate contaminated with an adhesive or the like is subjected to printing such as screen printing or photo printing as it is, the adhesiveness between the printing ink and the resin plate may be poor in the contaminated area, and the area may easily fall off. In addition, if the adhesive strength weakens, the protective paper may peel off during the transport process of the synthetic resin board, causing damage to the synthetic resin board, or the protective paper on the edges of the sheet may peel off when cutting the sheet after manufacturing. Chips generated during cutting enter the edges and cause damage to the sheet during storage, greatly reducing its commercial value. Therefore, the adhesive applied to the protective sheet must not leave any adhesive residue on the synthetic resin plate when it is peeled off, and must have appropriate adhesive strength.

また、加工段階での合成樹脂板のtfif萬を防くため
保護シートを合成樹脂板に貼りつけたままで加熱折り曲
げ加工等を行なうことがあるが、この際使用する糊剤の
種類、及び樹脂の種類によっては棒ヒーターを直接接触
する折り曲げ部分に肌荒れ又は/及びクランキングが生
しることがあり、この場合外観を−とシ<10ない加工
品の商品価値を大きく低下させてしまう。
In addition, in order to prevent TFIF of the synthetic resin board during the processing stage, heating and bending may be performed with the protective sheet still attached to the synthetic resin board, but the type of glue used and the resin Depending on the type, rough skin and/or cranking may occur at the bent portion that comes into direct contact with the rod heater, and in this case, the commercial value of the processed product with poor appearance will be greatly reduced.

水溶性糊剤としてポリビニルアセテート部分ケン化物を
用いた糊剤は糊残りがほとんどない優れた糊剤であるが
、接着強度が概して低いこと、前述の棒ヒーターによる
加熱折り曲げ成形を行なうとその折り曲げ部分に肌荒れ
及びクランキングが発生ずるというy11点があり、こ
れらの改善が強く要望されていた。
A sizing agent using partially saponified polyvinyl acetate as a water-soluble sizing agent is an excellent sizing agent that leaves almost no adhesive residue. There was a point y11 in which rough skin and cranking occurred, and there was a strong demand for improvements in these areas.

また、ポリビニルアセテート部分ケン化物を用いた糊剤
を使用した場合ブロー成形又は真空成形等の工程におい
て合成樹脂板が加熱延伸されたとき延伸斑による光学歪
が発生し、そのため出来あがった加工品の外観を著しく
+iない商品価値を大きく低下させてしまうのでその改
善が強く要望されている。
In addition, when a sizing agent using partially saponified polyvinyl acetate is used, optical distortion occurs due to stretching unevenness when the synthetic resin plate is heated and stretched during the blow molding or vacuum forming process, and as a result, optical distortion occurs in the finished product. There is a strong demand for improvement as it significantly reduces the appearance and product value.

(ハ)発明の目的 本発明の目的は、上述のような従来技術に鑑み、適度の
接着強度を有し、ポリビニルアセテート部分ケン化物に
起因する光学歪の発生を大きく抑制ないし消滅させ、し
かも、棒ヒーター接触部の折り曲げ部分の肌荒れ及びク
ランキングの発生を防止できる、ポリビニルアセテート
部分ケン化物水溶液を主剤とする保護シート用糊剤を提
供するにある。
(c) Object of the Invention In view of the above-mentioned prior art, the object of the present invention is to have a suitable adhesive strength, greatly suppress or eliminate the occurrence of optical distortion caused by partially saponified polyvinyl acetate, and To provide a adhesive for a protective sheet, which has an aqueous solution of partially saponified polyvinyl acetate as a main ingredient, and can prevent the occurrence of roughening and cranking of the bent portion of the contact portion of a rod heater.

(ニ)発明の構成 本発明は、ポリビニルアセテート部分ケン化物を3〜1
5重量%含む水溶液、該水溶液中のポリビニルアセテー
ト部分ケン化物の固形分に対するその固形分の割合が1
〜200重量%であるアクリル系エマルジョン、および
該水溶液中のポリビニルアセテート部分ケン化物固形分
に対する割合が0.01〜20重量%のホウ素化合物か
らなる保護シート用糊剤及びそれを用いた表面保護合成
樹脂成形品である。
(d) Structure of the invention The present invention provides 3 to 1 parts of partially saponified polyvinyl acetate.
An aqueous solution containing 5% by weight, the ratio of the solid content to the solid content of the partially saponified polyvinyl acetate in the aqueous solution is 1
A paste for a protective sheet comprising an acrylic emulsion of ~200% by weight and a boron compound in a proportion of 0.01 to 20% by weight based on the solid content of partially saponified polyvinyl acetate in the aqueous solution, and a surface protection synthesis using the same. It is a resin molded product.

(ボ)実施態様 本発明において使用するポリビニルアセテート部分ケン
化物としては、ケン化度が71.0%以上のものが望ま
しく、この中にはケン化度100%の完全にケン化され
たポリビニルアルコールも含む。
(B) Embodiment The partially saponified polyvinyl acetate used in the present invention preferably has a degree of saponification of 71.0% or more, including completely saponified polyvinyl alcohol with a degree of saponification of 100%. Also included.

本発明で使用されるアクリル系エマルジョンとしては併
用するポリビニルアセテート部分ケン化物の種類に応し
て、必要な糊剤の接着力、糊残り。
For the acrylic emulsion used in the present invention, the required adhesive strength and adhesive residue of the glue depend on the type of partially saponified polyvinyl acetate used.

成形歪等の物性を考慮して、市販の任意のアクリル系エ
マルジョンの中から選択することが可能である。
It is possible to select from any commercially available acrylic emulsions in consideration of physical properties such as molding distortion.

−11に、アクリル系エマルジョンは次の成分を含む。-11, the acrylic emulsion contains the following components.

(A)主成分モノマー(60〜100重量部)アルキル
基の炭素数が1〜8個のアクリル酸アルキルJ−ステル
モノマーであり、例エバ、エチルアクリレート、ブチル
アクリレート及び2−エチルへキシルアクリレート等が
含まれる。
(A) Main component monomer (60 to 100 parts by weight) An alkyl acrylate J-stell monomer whose alkyl group has 1 to 8 carbon atoms, such as EVA, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate. is included.

