JPS599554U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS599554U
JPS599554U JP10452782U JP10452782U JPS599554U JP S599554 U JPS599554 U JP S599554U JP 10452782 U JP10452782 U JP 10452782U JP 10452782 U JP10452782 U JP 10452782U JP S599554 U JPS599554 U JP S599554U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
lead terminal
semiconductor device
package
plug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10452782U
Other languages
Japanese (ja)
Other versions
JPH042478Y2 (en
Inventor
夏目　英敏
嘉田　守宏
南出　彰三
井口　憲昭
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP10452782U priority Critical patent/JPS599554U/en
Publication of JPS599554U publication Critical patent/JPS599554U/en
Application granted granted Critical
Publication of JPH042478Y2 publication Critical patent/JPH042478Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の半導体装置の実装形態を示す斜視図、第
２図は本考案による半導体装置の実装形態を示す斜視図
、第３図、第４図及び第５図は本考案による半導体装置
の実施例を示す斜視図である。 １０：半導体装置、１１：リードフレーム、１２：′リ
ード端子、１３：樹脂パッケージ。FIG. 1 is a perspective view showing a conventional mounting form of a semiconductor device, FIG. 2 is a perspective view showing a mounting form of a semiconductor device according to the present invention, and FIGS. 3, 4, and 5 are semiconductor devices according to the present invention. It is a perspective view showing an example of this. 10: Semiconductor device, 11: Lead frame, 12: Lead terminal, 13: Resin package.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パッケージの一側壁から一定方向に延びる機械的強度の
確かなリード端子を導出し、該り、−ド端子を直接機器
側のコンセント差し込みプラグとしたことを特徴とする
半導体装置ＪA semiconductor device J characterized in that a lead terminal with reliable mechanical strength is led out from one side wall of the package and extends in a certain direction, and the - lead terminal is used as a plug to be directly inserted into an outlet on the equipment side.
JP10452782U 1982-07-09 1982-07-09 semiconductor equipment Granted JPS599554U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10452782U JPS599554U (en) 1982-07-09 1982-07-09 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10452782U JPS599554U (en) 1982-07-09 1982-07-09 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS599554U true JPS599554U (en) 1984-01-21
JPH042478Y2 JPH042478Y2 (en) 1992-01-28

Family

ID=30245397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10452782U Granted JPS599554U (en) 1982-07-09 1982-07-09 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS599554U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5068356A (en) * 1973-10-20 1975-06-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5068356A (en) * 1973-10-20 1975-06-07

Also Published As

Publication number Publication date
JPH042478Y2 (en) 1992-01-28

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