JPS60107363A - Fitting method for thermal head - Google Patents
Fitting method for thermal headInfo
- Publication number
- JPS60107363A JPS60107363A JP21519983A JP21519983A JPS60107363A JP S60107363 A JPS60107363 A JP S60107363A JP 21519983 A JP21519983 A JP 21519983A JP 21519983 A JP21519983 A JP 21519983A JP S60107363 A JPS60107363 A JP S60107363A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- thermal head
- solder
- printed board
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Electronic Switches (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（司 発明の技術分野
本発明はシリアルドツト記録方式のサーマルプリンタに
係り、特にサーマルヘッドと外部引出し線との接続方法
に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a serial dot recording type thermal printer, and more particularly to a method of connecting a thermal head to an external lead line.
山） 技術の背景
サーマルプリンタには、サーマルヘッドの上に多数個の
発熱体を横一列に配列して形成し、サーマルヘッドは動
かさずに印刷用紙のみを送りながら印刷するライントッ
ド記録方式と、サーマルへ・ノドの上に少数の発熱体を
形成し、印刷用紙を送ると共にサーマルヘッドを左右に
走査させながら印刷するシリアルドツト記録方式がある
。(Yama) Technology Background Thermal printers use a line-tod recording method, in which a large number of heating elements are arranged horizontally in a row on top of a thermal head, and the thermal head does not move, printing while feeding only the printing paper. There is a serial dot recording method in which a small number of heating elements are formed above the thermal nozzle, and the printing paper is sent while printing while the thermal head is scanned from side to side.
ライントッド記録方式用のサーマルヘッドは固定した状
態で用いられるために全体の重量は問題視されず、した
がってサーマルヘッド端子部の端子間隔を比較的広くと
って、外部引出し線との接続に各種の接続方法を採用で
きる自由度がある。Since the thermal head for the line-tod recording method is used in a fixed state, the overall weight is not a problem. There is a degree of freedom in adopting connection methods.
しかしシリアルドツト記録方式用の号−マルヘッドは高
速度で左右に走査させるために小形で且つ軽量であるこ
とが要求されている。しかもサーマルヘッドと外部引出
し線との接続部分に走査の都度繰り返して外力が掛かる
ため、その接続には高密度化が可能で且つ全体を小形化
、軽量化することができ、しかも丈夫な接続方法の導入
が望まれている。However, the multi-number head for the serial dot recording system is required to be small and lightweight in order to scan left and right at high speed. Moreover, since external force is repeatedly applied to the connection between the thermal head and the external lead wire each time scanning is performed, the connection can be made with higher density, and the overall size and weight can be reduced, and the connection method is durable. is desired to be introduced.
（Ｃ１従来技術と問題点
第１図は従来のシリアルドツト記録方式用のサーマルヘ
ッドの構造を表す図であり、第１図（ａｌは正面図、第
１図（ｂｌは側面図である。(C1 Prior Art and Problems) FIG. 1 is a diagram showing the structure of a conventional thermal head for serial dot recording.
シリアルドツト記録方式用のサーマルヘッド１はアルミ
ナ基板２の上に複数個の発熱体３が形成されており、発
熱体３の一端は共通電極４を経由して複数個の端子６の
一部に接続されている。また発熱体３の他の一端はセレ
クト電極５を経由して複数個の端子６のそれぞれの発熱
体３に対応する端子に接続されている。そして発熱体３
、共通電極４およびセレクト電極５は共に保護膜７によ
って覆われ保護されている。A thermal head 1 for serial dot recording has a plurality of heating elements 3 formed on an alumina substrate 2, and one end of the heating element 3 is connected to a part of a plurality of terminals 6 via a common electrode 4. It is connected. The other end of the heating element 3 is connected to one of the plurality of terminals 6 corresponding to each heating element 3 via a select electrode 5 . and heating element 3
, the common electrode 4 and the select electrode 5 are both covered and protected by a protective film 7.
かかるサーマルヘッドにおいて従来は所要本数の線材か
らなるケーブル８の一端を端末処理した後一本ずつ端子
６に半田付けし、サーマルヘッドの端子部と外部引出し
線の接続を行っている。そしてサーマルヘッドの移動に
よって半田付部分に外力が掛かるのを防止するために、
ケーブル８を金具９でサーマルヘッドに固定している。Conventionally, in such a thermal head, one end of a cable 8 made of a required number of wires is terminal-treated and then soldered one by one to a terminal 6 to connect the terminal portion of the thermal head to an external lead wire. In order to prevent external force from being applied to the soldering part due to the movement of the thermal head,
A cable 8 is fixed to the thermal head with a metal fitting 9.