(B)コモノマー(20〜40重足部)アルキル基の炭
素数が1〜8個のメタクリル酸アルキルエステルまたは
上記生モノマーと共重合可能なビニル糸上ツマ−てあり
、例えば、酢酸ビニル、アクリロニトリル、スチレン、
アクリルアマイド′、メタクリル酸メチル等が含まれる
(B) Comonomer (20 to 40 carbon atoms) A methacrylic acid alkyl ester in which the alkyl group has 1 to 8 carbon atoms or a vinyl yarn that can be copolymerized with the above-mentioned raw monomer, such as vinyl acetate, acrylonitrile. ,styrene,
Includes acrylamide', methyl methacrylate, etc.

(C)官能基含有モノマー(0〜10重量部)上記(Δ
)、(B)と共重合可能な官能基含有モノマーであり、
例えばメタクリル酸。
(C) Functional group-containing monomer (0 to 10 parts by weight) above (Δ
), a functional group-containing monomer copolymerizable with (B),
For example, methacrylic acid.

アクリル酸、イタコン酸、ヒドロキシエ大ルメタクリレ
ート、ヒドロキシプロピルメタクリレート、ツメチルア
ミノエチルメタクリレート、アクリルアマイド、メチロ
ールアクリルアマイド、グリシジルメタクリレート2無
水マレイン酸等が含まれる。
These include acrylic acid, itaconic acid, hydroxyethyl methacrylate, hydroxypropyl methacrylate, trimethylaminoethyl methacrylate, acrylamide, methylol acrylamide, glycidyl methacrylate dimaleic anhydride, and the like.

市IJiのアクリル系エマルションとしては、例えば、
日本カーバイド工業株式会社製のニカゾールPL−3,
0OOA 、 C1,−302、CL−303、MG−
834、MG−1,439。
For example, IJi's acrylic emulsions include:
Nikazole PL-3 manufactured by Nippon Carbide Industries Co., Ltd.
0OOA, C1,-302, CL-303, MG-
834, MG-1,439.

MG−230B 、llX−78B 、’A−02,A
−10,FX−347゜RX−629、S −3,00
1、TS−444、TS−582、TS−660。
MG-230B, llX-78B,'A-02,A
-10,FX-347゜RX-629,S -3,00
1, TS-444, TS-582, TS-660.

TS−662、TS−530、TS−517B等がある
There are TS-662, TS-530, TS-517B, etc.

これらの中で本発明においてアクリル系エマルジョンと
し゛C使用して特に有すノなものは、ニカゾールA−1
0及びニカゾールS−3001である。この両者は、本
発明において、ポリビニルアセテート部分う−ン化物と
して特に日本合成化学工業製のゴーセノール旧1−17
(ケン化度78.5〜81.5モル%)を使用してこれ
と(71用した場合、Kl+−17単独使用の場合に比
べて糊剤としての接着力を大きく増大でき、しかも11
11残りが少なくてバランスのとれた物性をイ1する糊
剤を与えるので望ましい。
Among these, the one that is particularly used as the acrylic emulsion in the present invention is nicazole A-1.
0 and nicazole S-3001. In the present invention, both of these are particularly used as polyvinyl acetate partially vulcanized products such as Gohsenol Old 1-17 manufactured by Nippon Gohsei Chemical Industry Co., Ltd.
(saponification degree 78.5 to 81.5 mol%) and (71) can significantly increase the adhesive strength as a glue compared to the case of using Kl+-17 alone.
It is desirable because it provides a sizing agent with little 11 residue and well-balanced physical properties.

特に意外なことに、ポリビニルアセテート部分ケン化物
とこれら゛I′クリル系エマルジョンニカゾールS−3
001または八〜10を併用した場合、ポリビニル“r
セテート部分ケン化物に起因する加熱延伸時におりるメ
ククリル坂の光学歪の発生が大きく軽減ないし抑制°C
きることも明らかになった。
Particularly unexpectedly, partially saponified polyvinyl acetate and these acrylic emulsion nicazole S-3
When 001 or 8 to 10 are used together, polyvinyl "r"
Significantly reduces or suppresses the occurrence of optical distortion due to mekkrylic slope during heating and stretching due to partially saponified acetate °C
It became clear that it was possible.

この中でニカゾールS−3001はその分光学的データ
より2−エチルへキシルアクリレートを主成分とし、酢
酸ヒニルをコモノマーとして乳化重合させたものと思わ
れるが、このニカゾールS−3001を本発明のアクリ
ル系エマルジョンとして用いると特に有効である。即ち
、この二カブールS−3001のエマルジョンを単独で
糊剤として使用した場合、接着力が強すぎて保護紙がア
クリル樹脂板より剥離できなかったり、保護紙が破れた
りするが、本発明の如くポリビニルアセテート部分ケン
化物固形分に対して固形分換算で1〜200重量%(例
えば、133重量%)添加した場合は安定なエマルジョ
ン糊剤を形成し、糊残りもなく適度の接着力を有し、光
学歪も少なくて実用上問題とならない優れた糊剤を与え
る。
Among them, Nikazole S-3001 seems to be emulsion polymerized with 2-ethylhexyl acrylate as a main component and hinyl acetate as a comonomer, based on its spectroscopic data. It is particularly effective when used as a system emulsion. That is, when this emulsion of Nikabul S-3001 is used alone as a glue, the adhesive strength is too strong and the protective paper cannot be peeled off from the acrylic resin board, or the protective paper is torn. When added from 1 to 200% by weight (e.g., 133% by weight) in terms of solid content based on the solid content of partially saponified polyvinyl acetate, a stable emulsion paste is formed and has a suitable adhesive strength without any adhesive residue. This provides an excellent adhesive with little optical distortion and no practical problems.

