JPS60105203A - Method of producing thick film resistor - Google Patents
Method of producing thick film resistorInfo
- Publication number
- JPS60105203A JPS60105203A JP58212742A JP21274283A JPS60105203A JP S60105203 A JPS60105203 A JP S60105203A JP 58212742 A JP58212742 A JP 58212742A JP 21274283 A JP21274283 A JP 21274283A JP S60105203 A JPS60105203 A JP S60105203A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film resistor
- ceramic substrate
- resistor
- glass layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は高誘電率セラミック基板をベース材とし、その
ベース材上に異なる抵抗値の厚膜抵抗体を形成する厚膜
抵抗体の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a thick film resistor using a high dielectric constant ceramic substrate as a base material and forming thick film resistors with different resistance values on the base material. It is.
従来例の構成とその問題点
近年、セラミック基板を使用したハイブリッド回路及び
部品は、高密度化、複合化に向けて進歩が目ざましいも
のである。Conventional Structures and Their Problems In recent years, hybrid circuits and components using ceramic substrates have made remarkable progress toward higher density and more complex designs.
従来、高誘電率セラミック基板に異なる抵抗値の厚膜抵
抗体を形成する場合、第１図および第２図に示すように
高誘電率セラミック基板（以下単にセラミック基板と称
する）１上に低誘電率ガラス層（以下単にガラス層と称
する）２を印刷、乾燥、焼成し、このガラス層２および
セラミック基板１上に例えば銀、パラジウム等の導体３
，４を印刷、乾燥、焼成し、その後筒１の厚膜抵抗体６
を例えばシート抵抗１ＫＱで印刷、乾燥し、次いで第２
の厚膜抵抗体６を例えばシート抵抗１００ＫＱで印刷、
乾燥することにより、異なる上記厚膜抵抗体を焼成する
方法が採用されていた。しかしながら上記の方法の場合
、ガラス層２がないと、抵抗値が高い抵抗にシフトする
ためであるが、抵抗体の形成時に別々のシート抵抗の厚
膜ペーストを印刷、乾燥する工程をくり返さざるを得な
く、多大の工数を要していた。しかも上記した例では２
つの抵抗体の場合であるが、多数個かつシート抵抗が異
なる場合でも同様で、工数は個数に比例して増大し、多
大の工数がかかるという問題点を有していノこ。Conventionally, when forming thick-film resistors with different resistance values on a high-permittivity ceramic substrate, as shown in Figs. A glass layer (hereinafter simply referred to as a glass layer) 2 is printed, dried, and fired, and a conductor 3 of silver, palladium, etc. is formed on the glass layer 2 and the ceramic substrate 1.
, 4 are printed, dried, and fired, and then the thick film resistor 6 of the tube 1 is printed.
For example, a sheet resistance of 1KQ is printed, dried, and then a second
For example, print the thick film resistor 6 with a sheet resistance of 100KQ,
A method has been adopted in which the different thick film resistors are fired by drying. However, in the case of the above method, if the glass layer 2 is not present, the resistance value will shift to a higher resistor, but when forming the resistor, the process of printing and drying thick film pastes of separate sheet resistors must be repeated. This required a large amount of man-hours. Moreover, in the above example, 2
This is the case with one resistor, but the same is true when there are a large number of resistors with different sheet resistances.The problem is that the number of man-hours increases in proportion to the number of resistors, and a large number of man-hours are required.
発明の目的
本発明は、上記の欠点に鑑み、セラミック基板」二に容
易に異なる抵抗値の厚膜抵抗体を形成することが出来る
厚膜抵抗体の製造方法を提供することを目的とするもの
である。OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, it is an object of the present invention to provide a method for manufacturing a thick film resistor that can easily form thick film resistors with different resistance values on a ceramic substrate. It is.