しかしケーブルの一端を一本ずつ端子に半田付けするた
めには端子間隔を広くする必要があり、サーマルヘッド
の他の部分は高密度化されても号−マルヘッド全体では
小形化に寄与しないという問題があった。However, in order to solder one end of the cable to the terminal one by one, it is necessary to widen the spacing between the terminals, and even if the other parts of the thermal head are made denser, the overall head does not contribute to miniaturization. was there.
ｌｄｌ 発明の目的
本発明の目的はサーマルへノドの端子部と外部引出し線
の接続における前記問題を無くし、サーマルヘッドの小
形化、軽量化に寄与する実装方法を提供することにある
。ldl OBJECTS OF THE INVENTION An object of the present invention is to provide a mounting method that eliminates the above-mentioned problems in connecting the terminal portion of the thermal nozzle and the external lead wire, and contributes to reducing the size and weight of the thermal head.
（ｅｌ 発明の構成
そしてこの目的はサーマルへ・ノド端子部にＣｕ（銅）
を鍍金し、一方フレキシブルプリント坂の端子部に半田
を鍍金し、該サーマルへ・ノド端子部にフラックスを塗
布したる後、該サーマルへ・ノド端子部の上に該サーマ
ルヘッド端子部と該フレキシブルプリント板の端子部が
相面するようにフレキシブルプリント板を載置し、フレ
キシブルプリント板の裏面から加圧した状態で加熱して
半田を溶融せしめ、咳号−マルへ・ノド端子部と該フレ
キシブルプリント板の端子部を半田付けした後、加圧し
た状態で前記加熱部を冷却することで達成している。(el) The structure of the invention and its purpose is to use Cu (copper) for the thermal and throat terminals.
On the other hand, plate the terminal part of the flexible print slope with solder, apply flux to the thermal head terminal part, and then apply flux to the thermal head terminal part and the flexible print head terminal part to the thermal head and on the throat terminal part. Place a flexible printed board so that the terminals of the printed board are facing each other, and apply pressure from the back of the flexible printed board to heat it to melt the solder. This is achieved by cooling the heating section under pressure after soldering the terminals of the printed board.
（ｆｌ 発明の実施例 以下添付図により本発明の詳細な説明する。(fl Embodiments of the invention The present invention will be described in detail below with reference to the accompanying drawings.
第２図は本発明の一実施例を表す図であり、第２図（ａ
ｌは正面図、第２図（ｂ）は側面図である。なお第１図
と同じ対象物は同一符号で表してもする。FIG. 2 is a diagram showing one embodiment of the present invention, and FIG.
1 is a front view, and FIG. 2(b) is a side view. Note that the same objects as in FIG. 1 may be represented by the same symbols.
第２図においてサーマルへ・ノドの端子６にＣｕまたは
Ｎｉ−Ｃｕ１Ｏを鍍金する。サーマルへ・ノドの端子６
は一般に＾Ｕの薄膜または＾Ｕの薄膜の上に更にＡｕを
鍍金して構成されており、その上に半田を１寸番すると
肋が半田に拡散して断線等の障害を発生するので、Ａｕ
ＣｕまたはＡｕ Ｎｉ−Ｃｕ構成にすることによって
Ａｕが半田に拡散することを防止する。なお他の回路構
成に支障がなければ最初からＣｕでｆｉｔ成してもよい
。In FIG. 2, the thermal throat terminal 6 is plated with Cu or Ni--Cu1O. Thermal to throat terminal 6
Generally, it is constructed by plating a thin film of ^U or a thin film of ^U with Au, and if you apply solder on top of it, the ribs will spread into the solder and cause problems such as disconnection. Au
The Cu or Au Ni-Cu structure prevents Au from diffusing into the solder. Note that if there is no problem with other circuit configurations, the fit may be made of Cu from the beginning.
一方外部引出し線としてポリイミドフィルム１１八をベ
ースとし、その上に銅箔による配線パターンＩＩＢを形
成したフレキシブルプリント板１１を取す入れ、フレキ
シブルプリント板１１の端子（サーマルヘッドの端子６
に接続する部分）１２の表面に０．５〜５μ劇の半田鍍
金１３を行う。On the other hand, the flexible printed board 11, which is based on a polyimide film 118 and has a copper foil wiring pattern IIB formed thereon, is inserted as an external lead wire, and the terminals of the flexible printed board 11 (terminals 6 of the thermal head
Solder plating 13 with a thickness of 0.5 to 5 μm is applied to the surface of 12 (the part connected to the part) 12.
