JPS5995160U

JPS5995160U - sputtering device

Info

Publication number: JPS5995160U
Application number: JP19132082U
Authority: JP
Inventors: 保彦佐藤
Original assignee: クラリオン株式会社
Priority date: 1982-12-20
Filing date: 1982-12-20
Publication date: 1984-06-28

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図はスパッタ装置の図式的断面図、第２図ａおよび
ｂは第１図に示すスパッタ装置のターゲット付近のそれ
ぞれ拡大平面図および断面図、第３図ａおよびｂはター
ゲット覆いとしてそれぞれステンレスおよび石英ガラス
を用いてスパッタリングによって作成したＺｎＯ膜表面
の顕微鏡写真である。１・・・ターゲット、２・・・裏板、３・・・ターゲッ
ト覆い、４・・・ベルジャ、５・・・基板、６・・・基
板ホルダ、７・・・０リング、８・・・ガス導入口、９
・・・排気口、１０・・・絶縁用ブロック、１１・・・
ＲＦ電源、１２・・・水の導入口。Fig. 1 is a schematic cross-sectional view of the sputtering device, Fig. 2 a and b are enlarged plan views and cross-sectional views of the vicinity of the target of the sputtering device shown in Fig. 1, and Fig. 3 a and b are made of stainless steel as a target cover. 2 is a micrograph of the surface of a ZnO film created by sputtering using quartz glass. DESCRIPTION OF SYMBOLS 1... Target, 2... Back plate, 3... Target cover, 4... Bell jar, 5... Board, 6... Board holder, 7... 0 ring, 8... Gas inlet, 9
...Exhaust port, 10...Insulation block, 11...
RF power supply, 12...water inlet.

Claims

[Scope of utility model registration request]

A sputtering apparatus characterized in that a part other than the target where sputtering can occur, particularly a target cover, is made of a material with a lower sputtering rate than the target, or is made of the same material as the target.