JPS5992510A - Method of forming sheathed film of electronic part - Google Patents
Method of forming sheathed film of electronic partInfo
- Publication number
- JPS5992510A JPS5992510A JP20235682A JP20235682A JPS5992510A JP S5992510 A JPS5992510 A JP S5992510A JP 20235682 A JP20235682 A JP 20235682A JP 20235682 A JP20235682 A JP 20235682A JP S5992510 A JPS5992510 A JP S5992510A
- Authority
- JP
- Japan
- Prior art keywords
- film
- sheet
- electronic component
- forming
- exterior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 5
- 229910052573 porcelain Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
技術分野
本発明は、各種の電子部品で周側面を被覆保護する外装
皮膜の形成方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method for forming an exterior film that covers and protects the peripheral surface of various electronic components.
背景技術
従来、例えば第１図示の如きコンデンサを構成する場合
、磁器誘電体１の電極にリード線２，３を引出し装着し
た後、その外周面を液体塗料によるデツピングまたは粉
体塗料による流動浸漬やケースによるキャスティング等
で外装皮膜４を形成することが行なわれている。BACKGROUND ART Conventionally, when constructing a capacitor as shown in FIG. 1, for example, lead wires 2 and 3 are drawn out and attached to the electrodes of a ceramic dielectric 1, and then the outer peripheral surface of the lead wires is deposited with a liquid paint or fluidized with a powder paint. The exterior coating 4 is formed by casting with a case or the like.
然し、この皮膜４では、それを形成する材料によっては
電子部品にストレスを与えて性能の劣化を招くことがあ
る。このストレスを避けるため、皮膜４の下地にアンダ
ーコートを施すことも行なわれているが、工数が増える
ことになるから好ましくない。However, depending on the material from which the film 4 is formed, stress may be applied to electronic components, resulting in deterioration of performance. In order to avoid this stress, an undercoat has been applied to the base of the film 4, but this is not preferable because it increases the number of man-hours.
発明の開示
本発明は、電子部品にストレスを加えることなく外装皮
膜を設けることを可能にする電子部品の外装皮膜形成方
法を提供すること、を目的とする。DISCLOSURE OF THE INVENTION An object of the present invention is to provide a method for forming an exterior coating for an electronic component, which makes it possible to provide an exterior coating without applying stress to the electronic component.
即ち、本発明に係る外装皮膜の形成方法においては、電
子部品の外郭形状に相応して裁断した絶縁樹脂のシート
またはフィルムを電子部品の周面にラミネートするよう
にされている。That is, in the method for forming an exterior film according to the present invention, an insulating resin sheet or film cut according to the outer shape of the electronic component is laminated on the peripheral surface of the electronic component.
発明を実施するための最良の形態
これを第２及び３図で示す実施例に基づいて説明すれば
、次の通りである。BEST MODE FOR CARRYING OUT THE INVENTION This will be described below based on the embodiment shown in FIGS. 2 and 3.
この電子部品は例えば円板形の磁器コンデンサとして構
成するものであり、円板形の磁器誘電体ｌを持ち、その
両面に配置した電極からリード線２．３を引出すことに
より構成されている。この外表面には、シートまたはフ
ィルム５，６を被着して外装皮膜を形成するものである
。This electronic component is configured, for example, as a disk-shaped ceramic capacitor, and is constructed by having a disk-shaped ceramic dielectric 1 and having lead wires 2.3 drawn out from electrodes arranged on both sides of the disk-shaped ceramic dielectric. A sheet or film 5, 6 is applied to this outer surface to form an exterior coating.
このシートまたはフィルム５，６は、磁器誘電体ｌの外
表面を略半分づつ被覆するに足る面積で、磁器誘電体ｌ
の外郭形状に相応した円形状に裁断されている。また、
リード線２．３の付は根部を被覆するときには円形のシ
ートまたはフィルムの周縁からリード線２，３の軸径幅
に相応した小幅面を一体に裁断すればよい。この所定形
状に裁断したシートまたはフィルム５．６は、接着材を
用いて夫々側面から相対させてラミネートすることによ
り、リード線２．３の付は根部共々磁器誘電体ｌの周側
面を被覆した外装皮膜として形成することができる。こ
のシートまたはフィルム５．６としては、磁器誘電体ｌ
に接する内側面を可撓質または熱０ｆ塑性樹脂材料のフ
ィルム５ａ、８ａで、一方性側面を耐熱性硬質樹脂のフ
ィルム５ｂ。The sheets or films 5 and 6 have an area sufficient to cover approximately half of the outer surface of the porcelain dielectric 1.
It is cut into a circular shape that corresponds to the outer shape of the. Also,
When the lead wires 2 and 3 are attached to cover the roots, narrow width surfaces corresponding to the shaft diameter width of the lead wires 2 and 3 may be cut out from the periphery of a circular sheet or film. The sheet or film 5.6 cut into a predetermined shape is laminated using an adhesive so that the respective sides face each other, so that the lead wire 2.3 is attached to the base and covers the circumferential side of the porcelain dielectric 1. It can be formed as an exterior coating. As this sheet or film 5.6, a porcelain dielectric l
The inner surface in contact with is a film 5a, 8a of a flexible or thermoplastic resin material, and the one side surface is a film 5b of a heat-resistant hard resin.