アクリル系エマルジョンとポリビニルアセテート部分ケ
ン化物との混合割合ば使用するそれらの種類並びに最終
的な糊剤として要求される接着力等の糊剤物性に依存す
るが、ポリビニルアセテート部分ケン化物固形分に対す
るアクリル系エマルジョンの固形分の割合は1〜200
重恒%、好ましくは5〜100重U%である。1重量%
より少ない場合はアクリル系エマルジョンの添加効果が
殆ど認められず、また、200重量%より多い場合には
接着力が強すぎて保護シートを剥離するとき保護ソー1
へか破損したり、メタクリル樹脂板への糊残りが多くな
るので実用的に好ましくない。アクリル系エマルジョン
とポリビニルアセテート部分ケン化物との混合割合は、
糊剤物性を考慮して、上記の範囲内で任意乙こ変えるこ
とが可能であるが、20°Cにおいて均一・なエマルジ
ョンを形成し、少なくとも24時間静置しておいても相
分離が起らないようにアクリル系エマルジョンの種類を
選択し、その使用量を決定することが必要である。
The mixing ratio of the acrylic emulsion and the partially saponified polyvinyl acetate depends on the type of emulsion used and the physical properties of the glue, such as the adhesive strength required for the final glue, but the ratio of acrylic to the solid content of the partially saponified polyvinyl acetate depends The solid content ratio of the system emulsion is 1 to 200
It is 5% to 100% by weight, preferably 5 to 100% by weight. 1% by weight
If the amount is less than 200% by weight, the effect of adding the acrylic emulsion will hardly be recognized, and if it is more than 200% by weight, the adhesive force will be too strong and the protective saw 1 will be used when removing the protective sheet.
This is not practical because it may cause damage or leave a large amount of adhesive on the methacrylic resin plate. The mixing ratio of the acrylic emulsion and partially saponified polyvinyl acetate is
Considering the physical properties of the glue, it is possible to make any changes within the above range. It is necessary to select the type of acrylic emulsion and determine the amount to be used so as not to cause damage.

本発明で使用されるホウ素化合物は、加熱線折り曲げ加
土にj′;りる折り曲げ部分の肌荒れまたは/及びクラ
ンキングの防止のために有効である。
The boron compound used in the present invention is effective for preventing roughening and/or cranking of the bent portion of the heating wire.

この、Iトウ素化合物の添加による肌荒れまたは/及び
タラソキング防止機構は明確ではないが、肌荒れまたは
/及びクランキングの発生は、加熱時における水溶性糊
剤の溶融により保護シートを構成する繊維又は糊剤その
ものが合成樹脂板に融着することにより佳するものと考
えられ、ホウ素化合物の添加により加熱時にこれとポリ
ビニルアセテート部分ケン化物との間に架橋反応が進行
し、これにより肌荒れまたは/及びクランキングの発生
が抑制されるものと思われる。
Although the mechanism by which the addition of the I-toron compound prevents rough skin and/or thalassoking is not clear, the occurrence of rough skin and/or cranking is caused by the melting of the water-soluble adhesive during heating, which causes the fibers constituting the protective sheet to It is thought that this is achieved by the sizing itself being fused to the synthetic resin board, and the addition of a boron compound causes a crosslinking reaction between it and the partially saponified polyvinyl acetate when heated, resulting in rough skin and/or It is thought that the occurrence of cranking is suppressed.

上記ホウ素化合物としてはホウ酸2過ホウ酸塩等があり
、また、東邦化学工業株式会社よりエマルボンGBとい
う名称で市販されている次式で示される半極性結合を有
する有機ホウ素化合物も有効である。
Examples of the boron compound include boric acid diperborate, and an organic boron compound having a semipolar bond represented by the following formula, which is commercially available from Toho Chemical Industry Co., Ltd. under the name Emulbon GB, is also effective. .

上記ホウ素化合物の添加量は、同時に使用するポリビニ
ルアセテート部分ケン化物とアクリル系エマルジョンの
種類並びに使用するホウ素化合物の種類によって異なる
が、一般に、ポリビニルアセテート部分ケン化物固形分
に対し、0.01〜20重量%の範囲とする。0.01
重量%未満ではその添加による肌荒れまたは/及びクラ
・−7キングの防止効果が乏しい。また、20重量%を
超えると添加量に見合う肌荒れまたは/及びタラソキン
グ防止効果がほとんど認められないので経済的にメリッ
トがないうえ、加えたことによる糊剤粘度の増加が大き
く、保護シート又は合成樹脂板への塗布作業が困難とな
り、また糊残りも悪化する。
The amount of the boron compound added varies depending on the type of partially saponified polyvinyl acetate and acrylic emulsion used at the same time, as well as the type of boron compound used, but is generally 0.01 to 20% based on the solid content of partially saponified polyvinyl acetate. The range is by weight%. 0.01
If it is less than % by weight, the effect of preventing skin roughness and/or crack-7 king due to its addition is poor. In addition, if the amount exceeds 20% by weight, there is almost no effect on preventing rough skin and/or thalassoking commensurate with the amount added, so there is no economic advantage. It becomes difficult to apply the adhesive to the resin plate, and the adhesive residue also worsens.

本発明で使用される接着媒介物である上記の糊剤組成物
には[jJ塑剤、吸湿剤、防腐剤、増粘剤。
The above adhesive composition, which is an adhesive agent used in the present invention, includes [jJ plasticizer, moisture absorbent, preservative, thickener.

消泡剤等を添加することができる。この糊剤の粘度は塗
布作業上200〜io、oooセンチポアズ(cp)の
範囲にglli1節することが望ましい。粘度が200
cpよりも低いと保護シートを剥がす場合にメタクリル
樹脂板に接着媒介物の残渣や紙の繊維片からなる汚れが
発生し易い。粘度が10,000cpよりも大きい場合
には均一に塗布しにくくなるなと作業性上好ましくない
Antifoaming agents and the like can be added. The viscosity of this glue is desirably within the range of 200 to io, 00 centipoise (cp) for application purposes. Viscosity is 200
If it is lower than cp, stains consisting of adhesive agent residues and paper fiber fragments are likely to occur on the methacrylic resin plate when the protective sheet is removed. If the viscosity is greater than 10,000 cp, it will be difficult to apply uniformly, which is undesirable from the viewpoint of workability.

本発明において用いられる糊剤の塗布量は、0.4〜1
0 g / td 、好ましくは0.6〜2 g / 
rdの範囲である。0.4 g / r+(より少ない
と保護シートをメタクリル樹脂板その他の合成樹脂板が
ら剥がしたとき合成樹脂板に糊残りが発生ずる。逆に、
10 g/nrをこえると合成樹脂板表面に肌荒れの欠
陥を生じたり、接着力の再現性が乏しくなったりする場
合がある。
The coating amount of the glue used in the present invention is 0.4 to 1
0 g/td, preferably 0.6-2 g/td
rd range. 0.4 g/r+ (If it is less than that, adhesive residue will be left on the synthetic resin board when the protective sheet is removed from the methacrylic resin board or other synthetic resin board. Conversely,
If it exceeds 10 g/nr, defects such as rough skin may occur on the surface of the synthetic resin board, and the reproducibility of adhesive strength may become poor.