発明の構成
この目的を達成するために、本発明の厚膜抵抗体の製造
方法は、同一シート抵抗の厚膜ペーストを利用し、ガラ
ス層をセラミック基板と抵抗間に形成する抵抗体と、ガ
ラス層を抵抗とセラミック基板間に形成しない抵抗体に
より、抵抗値をコントロールすることを特徴とするもの
で、ガラス層を形成しない厚膜抵抗体はセラミック基板
と厚膜抵抗体中のガラスフリットの相互反応により、抵
抗値がガラス層上に形成されたものに比べて高い方にレ
ベルシフトすることを利用している。Structure of the Invention In order to achieve this object, the method for manufacturing a thick film resistor of the present invention utilizes a thick film paste of the same sheet resistance, and a resistor in which a glass layer is formed between a ceramic substrate and a resistor, and a glass The resistor is characterized by controlling the resistance value by using a resistor that does not form a layer between the resistor and the ceramic substrate.Thick film resistors that do not have a glass layer are made by forming a layer between the ceramic substrate and the glass frit in the thick film resistor. It takes advantage of the fact that the resistance level shifts to a higher level than that formed on the glass layer due to the reaction.
実施例の説明
第３図および第４図は本発明の一実施例を示しており、
図中、１はセラミｙり基板、２はガラス層で、印刷、乾
燥、焼成されて上記セラミック基板１上に構成されてい
る。３．４は導体で、印刷、乾燥、焼成されている。５
，５′は厚膜抵抗体であり、同一シート抵抗の厚膜抵抗
ペーストを印刷、乾燥、焼成されて構成されている。こ
こで厚膜抵抗体５の抵抗値より厚膜抵抗体（ガラス層２
なし）６′の方が高く形成されている。ガラス層２は厚
膜抵抗ペースト中のガラスフリットとセラミック基板１
との焼成時における相互反応のバッファ効果を有してお
シ、ガラス層２がない場合、上記バッファ効果が生じず
、同一シート抵抗の抵抗値が高い方にシフトする。DESCRIPTION OF EMBODIMENTS FIGS. 3 and 4 show an embodiment of the present invention.
In the figure, 1 is a ceramic substrate, and 2 is a glass layer, which is printed, dried, and fired on the ceramic substrate 1. 3.4 is a conductor, printed, dried and fired. 5
, 5' are thick film resistors, which are constructed by printing, drying, and baking thick film resistor pastes having the same sheet resistance. Here, the resistance value of the thick film resistor 5 is higher than that of the thick film resistor (glass layer 2
None) 6' is formed higher. Glass layer 2 consists of glass frit in thick film resistor paste and ceramic substrate 1
If there is no glass layer 2, the buffer effect will not occur and the resistance value of the same sheet resistance will shift to the higher side.
上記のように構成すると、ある抵抗値と、それよシも高
い抵抗値を形成する場合、ガラス層２の形成の有無でコ
ントロール可能となる。しかも従来例と異なり、抵抗体
６，５′は同一シート抵抗の厚膜ペーストで作成するこ
とが出来るものである。With the above configuration, when forming a certain resistance value and a higher resistance value, it is possible to control the resistance value by whether or not the glass layer 2 is formed. Moreover, unlike the conventional example, the resistors 6 and 5' can be made of thick film paste having the same sheet resistance.
即ち従来例では別々のシート抵抗の厚膜ペーストを印刷
、乾燥を繰シ返す工程が一回の印刷、乾燥の工程で行な
える利点テＶある。That is, there is an advantage that the process of repeatedly printing and drying thick film pastes of different sheet resistances can be performed in one printing and drying process in the conventional example.
なお、本実施例では、厚膜抵抗体が２つの場合を示した
が、多数個の形成でもよいわけであり、セラミック基板
１は、例えば、内部に積層された電極を有するチップコ
ンデンサであってもよいわけである。Although this embodiment shows the case where there are two thick film resistors, it is also possible to form a large number of resistors, and the ceramic substrate 1 may be, for example, a chip capacitor having electrodes stacked inside. That's good too.
発明の効果
以上のように本発明は、高誘電率セラミック基板に異な
る抵抗値の厚膜抵抗体をより少ない工数で複数個同時に
形成することが出来、その生産工程の合理化、あるいは
、印刷するだめのスクＩＪ−ン製版が版数を共用化する
ことができる等の多大の効果を有するものである。Effects of the Invention As described above, the present invention enables the simultaneous formation of multiple thick-film resistors with different resistance values on a high-permittivity ceramic substrate with fewer man-hours, streamlining the production process or reducing printing costs. This method has many advantages, such as the ability to share the number of versions in screen IJ plate making.
