JPS60105246A - Holding equipment for substrate - Google Patents
Holding equipment for substrateInfo
- Publication number
- JPS60105246A JPS60105246A JP21234683A JP21234683A JPS60105246A JP S60105246 A JPS60105246 A JP S60105246A JP 21234683 A JP21234683 A JP 21234683A JP 21234683 A JP21234683 A JP 21234683A JP S60105246 A JPS60105246 A JP S60105246A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- spring
- mounting surface
- pawl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
装
本発明は、基板保持〆置に係り、特に基板受台の基板載
置面に載置保持された基板をドライプロセスにて処理す
る半導体製造装置に好適な基板保持装置に関するもので
ある。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a device for holding and holding a substrate, and in particular to semiconductor manufacturing in which a substrate placed and held on a substrate mounting surface of a substrate holder is processed by a dry process. The present invention relates to a substrate holding device suitable for the device.
ドライエツチング装置、スパッタリング装置等の半導体
製造装置では、真空処理室内で基板受台の基板載置面に
載置保持された基板がドライプロセスにて処理される。In semiconductor manufacturing equipment such as dry etching equipment and sputtering equipment, a substrate placed and held on a substrate mounting surface of a substrate holder in a vacuum processing chamber is processed by a dry process.
基板受台の基板載置面への基板の載置保持技術としては
、従来、基板受台の基板載置面に基板を単に載置保持す
る技術、基板受台の基板＠置部に載置された基板を往復
動可能な固定具で基板受台の基板載置面に押圧し固定し
て保持する技術、バネで形成された爪で基板を把持する
技術、真空吸着により基板を基板受台の基板載置面に吸
着固定し保持する技術等が慣用されている〇
この内、基板受台に基板を単に載置保持する技術は、略
水平に設けられた基板受台の基板載置面に基板を載置す
る場合は問題ないが、基板受台が、例えば略垂直に設け
られている場合は、基板を基板受台の基板載置面に良好
に保持することできない。また、基板受台の基板載置面
に載置された基板を往復動可能な固定具で基板受台の基
板載置面に押圧し固定する技術は、基板受台が姿勢自在
であっても問題なく使用できるものの、固定具を往復動
させる駆動装置、例えば、シリンダを設ける必要がある
ため構造が複雑となり半導体製造装置が大型化する。ま
た、バネで形成された爪で基板を把持する技術は、基板
を爪で把持した後に基板の裏面に基板受台の基板載置面
を当接させる必要があるため、操作が複雑となると共に
、基板受台の基板載置面を基板の裏面に当接させる装置
を設ける必要があるため、構造が複雑となり半導体製造
装置が大型化する。また、真空吸着により基板受台の基
板載置面に吸着固定する技術は、基板受台の基板載置面
側が真空雰囲気である場合には使用不可である。Conventional techniques for placing and holding a board on the board placement surface of a board holder include a technique in which the board is simply placed and held on the board placement surface of the board holder, and a technique in which the board is placed on the board @ placement part of the board holder. A technology that uses a reciprocating fixture to press and fix the board on the board mounting surface of a board holder, a technology that grips the board with spring-formed claws, and a technology that uses vacuum suction to hold the board on the board holder. Among these, the technique of simply placing and holding the board on a board holder is commonly used to hold the board by suction on the board mounting surface of the board holder, which is installed approximately horizontally. There is no problem if the substrate is placed on the substrate holder, but if the substrate holder is provided, for example, substantially vertically, the substrate cannot be held well on the substrate placement surface of the substrate holder. In addition, the technology of pressing and fixing the board mounted on the board mounting surface of the board holder using a reciprocating fixture against the board mounting surface of the board cradle, even if the board holder can be positioned freely. Although it can be used without problems, it requires a drive device, such as a cylinder, to reciprocate the fixture, which complicates the structure and increases the size of the semiconductor manufacturing equipment. In addition, the technique of gripping the board with spring-formed claws requires the board mounting surface of the board holder to be brought into contact with the back side of the board after the board is gripped with the claws, which makes the operation complicated and Since it is necessary to provide a device for bringing the substrate mounting surface of the substrate holder into contact with the back surface of the substrate, the structure becomes complicated and the semiconductor manufacturing apparatus becomes larger. Further, the technique of suctioning and fixing the substrate to the substrate mounting surface of the substrate holder using vacuum suction cannot be used when the substrate mounting surface side of the substrate holder is in a vacuum atmosphere.