糊剤の付与方法は合成樹脂板に糊剤を均一に塗布した後
保護シートを貼りつけるか、保護シートに糊剤を塗布し
てからこれを合成樹脂板に貼りつけるか、又は両者を共
に実施するなどの例があげられる。
The adhesive can be applied by applying the adhesive evenly to the synthetic resin board and then attaching the protective sheet, or applying the adhesive to the protective sheet and then attaching it to the synthetic resin plate, or both. Examples include:

本発明の糊剤を利用した保護シートで保護できる合成樹
脂としては、保護シートを貼イ」できるものであれば特
に限定されず、例えば板状物2円筒状物、半円筒状物、
矩形等種々の成形品があげられる。
The synthetic resin that can be protected with the protective sheet using the adhesive of the present invention is not particularly limited as long as it can be pasted with the protective sheet, such as plate-shaped objects, cylindrical objects, semi-cylindrical objects, etc.
Various molded products such as rectangular shapes can be mentioned.

これらの合成樹脂成形品を形成する合成樹脂材料として
は、例えば、ポリメチルメタクリレート。
Examples of synthetic resin materials for forming these synthetic resin molded products include polymethyl methacrylate.

およびその他のメタクリル系樹脂、ゴム変性アクリル樹
脂、ポリカーボネート、ポリスチレン樹脂。
and other methacrylic resins, rubber-modified acrylic resins, polycarbonates, and polystyrene resins.

AS樹脂、ABS樹脂、塩化ビニル樹脂、アセテート樹
脂、ポリエチレン樹脂等があげられる。本発明の保護シ
ート用糊剤は、上記の中でも光学的性質にずくれたボリ
メククリレート、その他のメタクリル系樹脂、ポリカー
ボネート樹脂に対し特に有効である。
Examples include AS resin, ABS resin, vinyl chloride resin, acetate resin, and polyethylene resin. The adhesive for protective sheets of the present invention is particularly effective against bolimec acrylate, other methacrylic resins, and polycarbonate resins that have poor optical properties.

本発明におい“Cメタクリル樹脂板とは、粘度平均重合
度が800〜8 、000のポリメチルメタクリレート
またはメチルメタクリレートを主成分とする共重合体樹
脂の扱を指す。
In the present invention, "C methacrylic resin plate" refers to polymethyl methacrylate having a viscosity average degree of polymerization of 800 to 8,000 or a copolymer resin containing methyl methacrylate as a main component.

保護シートとしては、紙、フィルム等が用いられるか、
特に理知20〜80 g / rdの表面が平滑処理さ
れたクラット紙及びこれに類するものが好ましい。JI
S P 8122に記載のステキヒトサイズ度力月()
秒以上1.II3118129に記載の紙の表面強さが
10以上のものがよいが、これに限定されるもの°ζは
ない。またメタクリル樹脂1にと接しない面に熱可塑性
樹脂をq′、布したコート紙又は熱可塑性フィルムをラ
ミイ、−1〜した紙などを用いてもよい。
Is paper, film, etc. used as the protective sheet?
Particularly preferred is a surface-smoothed krat paper with a density of 20 to 80 g/rd and similar materials. J.I.
Steckicht size degree power month () described in S P 8122
More than a second 1. The paper described in II3118129 preferably has a surface strength of 10 or more, but is not limited to this. Alternatively, coated paper coated with a thermoplastic resin on the surface not in contact with the methacrylic resin 1, or paper laminated with a thermoplastic film of -1 or more may be used.

(へ)発明の効果 ポリビニルアセテート部用ケン化物水溶液にアクリル系
エマルションを加えたごとによりポリヒニルアセテート
部分ケン化物単独では得られながった強い接着力を得る
ことが可能となる。そのため、従来問題であった切断・
保管・輸送・加工時における端部の剥がれ等が無くなり
、従って、保護シートを剥がしても合成樹脂板表面に’
IQれや切粉等による押し傷の入ることがなくなった。
(F) Effects of the Invention By adding an acrylic emulsion to the aqueous solution of the saponified polyvinyl acetate part, it becomes possible to obtain a strong adhesive force that could not be obtained with the saponified polyvinyl acetate part alone. As a result, cutting and
This eliminates peeling of edges during storage, transportation, and processing, so even if the protective sheet is removed, the surface of the synthetic resin board remains intact.
There are no more pressure scratches caused by IQ cracks or chips.

また、このためメタクリル樹脂板に加熱成形や印刷加工
を施すに先立って合成樹脂板の表面を洗浄する必要がな
くなり、洗浄の際に誤って合成(h1脂!Fj、嶋傷を
つけるようなこともなくなった。さらに添加したアクリ
ル系エマルジョンの別の効果としてポリヒニルアセテー
ト部分ケン化物糊剤に起因した加熱延伸時におりる、メ
タクリル樹脂板の光学歪の発生が軽減ないし抑制できた
。さらに、添加したホウ素化合物により加熱線折り曲げ
加工時における糊剤に起因するメタクリル43(指板の
肌荒れまたは/及びタラノキングの発生が防止でき、従
って、保護シートを貼りつけたままで局部的に加熱し折
り曲げ成形を行っても折り曲り部の外観を損なうことが
なくなった。
In addition, this eliminates the need to clean the surface of the synthetic resin board before applying heat molding or printing to the methacrylic resin board, and there is no risk of accidentally damaging the surface of the synthetic resin board during cleaning. Furthermore, another effect of the added acrylic emulsion was that the optical distortion of the methacrylic resin plate caused by the partially saponified polyhinyl acetate sizing agent during heating and stretching was reduced or suppressed.Furthermore, The added boron compound can prevent methacrylic 43 (fingerboard roughness and/or taranoking) caused by the glue during the heating wire bending process. The appearance of the bent part is no longer spoiled even when the bending is done.

(ト)実施例 次に、実施例及び比較例により本発明を説明する。実施
例は本発明の一例を示したにすぎず、本発明は何らこれ
によっ゛ζ限定されるものではない。
(G) Examples Next, the present invention will be explained with reference to Examples and Comparative Examples. The embodiments merely show one example of the present invention, and the present invention is not limited thereto in any way.

なお、実施例に記載の評1i[1i結果は以下に示す方
法によった。
Note that the evaluation 1i [1i results described in Examples were obtained by the method shown below.

