JPS599625U - Filter package - Google Patents

Filter package

Info

Publication number
JPS599625U
JPS599625U JP10478682U JP10478682U JPS599625U JP S599625 U JPS599625 U JP S599625U JP 10478682 U JP10478682 U JP 10478682U JP 10478682 U JP10478682 U JP 10478682U JP S599625 U JPS599625 U JP S599625U
Authority
JP
Japan
Prior art keywords
filter
filter package
chip
rod
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10478682U
Other languages
Japanese (ja)
Inventor
猪原　淳一
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP10478682U priority Critical patent/JPS599625U/en
Publication of JPS599625U publication Critical patent/JPS599625U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案によるフィルタパッケージのキャップ装
着前を示す斜視図、第２図はキャップ装゛着直前の斜視
図である。 １・・・薄板、２・・・導電性棒、４・・・フィルタチ
ップ、６・・・導電性接着剤、７・・・引出し電極、９
・・・キャップ。FIG. 1 is a perspective view of the filter package according to the present invention before the cap is attached, and FIG. 2 is a perspective view of the filter package just before the cap is attached. DESCRIPTION OF SYMBOLS 1... Thin plate, 2... Conductive rod, 4... Filter chip, 6... Conductive adhesive, 7... Extraction electrode, 9
···cap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄板に設けた貫通孔に導電性を有する棒を挿入してなる
基板上に、フィルタチップを貼り付け、該フィルタチッ
プの電極と前記棒とを導電性の接着剤又は半田で接続し
、該フィルタチップ上方に空間を保持するエポキシ系樹
脂から成るキャップを、該基板に貼着してなるフィルタ
パッケージ。A filter chip is pasted on a substrate formed by inserting a conductive rod into a through hole provided in a thin plate, and the electrode of the filter chip and the rod are connected with a conductive adhesive or solder. A filter package in which a cap made of epoxy resin that maintains a space above the chip is attached to the substrate.
JP10478682U 1982-07-09 1982-07-09 Filter package Pending JPS599625U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10478682U JPS599625U (en) 1982-07-09 1982-07-09 Filter package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10478682U JPS599625U (en) 1982-07-09 1982-07-09 Filter package

Publications (1)

Publication Number Publication Date
JPS599625U true JPS599625U (en) 1984-01-21

Family

ID=30245892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10478682U Pending JPS599625U (en) 1982-07-09 1982-07-09 Filter package

Country Status (1)

Country Link
JP (1) JPS599625U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188722U (en) * 1984-11-16 1986-06-10

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216147A (en) * 1975-07-30 1977-02-07 Hitachi Ltd Pacage method for surface elastic wave element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216147A (en) * 1975-07-30 1977-02-07 Hitachi Ltd Pacage method for surface elastic wave element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188722U (en) * 1984-11-16 1986-06-10

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