本発明の目的は、基板を基板受台の基板載置面置皿に基
板を良好に保持できる基板保持装置を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate holding device that can properly hold a substrate on a substrate mounting plate of a substrate holder.
本発明は、姿勢自在な基板受台と、談合の基板載置面の
周囲に配設された爪と、該爪を介して基板を基板受台の
基板載置面に押圧するバネと、該バネのバネ力に抗して
基板受台の基板載置面への基板の押圧を解除する爪押し
具とで構成したことを特徴とするもので、基板を基板受
台の基板載置面に爪を介してバネ力で押圧し固定して保
持しようとしたものである。The present invention provides a substrate holder that can be freely positioned, a claw disposed around the substrate mounting surface of the rigging, a spring that presses the substrate against the substrate mounting surface of the board holder via the claw, and The device is characterized by a claw pusher that releases the pressure of the board against the board mounting surface of the board holder against the spring force of the spring, and the device is characterized by a claw pushing tool that releases the pressure of the board against the board mounting surface of the board holder. This is an attempt to hold it in place by pressing it with spring force through a claw.
本発明の一実施例を第１図により説明する。 An embodiment of the present invention will be described with reference to FIG.
第１図で、基板保持装置は、基板受台１０と承句とバネ
（資）と爪押し共和とで構成されている。基板受台１０
の形状は、この場合、基板載置面が突設された形状であ
り、基板受台１０の基板載置面の周囲には、例えば、複
数個の承句が適正間隔で配設されている。承句の配設位
置に対応してバネ取付棒（資）力≦基板受台１０の基板
載置面の周囲に設けられ、バネ取付棒５０には、一端部
を基板受台１０に当接してバネ（資）が設けられている
。バネ関の他端部には承句が設けられ、爪（イ）の基板
載置面側端部は、基板受台１０の基板載置面に載置され
た基板６０の外周辺に当接可能となっている。承句の基
板載置面反対側端部に対応して爪押し共和が往復動可能
に設けられている。In FIG. 1, the substrate holding device is composed of a substrate holder 10, a spring, and a claw pusher. Board holder 10
In this case, the shape is such that the board mounting surface is protruded, and for example, a plurality of testimonials are arranged at appropriate intervals around the board mounting surface of the board holder 10. . The spring mounting rod (material) force is provided around the board mounting surface of the board holder 10 in accordance with the arrangement position of the spring mounting rod 50, and one end of the spring mounting rod 50 is in contact with the board holder 10. A spring is provided. The other end of the spring fitting is provided with a seal, and the end of the claw (a) on the board mounting surface side comes into contact with the outer periphery of the board 60 placed on the board mounting surface of the board holder 10. It is possible. A claw pusher is provided so as to be reciprocally movable corresponding to the opposite end of the substrate mounting surface.