糊M: 糊剤が水溶性成分のみで水に不溶性成分を含まない場合
は、合成樹脂板から引き剥がした糊量きの保護シートを
l0cm X 10cmの試片に切り、先ず100°C
で2時間乾燥し秤量する(重量をWlgとする。)。次
に、約40℃の温水中に試片を置き、約2時間糊を溶出
させた後、同様に乾燥して秤量する(重量をW2 gと
する。)。糊量は次の式で算出する。
Glue M: If the glue contains only water-soluble components and no water-insoluble components, cut the adhesive protective sheet peeled off from the synthetic resin board into 10cm x 10cm pieces and heat it at 100°C first.
Dry for 2 hours and weigh (weight in Wlg). Next, the test piece is placed in warm water at about 40°C, and after the glue is eluted for about 2 hours, it is similarly dried and weighed (the weight is W2 g). The amount of glue is calculated using the following formula.

糊Wk (g/nf) = (W+ −1d2) x1
00糊剤が水に不溶性成分を含む場合は、上記の水溶出
法によって正確に糊量を測定することは不可能であるの
で糊剤塗布前の保護シートを100℃で2時間乾燥した
後秤量しく重量を葬2とする。)、次に糊剤を塗布した
糊付きの保護シートを同様に乾燥した後秤量しく重量を
−1とする。)、糊量を次式により算出する。
Glue Wk (g/nf) = (W+ -1d2) x1
If the 00 glue contains water-insoluble components, it is impossible to accurately measure the amount of glue using the water elution method described above, so dry the protective sheet at 100°C for 2 hours before applying the glue and then weigh it. The weight is set to 2. ), then dry the adhesive protective sheet coated with adhesive in the same manner and weigh it to give a weight of -1. ), the amount of glue is calculated using the following formula.

糊ii (g/m) −(誓1 ′−晩’)X100保
護シートの接着カニ 中IQcm、長さ3Qcmの保護シート伺きの合成樹脂
板試片を、温度23℃の恒温室に2時間以上放置した後
、この試片の一端から保護シートを合成樹脂板と平行且
つ180°の定角で、30c+n/分の速度で引き剥が
ずに要する平均的力(g/10cm中)を接着力とし、
試片5個の平均値で示した。
Glue II (g/m) - (1'-night') x 100 Adhesion of protective sheet A synthetic resin plate specimen with a medium IQcm and a length of 3Qcm, with a protective sheet attached, was placed in a thermostatic chamber at a temperature of 23°C for 2 hours. After allowing the specimen to stand for more than 10 minutes, the adhesive strength was determined by the average force (in g/10cm) required to keep the protective sheet from peeling off from one end of the specimen at a speed of 30c+n/min, parallel to the synthetic resin plate and at a constant angle of 180°. year,
It is shown as the average value of 5 test pieces.

糊残り: 保護シートを剥がした後の合成樹脂板表面の汚染状態を
肉眼で判定し次のランクに分類した。
Adhesive residue: After the protective sheet was removed, the contamination state of the surface of the synthetic resin board was visually judged and classified into the following ranks.

以下余白 ランク 状 態 △ 明瞭に糊残りが認められ、洗浄 の必要がある。Below margin Rank status △ Adhesive residue was clearly observed, and cleaning was required. There is a need for

加熱線折り曲げ時の肌荒れ又はクランキング保護シー1
〜で表面を保護された縦横の長さが3(1cm X 1
5c+nの合成樹脂板を、加熱した棒状ヒーターに一定
時間接触させ、加熱面を外側にし、直ちに90゛の角度
に折り曲げ、折り曲げ部に生ずる肌荒れ又はクランキン
グを肉眼で判定し、次のランクに分類した。
Rough skin or cranking protection sheet when bending heating wire 1
The length and width of the surface protected by ~ is 3 (1 cm x 1
A synthetic resin plate of 5c+n is brought into contact with a heated rod-shaped heater for a certain period of time, then immediately bent at a 90° angle with the heating side facing outward, and the roughness or cranking that occurs at the bent part is visually judged and classified into the following ranks. did.

ランク 状 態 × 樹脂板の肌荒れが生しクランキ ングが一部発生している。Rank status × The surface of the resin board is rough and crunchy. There are some occurrences of

光学歪: 製板直後のシートに直ちに保護シートを貼り付は室温に
3日間放置した後、直径20cm、高さ10cmの半球
状にブロー成形する。この半球を通して格子線を透視し
、格子線の全程度を判定して次のランクに分類した。
Optical distortion: A protective sheet was immediately attached to the sheet after it was made, and after being left at room temperature for 3 days, it was blow-molded into a hemispherical shape with a diameter of 20 cm and a height of 10 cm. The grid lines were seen through this hemisphere, and the total extent of the grid lines was determined and classified into the following ranks.

ランク 状 慾 実施例1 重合率19%のメチルメタクリレートシロ・ノフ。rank status desire Example 1 Methyl methacrylate Shilonov with a polymerization rate of 19%.

(粘度約10ポアズ、20’C)に、重合開始剤アブヒ
スジメチルバレロニトリルeooppm及ヒ剥離剤ジオ
クチルスルホサクンネート20p9mを混合したものを
出発原料として、厚さ3 msのステンレス板製注型成
型用セルに注入して、80°Cの温度Gこ30分、その
後120℃の空気浴に1時間滞留させ厚さ3鰭のメタク
リル樹脂板を製造した。
(viscosity approximately 10 poise, 20'C), a mixture of a polymerization initiator Abhis dimethylvaleronitrile eooppm and a release agent dioctyl sulfosacunate 20p9m was used as a starting material and cast into a stainless steel plate with a thickness of 3 ms. The mixture was poured into a cell for 30 minutes at a temperature of 80°C, and then kept in an air bath at 120°C for 1 hour to produce a methacrylic resin plate with a thickness of 3 fins.

次いで、ポリビニルアセテート部分ケン化物ゴーセノー
ル(iuj標)K11〜17(日本合成化学工業株式会
社!!りの9.5重量%水溶液80重量部に、アクリル
系エマルジョンニヵソ゛−ルS −3001(B本カー
ハイト工業株式会礼装、固形分44.7重量%。
Next, to 80 parts by weight of a 9.5% by weight aqueous solution of partially saponified polyvinyl acetate Gohsenol (IUJ mark) K11-17 (Nippon Gosei Kagaku Kogyo Co., Ltd.!!) was added acrylic emulsion nicazole S-3001 (B). This Carheit Industrial Co., Ltd. formal wear has a solid content of 44.7% by weight.