しかる後、サーマルヘッド１の端子６の表面にフラック
ス１４を塗布し、その上にサーマルヘッド１の端子６と
フレキシブルプリント板１１の端子１２が相面するよう
にフレキシブルプリント板１１を載置し、半田付けを行
う。After that, flux 14 is applied to the surface of the terminal 6 of the thermal head 1, and the flexible printed board 11 is placed thereon so that the terminal 6 of the thermal head 1 and the terminal 12 of the flexible printed board 11 face each other. Perform soldering.
第３図は半田付は方法を示した図である。半田付けは半
田鏝を使用せず熱圧着装置により行う。FIG. 3 is a diagram showing the soldering method. Soldering is performed using a thermocompression bonding device without using a soldering iron.
端子６と端子１２が相面するように重ねたサーマルヘッ
ドｌとフレキシブルプリント板１１を熱圧着装置にセン
トし、フレキシブルプリント板１１の裏面から熱圧着装
置のウェッジ１５で加圧した後、ウェッジを加熱してフ
レキシブルプリント板１１に鍍金されている半田１３を
溶融せしめ、半田が端子６と十分馴染んだところでウェ
ッジ１５を冷却する。Place the thermal head l and the flexible printed board 11 stacked so that the terminals 6 and 12 face each other in a thermocompression bonding device, apply pressure from the back side of the flexible printed board 11 with the wedge 15 of the thermocompression bonding device, and then press the wedge. The solder 13 plated on the flexible printed board 11 is heated and melted, and the wedge 15 is cooled when the solder is fully compatible with the terminal 6.
半田が溶融して端子６と十分に馴染み、冷却されて再度
固体化するまでの間加圧しておくことにより、半田付け
する間の端子６と端子１２の位置ずれを無くし、少ない
半田の量で従来の半田付けと同等の接続強度を持たせる
ことができる。また半田の量はフレキシブルプリント板
１１の端子１２の表面に行う半田鍍金１３の厚さでコン
トロールできるため、端子間のブリッジを無くすことが
可能になり端子ピッチを０．３ｍｍ程度まで高密度化す
ることができる。By applying pressure until the solder melts and fully blends with the terminals 6, cools down, and solidifies again, it is possible to eliminate misalignment between the terminals 6 and 12 during soldering, and to use a small amount of solder. It is possible to provide the same connection strength as conventional soldering. Furthermore, since the amount of solder can be controlled by the thickness of the solder plating 13 applied to the surface of the terminals 12 of the flexible printed board 11, it is possible to eliminate bridges between the terminals and increase the density of the terminal pitch to about 0.3 mm. be able to.
なお端子ピンチの高密度化によって端子部分の形状が小
形化されるため、金具等を用いてフレキシブルプリント
板１１をサーマルへラドに固定する必要は無く、第２図
Ｔｂ）に示した如くフレキシブルプリント板１１の周り
を樹脂１６で固めるだけで、サーマルヘッドの移動によ
って半田付部分に外力がｌ）かるのを防止することがで
きる。In addition, since the shape of the terminal part is made smaller by increasing the density of the terminal pinch, there is no need to use metal fittings or the like to fix the flexible printed board 11 to the thermal pad, and the flexible printed board 11 can be printed as shown in FIG. By simply hardening the area around the plate 11 with the resin 16, it is possible to prevent external force from being applied to the soldering portion due to movement of the thermal head.
また別の方法としてサーマルヘッドの端子部を八〇のま
まとし、フレキシブルプリント板の端子部にＡｕを鍍金
して熱圧着法によって＾ｕ−Ａｕ共晶を形成して両方の
端子を接続する方法もあるが、接続強度が極めて弱く、
サーマルヘッドと外部引出し線との接続部分に走査の都
度繰り返して外力が掛かる、シリアルドツト記録方式用
のサーマルヘッドと外部引出し線との接続方法としては
適当ではない。Another method is to leave the terminal part of the thermal head as 80, plate the terminal part of the flexible printed board with Au, and form a u-Au eutectic using thermocompression bonding to connect both terminals. However, the connection strength is extremely weak,
This is not suitable as a method of connecting a thermal head and an external lead line for serial dot recording, in which external force is repeatedly applied to the connection between the thermal head and the external lead line each time a scan is performed.
１ｇ） 発明の効果
以上述べたように本発明によれば、サーマルヘッドの小
形化、軽量化に寄与するサーマルヘッドの端子部と外部
引出し線の接続方法を提供することができる。1g) Effects of the Invention As described above, according to the present invention, it is possible to provide a method for connecting the terminal portion of a thermal head and an external lead wire, which contributes to miniaturization and weight reduction of the thermal head.