基板萄は、公知の搬送装置、例えば、メカニカルチャッ
クを有する搬送装置（図示省略）により基板受台ｌＯの
基板載置面と対応する位置まで搬送された後に、メカニ
カルチャックを基板載置面側に移動させることで基板受
台１０の基板載置面に載置される。この場合、爪押し具
４０をメカニカルチャックに設け、爪押し具４０はメカ
ニカルチャックの基板載置面側への移動に伴い承句の基
板載置面反対側端部に当接した後、バネ（資）のバネ力
に抗して承句の基板載置面側端部をメカニカルチャック
による基板６０の基板載置面への載置を阻害しない位置
まで退避させる。基板ωを基板載置面に載置させた後に
メカニカルチャックは光の位置まで移動し、これに伴い
爪押し共和も移動する。これにより、基板６０の外周辺
には、爪（イ）の基板載置面側端部が当接し、基板ωは
爪加な介してバネ園のバネ力により基板受台１００基板
載置面に押圧され固定されて保持される。なお、ドライ
プロセスによる処理完了後、メカニカルチャックを基板
受台１０の基板載置面側に移動させることで、基板ωの
基板受台１０の基板載置面への押圧は爪押し共和により
バネ凹のバネカ毫こ抗して解除され、基板６０はメカニ
カルチャックで把持されて搬送装置壷こより他の場所へ
搬送される。The substrate is transported to a position corresponding to the substrate mounting surface of the substrate pedestal IO by a known transport device, for example, a transport device having a mechanical chuck (not shown), and then the mechanical chuck is moved to the substrate mounting surface side. By moving it, it is placed on the substrate placement surface of the substrate holder 10. In this case, the claw pusher 40 is provided on the mechanical chuck, and the claw pusher 40 comes into contact with the opposite end of the substrate mounting surface as the mechanical chuck moves toward the substrate mounting surface, and then the spring ( The end portion of the substrate mounting surface side of the substrate is retracted against the spring force of the mechanical chuck to a position where it does not interfere with the placement of the substrate 60 on the substrate mounting surface by the mechanical chuck. After placing the substrate ω on the substrate mounting surface, the mechanical chuck moves to the position of the light, and the claw pushers also move accordingly. As a result, the edge of the claw (a) on the board mounting surface side comes into contact with the outer periphery of the board 60, and the board ω is brought into contact with the board mounting surface of the board holder 100 by the spring force of the spring garden through the claw. It is pressed, fixed and held. After completion of the dry process, by moving the mechanical chuck to the substrate mounting surface of the substrate pedestal 10, the pressure of the substrate ω against the substrate mounting surface of the substrate pedestal 10 is reduced by the spring concavity due to the claw pressing force. The spring is released against the pressure, and the substrate 60 is gripped by a mechanical chuck and transported from the transporting device jar to another location.
本実施例のような基板保持装置は、基板を基板受台に爪
を介してバネ力で押圧し固定して保持できるため、次の
ような効果が得られる。The substrate holding device according to this embodiment can press and fix the substrate on the substrate holder using the spring force through the claws, and therefore, the following effects can be obtained.
（１）基板受台がどのような位置に設けられていようと
も、即ち、姿勢自在であっても基板を基板受台の基板載
置面に良好に保持することができる。(1) Regardless of the position of the substrate holder, that is, even if the substrate holder is freely positioned, the substrate can be satisfactorily held on the substrate mounting surface of the substrate holder.
（２）特別な駆動装置等が不用であり、構造を簡単化で
き半導体製造装置をコンパクト化できる。(2) A special drive device or the like is not required, and the structure can be simplified and the semiconductor manufacturing equipment can be made more compact.
（３） 基板の基板受合の基板載置面への保持操作を簡
単化できる。(3) It is possible to simplify the operation of holding the substrate on the substrate receiving surface.
（４）基板受台の基板載置面側が真空雰囲気であっても
問題なく使用できる。(4) It can be used without any problem even if the substrate mounting surface side of the substrate holder is in a vacuum atmosphere.
第２図は、本発明による基板保持装置の他の実施例を説
明するもので、爪加′の基板載置面側端部の形状は、基
板受金工０の基板載置面に載置された基板印の側面のみ
に当接可能な形状となっている。FIG. 2 explains another embodiment of the substrate holding device according to the present invention. It has a shape that allows it to come into contact only with the side surface of the printed circuit board mark.