粘度8900cps) 20重量部を添加した。この水
溶液中のポリビニルアセテート部分ケン化物固形分に対
するニカゾールS −3001の固形分の割合は118
重足%であった。さらに、この水溶液中のポリビニルア
セテート部分ケン化物固形分に対する割合が5重量%に
なるようにエマルポンGB−90(東邦化学工業株式会
社製、ホウ素化合物エマルホンGBに水を10重量%添
加したもの。)を添加して本発明の糊剤を調製した。こ
れを#8のバーコーターを用いて前記のメタクリル樹脂
板に1.4g / rt(の割合で均一に塗布した。直
ちに大王製紙カタツヤクラフトIL(坪1ft40 g
/nr、ステキヒトザイス度12秒2表面強度12A)
を貼り付け、表面を保護されたメタクリル樹脂板を得た
Viscosity: 8900 cps) 20 parts by weight were added. The ratio of the solid content of Nikazole S-3001 to the solid content of partially saponified polyvinyl acetate in this aqueous solution is 118
It was a heavy foot%. Furthermore, Emulpon GB-90 (manufactured by Toho Chemical Co., Ltd., boron compound Emulpon GB with 10% water added) was added so that the solid content of partially saponified polyvinyl acetate in this aqueous solution was 5% by weight. A sizing agent of the present invention was prepared by adding . This was applied uniformly to the methacrylic resin board at a rate of 1.4 g/rt using a #8 bar coater.
/nr, Steckchtseiss degree 12 seconds 2 surface strength 12A)
was attached to obtain a methacrylic resin plate with a protected surface.

この保護紙付きのメタクリル樹脂板を23°Cの恒温室
で1夜放置したのち糊剤物性を前述方法に従って測定し
保護紙の接着力を測定した。その結果を第1表に示す。
After this methacrylic resin plate with the protective paper was left in a constant temperature room at 23° C. overnight, the physical properties of the glue were measured according to the method described above, and the adhesive strength of the protective paper was measured. The results are shown in Table 1.

比較例1 実施例工において糊剤水溶液にアクリル系エマルジョン
ニカゾールS−3001及びエマルポン(iB−90を
添加しない他は全〈実施例1と同様にして保護紙付きの
メタクリル樹脂板を製造し、実施例1と全く同様に糊剤
の評価を行った。その結果を第1表に示す。
Comparative Example 1 A methacrylic resin board with a protective paper was produced in the same manner as in Example 1, except that acrylic emulsion Nikazole S-3001 and Emulpon (iB-90) were not added to the aqueous glue solution in the Example process. The adhesive was evaluated in exactly the same manner as in Example 1. The results are shown in Table 1.

比較例2 実施例1において糊剤水溶液にアクリル系エマルジョン
ニカゾール573001を添加しない他は全〈実施例1
と同様にして保護紙付きのメタクリル樹脂板を製造し、
実施例1と全く同様に糊剤の評価を行った。その結果を
第1表に示す。
Comparative Example 2 All the procedures in Example 1 were repeated except that the acrylic emulsion nicazole 573001 was not added to the aqueous glue solution.
A methacrylic resin plate with protective paper was manufactured in the same manner as above,
The adhesive was evaluated in exactly the same manner as in Example 1. The results are shown in Table 1.

比較例3 実施例1において糊剤水溶液にエマルポンGB−90を
添加しない他は全〈実施例1と同様にして保護紙例きの
メタクリル樹脂板を製造し、実施例1と全く同様に1′
M1剤の評ll1liを行った。その結果を第1表に示
す。
Comparative Example 3 A methacrylic resin board with a protective paper was produced in the same manner as in Example 1, except that Emulpon GB-90 was not added to the aqueous adhesive solution in Example 1.
An evaluation of M1 agent was conducted. The results are shown in Table 1.

以下余白 実施例1と比較例1〜3とを比較することるより、本発
明の糊剤を使用した場合の効果は明らかである。ずなわ
ら、実施例1と比較例1を比較すると糊剤として単にポ
リビニルアセテート部分ケン化物のみを使用した場合に
比べて、本発明の糊剤を使用した場合は、川に接着力が
大rlJに向上するのみならず、ポリヒニルアセテ−1
・部分ケン化物糊剤の欠陥であるブロー成形時の光学歪
の発生並びにヒーターカIげ(1折り曲げ時の肌荒れ及
びタラソギングの光)1.か防止できることがわかる。
By comparing Margin Example 1 and Comparative Examples 1 to 3 below, the effect of using the adhesive of the present invention is clear. However, when comparing Example 1 and Comparative Example 1, it is found that the adhesive strength of the adhesive of the present invention is greater when the adhesive of the present invention is used than when only partially saponified polyvinyl acetate is used as the adhesive. Not only does it improve polyhinyl acetate-1
・Occurrence of optical distortion during blow molding, which is a defect of partially saponified adhesive, and heater cracking (rough skin and light from thalassogging during 1st bending)1. It turns out that this can be prevented.

また、実施例1と比較例2を比較することにより、アク
リル系エマルジョンニカゾールS −3001を添加す
ることにより糊剤の接着力を大きく向上させると共に、
その中に存在する界面活性剤の効果によりポリビニルア
セテート部分ケン化物糊剤に特有の欠陥であるブロー成
形時の光学歪の発生を抑制していることがわかる。さら
に、実施例1と比較例3を比較するごとにより、ホウ素
化合物エマルボンGB−90を添加することによりヒー
ター加熱折り曲げ部の肌荒れ及びタラソキングが防止で
きることがわかる。
In addition, by comparing Example 1 and Comparative Example 2, it was found that the addition of acrylic emulsion nicazole S-3001 greatly improved the adhesive strength of the glue, and
It can be seen that the effect of the surfactant present therein suppresses the occurrence of optical distortion during blow molding, which is a defect specific to partially saponified polyvinyl acetate pastes. Further, by comparing Example 1 and Comparative Example 3, it can be seen that the addition of the boron compound Emulbon GB-90 can prevent rough skin and thalassoking at the heater-heated bent portion.

実施例2 重合率19%のメチルメタクリレートシロ・ノブ(粘度
約10ボアス、20℃)に、重合開始剤としてアゾビス
ジメチルバレロニトリルを830ppm 。
Example 2 830 ppm of azobisdimethylvaleronitrile as a polymerization initiator was added to methyl methacrylate Shilonobu (viscosity: about 10 boas, 20°C) with a polymerization rate of 19%.