第１図は従来の厚膜抵抗体基板の平面図、第２図はその
Ａ −Ａ’線断面図、第３図は本発明の厚膜抵抗体の製
造方法の一実施例を示す抵抗基板の平面図、第４図はそ
のＢ −Ｂ’線断面図である。
１ ・セラミック基板、２ ガラス層、３．４・ 導体
、５，５′ ・厚膜抵抗体。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第３図
第４図FIG. 1 is a plan view of a conventional thick film resistor substrate, FIG. 2 is a cross-sectional view taken along the line A-A', and FIG. 3 is a resistor substrate showing an embodiment of the thick film resistor manufacturing method of the present invention. FIG. 4 is a sectional view taken along the line B-B'. 1. Ceramic substrate, 2. Glass layer, 3.4. Conductor, 5, 5'. Thick film resistor. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3 Figure 4
Claims (1)
を形成する際に、上記高誘電率セラミック基板上に形成
した、低誘電率ガラス層上に第１の厚膜抵抗体を形成す
ると同時に、上記高誘電率セラミック基板上に低誘電率
ガラス層を形成せずに同一シート抵抗の厚膜ペーストを
使用して上記第１の厚膜抵抗体よりも高い面積抵抗値を
有する第２の厚膜抵抗体を形成することを特徴とする厚
膜抵抗体の製造方法。When forming thick film resistors with different resistance values on a high dielectric constant ceramic substrate, at the same time a first thick film resistor is formed on a low dielectric constant glass layer formed on the high dielectric constant ceramic substrate. , a second thickness having a higher sheet resistance value than the first thick film resistor by using a thick film paste of the same sheet resistance without forming a low dielectric constant glass layer on the high dielectric constant ceramic substrate; A method for manufacturing a thick film resistor, the method comprising forming a film resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58212742A JPS60105203A (en) | 1983-11-11 | 1983-11-11 | Method of producing thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58212742A JPS60105203A (en) | 1983-11-11 | 1983-11-11 | Method of producing thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60105203A true JPS60105203A (en) | 1985-06-10 |
Family
ID=16627674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58212742A Pending JPS60105203A (en) | 1983-11-11 | 1983-11-11 | Method of producing thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105203A (en) |
-
1983
- 1983-11-11 JP JP58212742A patent/JPS60105203A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60105203A (en) | Method of producing thick film resistor | |
| JP2556065B2 (en) | Manufacturing method of electronic component with built-in resistor | |
| JPS6045095A (en) | Method of producing thick film multilayer board | |
| JPS62169301A (en) | Temperature coefficient regulation of thick film resistance element | |
| JPH0795483B2 (en) | Method for manufacturing thick film resistance element | |
| JPH0127565B2 (en) | ||
| JPS61154195A (en) | Manufacture of thin film printed circuit board | |
| JPS5972715A (en) | Laminated condenser | |
| JPS61154104A (en) | Film resistor | |
| JPS59143304A (en) | Method of producing chip-shaped electronic part | |
| JPS5963702A (en) | Printed resistance part | |
| JPS6365601A (en) | Manufacture of network resistor | |
| JPS5816502A (en) | Electronic part and method of producing same | |
| JPS60167496A (en) | Method of producing thick film multilayer substrate | |
| JPH05335743A (en) | Multilayer circuit board | |
| JPS60171793A (en) | Method of producing multilayer circuit board | |
| JPS6262501A (en) | Thick film substrate unit | |
| JPS58202503A (en) | Method of producing thick film resistor | |
| JPS61101016A (en) | Laminated thick film capacitor element | |
| JPS59113681A (en) | Circuit board | |
| JPS5873183A (en) | Printed circuit board with printed coil | |
| JPS58158902A (en) | Printed resistance unit | |
| JPS60175495A (en) | Multilayer board | |
| JPS6337601A (en) | Chip resistor and manufacture of the same | |
| JPS61154197A (en) | Thick film multilayer substrate |