第１図は従来のシリアルドツト記録方式用のサーマルヘ
ッドの構造を表す図で、第１図（ａ）は正面図、第１図
（ｂ）は側面図、第２図は本発明の一実施例を表す図で
、第２図（ａ）は正面図、第２図（ｂｌは側面図、第３
図は本発明になる半田付は方法を示した図である。
図において１はす７マルヘツド、２はアルミナ基板、３
は発熱体、４は共通電極、５はセレクト電極、６はサー
マルヘッドの端子、７は保護膜、ｌＯはＣｕまたはＮｉ
−Ｃｕ鍍金層、１１はフレキシブルプリント板、１２は
フレキシブルプリント板の端子、１１Ａはポリイミドフ
ィルム、ｌＩＢは配線ノイターン、１３は半田鍍金層、
１４はフラ・ノクス、１５１まウェッジ、１６は樹脂を
表す。
第 １ 図 （ａ） （ｂ）
第２図 （α） ＜５
第 ３ 図FIG. 1 is a diagram showing the structure of a conventional thermal head for serial dot recording, in which FIG. 1(a) is a front view, FIG. 1(b) is a side view, and FIG. 2 is an embodiment of the present invention. Figure 2 (a) is a front view, Figure 2 (bl is a side view, Figure 3 is a side view,
The figure shows a soldering method according to the present invention. In the figure, 1 is a 7-marhead, 2 is an alumina substrate, and 3
is a heating element, 4 is a common electrode, 5 is a select electrode, 6 is a terminal of a thermal head, 7 is a protective film, IO is Cu or Ni
-Cu plating layer, 11 is a flexible printed board, 12 is a terminal of the flexible printed board, 11A is a polyimide film, IIB is a wiring noiturn, 13 is a solder plating layer,
14 represents Fura Nox, 151 represents wedge, and 16 represents resin. Figure 1 (a) (b) Figure 2 (α) <5 Figure 3
Claims (1)
レキシブルプリント板の端子部に半田を鍍金し、該サー
マルヘッド端子部にフラックスを塗布したる後、該サー
マルヘッド端子部の上に該サーマルヘッド端子部と該フ
レキシブルプリント板の端子部が相面するようにフレキ
シブルプリント板を載置し、フレキシブルプリント板の
裏面から加圧した状態で加熱して半田を溶融せしめ、該
サーマルへ・ノド端子部と該フレキシブルプリント板の
端子部を半田付けした後、加圧した状態で前記加熱部を
冷却することを特徴とするサーマルヘッド実装法。After plating the thermal head terminal part with Cu (copper), plating the terminal part of the flexible printed board with solder, and applying flux to the thermal head terminal part, the thermal head is placed on top of the thermal head terminal part. Place the flexible printed board so that the terminal part and the terminal part of the flexible printed board face each other, heat the flexible printed board under pressure from the back side to melt the solder, and apply it to the thermal terminal. A thermal head mounting method characterized in that after soldering the terminal portions of the flexible printed board, the heating portion is cooled under pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21519983A JPS60107363A (en) | 1983-11-16 | 1983-11-16 | Fitting method for thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21519983A JPS60107363A (en) | 1983-11-16 | 1983-11-16 | Fitting method for thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60107363A true JPS60107363A (en) | 1985-06-12 |
Family
ID=16668326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21519983A Pending JPS60107363A (en) | 1983-11-16 | 1983-11-16 | Fitting method for thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60107363A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62162562A (en) * | 1986-01-13 | 1987-07-18 | Alps Electric Co Ltd | Thermal head |
| JPH02226795A (en) * | 1989-02-28 | 1990-09-10 | Matsushita Electric Ind Co Ltd | Parts mounting method and parts fixing method |
| JPH039856A (en) * | 1989-06-07 | 1991-01-17 | Kyocera Corp | Thermal head |
-
1983
- 1983-11-16 JP JP21519983A patent/JPS60107363A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62162562A (en) * | 1986-01-13 | 1987-07-18 | Alps Electric Co Ltd | Thermal head |
| JPH0586346B2 (en) * | 1986-01-13 | 1993-12-10 | Alps Electric Co Ltd | |
| JPH02226795A (en) * | 1989-02-28 | 1990-09-10 | Matsushita Electric Ind Co Ltd | Parts mounting method and parts fixing method |
| JPH039856A (en) * | 1989-06-07 | 1991-01-17 | Kyocera Corp | Thermal head |
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