及び剥離剤としてジスルホサクシネートを20ppm混
合したものを出発原料として、厚さ3 amのステンレ
ス板製注型成型用セルに注入して、74;9の温度に4
0分、その後120℃の空気浴に1時間滞留させ厚さ3
mmのメタクリル樹脂板を製造した。
A mixture of 20 ppm of disulfosuccinate and disulfosuccinate as a release agent was used as a starting material, poured into a cast molding cell made of stainless steel plate with a thickness of 3 am, and heated to a temperature of 74:9.
0 minutes, then left in an air bath at 120°C for 1 hour to form a layer with a thickness of 3
A methacrylic resin plate of mm was manufactured.

次いで、ポリビニルアセテート部分ケン化物としてゴー
セノールKli、17 ()1本合成化学工業株式会社
製商品名)の8.0重量%水溶液85重量部にアクリル 本カーバイト工業株式会社製,固形分44.7重量%。
Next, 85 parts by weight of an 8.0% by weight aqueous solution of Gohsenol Kli, 17 (trade name, manufactured by Honsei Kagaku Kogyo Co., Ltd.) as a partially saponified polyvinyl acetate product was added to 85 parts by weight of an 8.0% by weight aqueous solution of Gohsenol Kli, 17 (trade name, manufactured by Honsei Kagaku Kogyo Co., Ltd.), and an acrylic product made by Hon Carbide Kogyo Co., Ltd., solid content: 44.7 weight%.

粘度8900cps) 1 5重量部を添加し、さらに
この水溶液中のポリビニルアセテート部分ケン化物固形
分に対する割合が3重量%になるようにエマルポンGB
−90 (東邦化学工業株式会社製,これはにつ素化合
物エマルボンGBに水を10重量%添加したもの)を添
加して本発明の糊剤を調製し、これを#8のパーコーク
−を用いて前記のメタクリル樹脂板に均一・Gこ塗布し
た,その後直ちるこ大王W1製のカタツヤクラフト紙(
坪ffi40g/n(、ステキヒトサイス度12秒,表
面強度12A)を貼りつり、表面を保護されたメタクリ
ル樹脂板を得た。
Viscosity: 8900 cps) 15 parts by weight of Emulpon GB were added so that the proportion of the solid content of partially saponified polyvinyl acetate in this aqueous solution was 3% by weight.
-90 (manufactured by Toho Chemical Industry Co., Ltd., this is a nitrogen compound emalbon GB with 10% water added) to prepare the sizing agent of the present invention, and this was mixed using #8 Percoke. The above-mentioned methacrylic resin plate was coated with G evenly, and then Katatsuya kraft paper (made by Chiruko Daioh W1) was applied.
A methacrylic resin plate with a protected surface was obtained by pasting and suspending a tsubo ffi of 40 g/n (Stekcht scale: 12 seconds, surface strength: 12 A).

ごの保護紙例きのメタクリル樹脂板を23°Cの恒温室
で1夜放置した後糊剤物性を前記の方法Gこ従っ゛ζ測
定した。その結果接着力Gよ35g/♂であり、糊残り
もなく、光学歪は少なくーこ実用上問題のない程度であ
った。
The methacrylic resin plate as an example of protective paper was left overnight in a constant temperature room at 23°C, and the physical properties of the glue were measured according to Method G described above. As a result, the adhesive force G was 35 g/♂, there was no adhesive residue, and the optical distortion was small, which was not a problem for practical use.

実施例3 実施例1においてコーセノールに++ー17ノ濃度’;
r7、0%にした以外は全〈実施例1と同様Gこしてf
呆護紙付きのメタクリル樹脂板を製造し、実施例1と全
く同様にして糊剤の評価を行なった。そのB存の糊剤の
粘度(B型粘度計にて20°Cにて測定)は2560セ
ンチポアズ<cp>であり、その接着強度は4 0 g
 / n(−ζあり、糊残りは認められず、光学歪も実
用上問題ない程度であった。
Example 3 In Example 1, cosenol had a concentration of ++-17';
All except that r7 and 0% (Same as Example 1)
A methacrylic resin plate with a protective paper was produced, and the adhesive was evaluated in exactly the same manner as in Example 1. The viscosity of the B-based glue (measured with a B-type viscometer at 20°C) is 2560 centipoise (cp), and its adhesive strength is 40 g.
/n(-ζ), no adhesive residue was observed, and optical distortion was at a level that caused no practical problems.

以上のことより明らかな如く、本発明の組成の糊剤を使
用した場合は、従来のポリビニルアセテート部分ケン化
物特有の光学歪の発生並びGこヒーター加熱折り曲げ時
の肌荒れ及びクラ・ノキングの発生を防止でき、しかも
接着力を火中に向上さーUること力呵能になる。これら
の結果から、本発明の糊剤を用いて表面を保護されたポ
リメチルメタクリレート樹脂扱の優位性は明らかである
As is clear from the above, when the adhesive composition of the present invention is used, it is possible to prevent the occurrence of optical distortion peculiar to conventional partially saponified polyvinyl acetate products, as well as the occurrence of rough skin and crack knocking during heating and bending with a G heater. It can be prevented and the adhesion strength can be improved. From these results, the superiority of treating polymethyl methacrylate resin whose surface is protected using the adhesive of the present invention is clear.

実施例4 押出または射出成形して得た厚さ3 mmの」ミリカー
ボネート、As樹脂, A B 3 4!4脂,ポリ塩
化ヒニル樹脂,アセテート樹脂およびポリスチレン樹脂
の板について実施例1で使用した保護紙及DC tlJ
I剤を用いて接着したところ、いずれも接着強度番よ十
分−であり、また剥離した際も板表面に糊残りもなかっ
た。
Example 4 A plate of 3 mm thick extrusion or injection molding made of millicarbonate, As resin, A B 3 4!4 resin, polyhinyl chloride resin, acetate resin, and polystyrene resin was used in Example 1. Protective paper and DC tlJ
When bonded using Agent I, the adhesive strength was sufficient in all cases, and there was no adhesive residue on the surface of the board when it was peeled off.