なお、第２図で、第１図と同一部品等は同一符号で示し
説明を省略する。Note that in FIG. 2, the same parts as those in FIG.
このような基板保持装置では、上記一実施例に比べ更に
次のような効果が得られる。With such a substrate holding device, the following effects can be obtained as compared to the above embodiment.
（１）爪の基板載置面側端部が基板表面に接触しないた
め、爪による基板表面の損傷を防止でき、また、基板表
面に膜が形成される場合は、爪による膜の剥離を防止で
きる。(1) Since the edge of the nail on the substrate mounting surface does not touch the substrate surface, damage to the substrate surface caused by the nail can be prevented. Also, if a film is formed on the substrate surface, the peeling of the film due to the nail can be prevented. can.
なお、基板受台の基板載置面は、基板よりも大きくても
小さくても良い。また、基板受台の基板載置面が基板よ
りも太き（、搬送装置としてメカニカルチャックを有す
る搬送装置を用いる場合は、基板載置面にチャック爪の
逃し溝等を形成する必要がある。Note that the substrate mounting surface of the substrate holder may be larger or smaller than the substrate. In addition, the substrate mounting surface of the substrate holder is thicker than the substrate (if a transfer device having a mechanical chuck is used as the transfer device, relief grooves for chuck claws, etc. must be formed on the substrate placement surface).
本発明は、以上説明したように、姿勢自在な基板受台と
、談合の基板載置面の周囲に配設された爪と、該爪を介
して基板を基板受台の基板載置面に押圧するバネと、該
バネのバネ力に抗して基板受台の基板載置面への基板の
抑圧を解除する爪押し具とで構成したことで、簡単な構
造で姿勢自在な基板受台の基板載置面（二基板を良好裔
こ保持できるという効果がある。As described above, the present invention includes a substrate holder that can be freely positioned, a claw provided around the substrate mounting surface of the rigging, and a substrate placed on the substrate mounting surface of the board holder via the claw. This board holder has a simple structure and can be positioned freely, as it is composed of a pressing spring and a claw pusher that releases the suppression of the board from the board mounting surface of the board holder against the spring force of the spring. The substrate mounting surface (has the effect of being able to properly hold two substrates side by side).
第１図は、本発明による基板保持装置の一実施例を示す
縦断面図、第２図（ま、本発明曝こよる基板保持装置の
他の実施例を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing one embodiment of the substrate holding device according to the present invention, and FIG. 2 is a longitudinal sectional view showing another embodiment of the substrate holding device according to the present invention.
Claims (1)
配置された爪と、該爪を介して前ｉｃ基板を前記基板受
台の基板載置面に押圧するバネと、該バネのバネ力に坑
して前記基板受台の基板載置面への前記基板の抑圧を解
除する爪押し具とで構成したことを特徴とする基板保持
装置。1. A board holder that can be positioned freely; a claw disposed around the board mounting surface of the rigging; a spring that presses the front IC board against the board mounting surface of the board holder via the claw; 1. A substrate holding device comprising a claw pusher that releases the substrate from being pressed against the substrate mounting surface of the substrate holder by resisting the spring force of a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21234683A JPS60105246A (en) | 1983-11-14 | 1983-11-14 | Holding equipment for substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21234683A JPS60105246A (en) | 1983-11-14 | 1983-11-14 | Holding equipment for substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60105246A true JPS60105246A (en) | 1985-06-10 |
Family
ID=16621012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21234683A Pending JPS60105246A (en) | 1983-11-14 | 1983-11-14 | Holding equipment for substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105246A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6863735B1 (en) * | 1998-07-27 | 2005-03-08 | Super Silicon Crystal Research Institute Corp. | Epitaxial growth furnace |
-
1983
- 1983-11-14 JP JP21234683A patent/JPS60105246A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6863735B1 (en) * | 1998-07-27 | 2005-03-08 | Super Silicon Crystal Research Institute Corp. | Epitaxial growth furnace |
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