JPS5812951U - Motherboard for chip carrier - Google Patents

Motherboard for chip carrier

Info

Publication number
JPS5812951U
JPS5812951U JP10597281U JP10597281U JPS5812951U JP S5812951 U JPS5812951 U JP S5812951U JP 10597281 U JP10597281 U JP 10597281U JP 10597281 U JP10597281 U JP 10597281U JP S5812951 U JPS5812951 U JP S5812951U
Authority
JP
Japan
Prior art keywords
chip carrier
motherboard
hole
insulating substrate
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10597281U
Other languages
Japanese (ja)
Inventor
萩本　英二
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10597281U priority Critical patent/JPS5812951U/en
Publication of JPS5812951U publication Critical patent/JPS5812951U/en
Pending legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示す斜視図、第２図ａ、　　
ｂは本考案の実施例における横断面図である。 なお図において、１・・・電気絶縁基板、２・・・金属
リード端部、３・・・チップキャリア、４・・・外部リ
ード、である。Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2a,
b is a cross-sectional view of an embodiment of the present invention. In the figure, 1...electrical insulating substrate, 2...metal lead end, 3...chip carrier, 4...external lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板にチップキャリアーが挿入される貫通孔が少な
くとも１個形成され、該貫通孔にはチップキャリアーの
外部接続端子と接続すべきリードの一端が突出している
ことを特徴とするチップキャリアー用マザーボード。A motherboard for a chip carrier, characterized in that at least one through hole into which the chip carrier is inserted is formed in an insulating substrate, and one end of a lead to be connected to an external connection terminal of the chip carrier protrudes from the through hole.
JP10597281U 1981-07-16 1981-07-16 Motherboard for chip carrier Pending JPS5812951U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10597281U JPS5812951U (en) 1981-07-16 1981-07-16 Motherboard for chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10597281U JPS5812951U (en) 1981-07-16 1981-07-16 Motherboard for chip carrier

Publications (1)

Publication Number Publication Date
JPS5812951U true JPS5812951U (en) 1983-01-27

Family

ID=29900489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10597281U Pending JPS5812951U (en) 1981-07-16 1981-07-16 Motherboard for chip carrier

Country Status (1)

Country Link
JP (1) JPS5812951U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134853A (en) * 1980-12-24 1982-08-20 Keishiiaaru Tekunorojii Inc Method and device for controlling electrode voltage of electron beam tube

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134853A (en) * 1980-12-24 1982-08-20 Keishiiaaru Tekunorojii Inc Method and device for controlling electrode voltage of electron beam tube

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