Claims (1)

【特許請求の範囲】 ■、 ポリビニルアセテート部分ケン化物を3〜15車
量%含む水溶液、該水溶液中のポリビニルアセテート部
分ケン化物の固形分に対するその固形分の割合が1〜2
00重星%であるアクリル系エマルジョンおよび該水溶
液中のポリビニルアセテート部分ケン化物の固形分に対
する割合が0.01〜20重量%のホウ素化合物からな
る保護シート用糊剤。 2、 アクリル系エマルジョンか2−エチルへキシルア
クリレ−1〜を主成分とし酢酸ビニルをコモノマーとし
て含む中量体混合物から得られた乳化重合体である特許
請求の範囲第1項記載の糊剤。 3、 ホウ素化合物がホウ酸である特許請求の範囲第1
項記載の11J1刑。 4、 ホウ素化合物か次ヱ(て示される化合物である特
許請求の範囲第1項記載の糊剤。 5、 ポリヒニルアセテ−1・部分ケン化物を3〜15
重量%含む水溶液、該水溶液中のポリビニ、ルアセテー
ト部分ケン化物の固形分に対するその固形分の割合が1
〜200重量%であるアクリル系エマルジョンおよび該
水溶液中のポリビニルアセテート部分ケン化物の固形分
に対する割合が0.01〜20重量%のホウ素化合物か
らなる糊剤を、合成樹脂板と保護シートとの間に介在せ
しめた表面保護合成樹脂成形品。 6、 アクリル系エマルジョンが2−エチルへキシルア
クリレ−1・を主成分とし酢酸ビニルをコモノマーとし
て含む単址体混合物から得られた乳化重合体である特許
請求の範囲第5項記載の合成樹脂成形品。 7、 ホウ素化合物がホウ酸である特許請求の範囲第5
項記載の合成樹脂成形品。 8、 ホウ素化合物が次式で示される化合物である特許
請求の範囲第5項記載の合成樹脂成形品。 9、保護シートが、少なくとも合成樹脂板に接する面を
平滑処理したクラフトバルブを主原料としたクラフト紙
である特許請求の範囲第5項から第8項までのいずれ−
かに記載の合成樹脂成形品。 10、糊剤が、合成樹脂板と保護シートとの接着時にお
りる粘度が20 ℃において200〜10.000セン
チポアズの範囲である特許請求の範囲第5項から第9項
までのいずれかに記載の合成樹脂成形品。 11、合成樹脂板が、粘度平均1合度が800〜g、o
ooのメチルメタクリレ−I〜の重合体からなるメタク
リル樹脂板である特許請求の範囲第5項がら第10項ま
でのいずれかに記載の合成樹脂成形品。 12、介在せしめられた糊剤の量が0.4〜10g/M
の範囲である特許請求の範囲第5項から第11項までの
いずれかに記載の合成樹脂成形品。
[Scope of Claims] (1) An aqueous solution containing 3 to 15% by volume of partially saponified polyvinyl acetate, the ratio of the solid content to the solid content of the partially saponified polyvinyl acetate in the aqueous solution is 1 to 2.
A adhesive for a protective sheet comprising an acrylic emulsion having a concentration of 0.00 double stars and a boron compound having a proportion of 0.01 to 20% by weight based on the solid content of partially saponified polyvinyl acetate in the aqueous solution. 2. The sizing agent according to claim 1, which is an emulsion polymer obtained from an acrylic emulsion or an intermediate mixture containing 2-ethylhexyl acrylate-1 as a main component and vinyl acetate as a comonomer. 3. Claim 1 in which the boron compound is boric acid
11J1 punishment as stated in Section 11. 4. The sizing agent according to claim 1, which is a boron compound or a compound represented by
% by weight of an aqueous solution, the solid content of which is based on the solid content of partially saponified polyvinylacetate and ruacetate in the aqueous solution is 1
A glue consisting of an acrylic emulsion of ~200% by weight and a boron compound having a proportion of partially saponified polyvinyl acetate in the aqueous solution of 0.01 to 20% by weight based on the solid content is applied between the synthetic resin board and the protective sheet. Surface protection synthetic resin molded product interposed in 6. The synthetic resin molded article according to claim 5, wherein the acrylic emulsion is an emulsion polymer obtained from a monomer mixture containing 2-ethylhexyl acrylate-1 as a main component and vinyl acetate as a comonomer. . 7. Claim 5 in which the boron compound is boric acid
Synthetic resin molded products as described in section. 8. The synthetic resin molded article according to claim 5, wherein the boron compound is a compound represented by the following formula. 9. Any one of claims 5 to 8, wherein the protective sheet is kraft paper made mainly from kraft valves whose surface in contact with the synthetic resin plate has been smoothed at least.
Synthetic resin molded product described in Crab. 10. According to any one of claims 5 to 9, the adhesive has a viscosity in the range of 200 to 10,000 centipoise at 20°C when the synthetic resin plate and the protective sheet are bonded together. Synthetic resin molded products. 11. The synthetic resin plate has an average viscosity of 800 g, o
The synthetic resin molded article according to any one of claims 5 to 10, which is a methacrylic resin plate made of a polymer of methyl methacrylate-I. 12. The amount of glue interposed is 0.4 to 10 g/M
A synthetic resin molded article according to any one of claims 5 to 11, which falls within the scope of the following claims.
JP58221083A 1983-11-24 1983-11-24 Paste for protective sheet, and surface-protected synthetic resin molded article using the same Pending JPS60112875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58221083A JPS60112875A (en) 1983-11-24 1983-11-24 Paste for protective sheet, and surface-protected synthetic resin molded article using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58221083A JPS60112875A (en) 1983-11-24 1983-11-24 Paste for protective sheet, and surface-protected synthetic resin molded article using the same

Publications (1)

Publication Number Publication Date
JPS60112875A true JPS60112875A (en) 1985-06-19

Family

ID=16761218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58221083A Pending JPS60112875A (en) 1983-11-24 1983-11-24 Paste for protective sheet, and surface-protected synthetic resin molded article using the same

Country Status (1)

Country Link
JP (1) JPS60112875A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03190988A (en) * 1989-12-19 1991-08-20 Tombow Pencil Co Ltd Liquid adhesive composition
JP2023043826A (en) * 2021-09-16 2023-03-29 積水化学工業株式会社 Temporary protection material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03190988A (en) * 1989-12-19 1991-08-20 Tombow Pencil Co Ltd Liquid adhesive composition
JP2023043826A (en) * 2021-09-16 2023-03-29 積水化学工業株式会社 Temporary protection material

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