JPS60109283A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS60109283A
JPS60109283A JP21687283A JP21687283A JPS60109283A JP S60109283 A JPS60109283 A JP S60109283A JP 21687283 A JP21687283 A JP 21687283A JP 21687283 A JP21687283 A JP 21687283A JP S60109283 A JPS60109283 A JP S60109283A
Authority
JP
Japan
Prior art keywords
film
crystallized
amorphous
semiconductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21687283A
Other languages
Japanese (ja)
Inventor
Seiichi Iwamatsu
誠一 岩松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP21687283A priority Critical patent/JPS60109283A/en
Publication of JPS60109283A publication Critical patent/JPS60109283A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/78654Monocrystalline silicon transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78663Amorphous silicon transistors
    • H01L29/78666Amorphous silicon transistors with normal-type structure, e.g. with top gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To contrive speed-up by carrier passage to a crystallized film having a larger mobility of carriers by a method wherein the crystallized semiconductor film and an amorphous semiconductor film are put in a double-layer. CONSTITUTION:The crystallized Si film 12 resulting from laser anneal polycrystallization or single-crystallization of the amorphous Si film formed by plasma CVD is formed on the surface of a glass substrate 11, and the amorphous Si film 13 is formed thereon by plasma CVD, which are put in a structure of double-layer semiconductor films. Thus, a deep depletion type MOSFET consisting of diffused layers 14 and 15, a gate oxide film 16, and a gate electrode 17 formed thereon is obtained.

Description

【発明の詳細な説明】 本発明は、゛1′導体装置構造K lflする。[Detailed description of the invention] The present invention provides a ``1'' conductor device structure Klfl.

(r/・K、i?: 、4t1体u i’7け例えばア
モルファス半導体から成X)’h r、i体装置:′1
′に;bてけ、Yモルフ丁ス単層璋1+*’、゛l’導
体装置/iを形成トろのが油側で力、った、1、か12
、L記?Fr牢技術にすると、γモルファヌ゛I′導体
%JS li’1″のへ連化に限1”fが生じるという
欠点が声・−1な。
(r/・K, i?: , 4t1 body u i'7 made of, for example, an amorphous semiconductor X)'h r, i body device: '1
'B, Y morphine single layer 1 + *', 'l' Forming the conductor device/i, the force on the oil side was 1, 12
, L? When using the Fr cell technology, the drawback is that 1"f occurs only when the γ morphan I' conductor is connected to a conductor of 1".

木!7.1111 tt /ト1J’s 7−ンに車t
17?Jrのか占& trビ1 γモ/l−ファス半導
体を用いた半導体装置に於ても高速化が可能な半導体装
fPt tiIl造を提供することを目的とする、 1;記目的を達成するための、本発明のlS、木的1.
【構成は、半導体装置に於て、ガラス集4反1−. K
はll+結晶または多結晶から成る結晶イトさhた”F
 ?、’f体月ζ(が形成され、該結晶化さねた半涛体
嘩I:I−U 1−/”モルファス半導体すαが形成さ
れて成ることを特徴とするO 以下、実施例により本発明を詳述する、第1図6従来技
術を示すNO8FBTの断面図である。すなわち、ガラ
ス基板10表面にはアモノトファヌFtj膜2が形成さ
れ、該アモルファスgマ’ Rには拡散層3.4、ゲー
ト酸化膜5、その上にゲート?tf榛6が形成されて、
1.イO8型FFjTを(1”りh’2 して成る。
wood! 7.1111 tt / 1J's 7-car t
17? To achieve the following objectives, the purpose is to provide a semiconductor device fPttiIl structure that can increase the speed even in semiconductor devices using gamma mo/l-fas semiconductors. The lS of the present invention, tree-like 1.
[The structure is as follows: In a semiconductor device, 4 glass plates 1-. K
is a crystal consisting of ll+crystals or polycrystals.
? , 'f body ζ() is formed, and the crystallized semiconducting body I: I-U 1-/'' is characterized by the formation of amorphous semiconductor α. 6 is a cross-sectional view of NO8FBT showing the prior art, which explains the present invention in detail. That is, an Amonotofanu Ftj film 2 is formed on the surface of a glass substrate 10, and a diffusion layer 3. 4. A gate oxide film 5 and a gate ?tf film 6 are formed thereon.
1. It is made by (1"rih'2) of 08 type FFjT.