６ｂとで形成した複合シートまたはフィルムを用いても
よい。この場合には、各シートまたはフィルム５．６を
磁器誘電体ｌに被せて加熱処理すると、各内側面フィル
ム５ａ、Ｅｔａが溶融して互いに接着すると共に磁器誘
電体１の周側面にも接合し、しかもその軟質性によりプ
リコートと同様の作用を発揮するため緩衝層として作用
し、仮に外側面の耐熱性硬質樹脂フィルム層５ｂ、６ｂ
よリストレスが加わっても吸収するようになる。A composite sheet or film formed with 6b may also be used. In this case, when each sheet or film 5.6 is placed over the porcelain dielectric 1 and heat-treated, the inner side films 5a and Eta melt and adhere to each other as well as to the circumferential side of the porcelain dielectric 1. Moreover, due to its softness, it exhibits the same effect as a precoat, so it acts as a buffer layer.
You will be able to absorb even more stress from your wrist.
なお、」二連した実施例では磁器コンデンサに基づいて
説明したが、これを他の電子部品の製造に広く適用する
ことが可能である。Note that although the two embodiments have been described based on a ceramic capacitor, this can be widely applied to the manufacture of other electronic components.
発明の効果
このように、本発明に係る電子部品の外装皮膜形成方法
に依れば、絶縁樹脂シート門たはフィルムを被着するこ
とにより外装皮膜を形成するため、内部素子にストレス
が加わることがなく、しかもプリコートを施す必要もな
いため工数の増加を防ぐことができる。Effects of the Invention As described above, according to the method for forming an exterior film of an electronic component according to the present invention, since the exterior film is formed by applying an insulating resin sheet gate or film, stress is not applied to internal elements. Moreover, since there is no need to pre-coat, an increase in the number of man-hours can be prevented.
第１図は従来方法で皮膜被覆した電子部品の側断面図、
第２図は本発明に係る電子部品の外装皮膜形成方法を示
す説明図、第３図は本発明に係る方法で皮膜成形した電
子部品の断面図である。
１．２，３：電子部品、５，６：絶縁樹脂シートまたは
フィルム、５ａ、Ｂａ：内面側樹脂材料、５ｂ、６ｂ：
外面側樹脂材料。Figure 1 is a side sectional view of an electronic component coated with a film using a conventional method.
FIG. 2 is an explanatory diagram showing a method of forming an exterior film on an electronic component according to the present invention, and FIG. 3 is a sectional view of an electronic component formed into a film by the method according to the present invention. 1.2, 3: Electronic component, 5, 6: Insulating resin sheet or film, 5a, Ba: Inner side resin material, 5b, 6b:
Outer side resin material.
Claims (2)
郭形状に相応させて裁断し、その特定形状のシートまた
はフィルムを電子部品の周面にラミネートすることによ
り、外装皮膜を形成したことを特徴する電子部品の外装
皮膜形成方法。(1) The exterior film is formed by cutting an insulating resin sheet or film to match the outer shape of the electronic component and laminating the sheet or film of the specific shape to the peripheral surface of the electronic component. Method for forming external coatings on electronic components.
賀或いは熱可塑性樹脂材料と外面側の耐熱性硬質樹脂材
料との複合シートまたはフィルムを用いたところの特許
請求の範囲第１項記載の電子部品の外装皮膜形成方法。(2) The electronic device according to claim 1, wherein the sheet or film is a composite sheet or film of a flexible resin material or thermoplastic resin material on the inner surface side and a heat-resistant hard resin material on the outer surface side. Method for forming exterior coatings on parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20235682A JPS5992510A (en) | 1982-11-18 | 1982-11-18 | Method of forming sheathed film of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20235682A JPS5992510A (en) | 1982-11-18 | 1982-11-18 | Method of forming sheathed film of electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5992510A true JPS5992510A (en) | 1984-05-28 |
| JPH0236046B2 JPH0236046B2 (en) | 1990-08-15 |
Family
ID=16456154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20235682A Granted JPS5992510A (en) | 1982-11-18 | 1982-11-18 | Method of forming sheathed film of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5992510A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103535U (en) * | 1972-12-27 | 1974-09-05 | ||
| JPS5479460A (en) * | 1977-12-07 | 1979-06-25 | Marukon Denshi Kk | Capacitor and method of producing same |
| JPS5486752A (en) * | 1977-12-22 | 1979-07-10 | Nichicon Capacitor Ltd | Method of sheathing capacitor |
| JPS54155460A (en) * | 1978-05-29 | 1979-12-07 | Marukon Denshi Kk | Method of producing capacitor |
-
1982
- 1982-11-18 JP JP20235682A patent/JPS5992510A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103535U (en) * | 1972-12-27 | 1974-09-05 | ||
| JPS5479460A (en) * | 1977-12-07 | 1979-06-25 | Marukon Denshi Kk | Capacitor and method of producing same |
| JPS5486752A (en) * | 1977-12-22 | 1979-07-10 | Nichicon Capacitor Ltd | Method of sheathing capacitor |
| JPS54155460A (en) * | 1978-05-29 | 1979-12-07 | Marukon Denshi Kk | Method of producing capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0236046B2 (en) | 1990-08-15 |
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