第2図は本発明の一実雄例を示す)、J Oj”jり(
II Tl・l・:゛工゛の断面図である。すなわち、
ガラス基4fi 11グ)!−面にはプラズマOVDで
形成されたア−F /1 ノアクSi膜をレー→ドー・
アニールで多結晶ヤfr i□I l結晶化した結晶化
Si膜12、その)(FプラズマCVDで形成さり、f
cアモルファスS1:llI+3の2層半導体膜構令に
は、拡散層ji!、15及びゲート酸化脇16そのt二
に形成さfl、 p A’ −ト電1ケ17から成るテ
゛イープ 〒イブレソションタイプのMO8型FETで
ある。
Figure 2 shows an example of the present invention);
II Tl.l.: It is a sectional view of the "work". That is,
Glass base 4fi 11g)! - side is coated with A-F/1 Noack Si film formed by plasma OVD.
The crystallized Si film 12 is annealed and polycrystalline.
The two-layer semiconductor film structure of c amorphous S1:llI+3 includes a diffusion layer ji! , 15 and a gate oxidation side 16 and a gate electrode 17 formed on the two sides of the gate oxidation side 16.

本発明の如(、結晶北米導体llαとアモA・ファスゝ
r導体障を21−にすることにより、キャリアーの移動
度の大Aい結晶化膜にキャリアーを挿過させて、高速化
を19することがで^る効ツがある、
According to the present invention (by making the crystalline conductor llα and the amorphous A-fasr conductor barrier 21-21-2, carriers can be inserted into a crystallized film with high carrier mobility, increasing the speed to 19-19). There are some benefits to doing this,

【図面の簡単な説明】[Brief explanation of drawings]

第1図(11イ′来技術によるMOSハII F Iu
 Tの断面図、第21ツ1は本発明による−す雄側を示
す)408型F rl; TのN?i面図である。 1.11 ・・・・・・ガラスJ4板 2.13・・・・・・アモルファス半導体++i12・
・・・・・結晶化半導体嘆 3.4.111.15・・・・・・拡散層5.16・・
・・・・/y’−ト酸化膜6.17・・・・・・)f−
)flif」す、ト 出願人 株式会社 諏訪精工舎 代理人 弁理士 が−に をン?
Figure 1 (11) MOS High II F Iu
408 type F rl; N of T? It is an i-side view. 1.11...Glass J4 plate 2.13...Amorphous semiconductor++i12.
...Crystallized semiconductor layer 3.4.111.15...Diffusion layer 5.16...
.../y'-t oxide film 6.17...) f-
)flif', the applicant Suwa Seikosha Co., Ltd., a patent attorney.

Claims (1)

【特許請求の範囲】[Claims] カラス」1鬼・板E二にはφ結晶または多結晶からなる
結晶化さI]、 f ?ト導体膜が形成され、該結晶化
された半2.り体膜h Kけアモルファス半導体殴が形
成さハて成ろことを特徴とする半導体装置。
Crow' 1 Oni/board E 2 is crystallized consisting of φ crystals or polycrystals I], f? A conductive film is formed on the crystallized half 2. 1. A semiconductor device characterized in that an amorphous semiconductor layer is formed in a body film.
JP21687283A 1983-11-17 1983-11-17 Semiconductor device Pending JPS60109283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21687283A JPS60109283A (en) 1983-11-17 1983-11-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21687283A JPS60109283A (en) 1983-11-17 1983-11-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS60109283A true JPS60109283A (en) 1985-06-14

Family

ID=16695234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21687283A Pending JPS60109283A (en) 1983-11-17 1983-11-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS60109283A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02303167A (en) * 1989-05-18 1990-12-17 Sanyo Electric Co Ltd Semiconductor device
US4988634A (en) * 1986-10-08 1991-01-29 Semiconductor Energy Laboratory Co., Ltd. Method for forming FET with a super lattice channel
JPH0334457A (en) * 1989-06-30 1991-02-14 Semiconductor Energy Lab Co Ltd Field effect semiconductor device
JPH0334459A (en) * 1989-06-30 1991-02-14 Semiconductor Energy Lab Co Ltd Manufacture of field effect semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4988634A (en) * 1986-10-08 1991-01-29 Semiconductor Energy Laboratory Co., Ltd. Method for forming FET with a super lattice channel
US5008211A (en) * 1986-10-08 1991-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming FET with a super lattice channel
JPH02303167A (en) * 1989-05-18 1990-12-17 Sanyo Electric Co Ltd Semiconductor device
JPH0334457A (en) * 1989-06-30 1991-02-14 Semiconductor Energy Lab Co Ltd Field effect semiconductor device
JPH0334459A (en) * 1989-06-30 1991-02-14 Semiconductor Energy Lab Co Ltd Manufacture of field effect semiconductor device

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