JPS5987170U - Mounting structure of electronic components - Google Patents

Mounting structure of electronic components

Info

Publication number
JPS5987170U
JPS5987170U JP18315982U JP18315982U JPS5987170U JP S5987170 U JPS5987170 U JP S5987170U JP 18315982 U JP18315982 U JP 18315982U JP 18315982 U JP18315982 U JP 18315982U JP S5987170 U JPS5987170 U JP S5987170U
Authority
JP
Japan
Prior art keywords
electronic component
mounting structure
electronic components
opening
back portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18315982U
Other languages
Japanese (ja)
Inventor
大塚　隆夫
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP18315982U priority Critical patent/JPS5987170U/en
Publication of JPS5987170U publication Critical patent/JPS5987170U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の放熱板を用いた例を示す断面図、第２
図は、従来の筐体を放熱板として用いた例を示す断面図
、第３図は、本考案を示す基板の斜視図、第４図は、本
考案を示す基板の断面図、第５図は、本考案の基板と筐
体を示す断面図である。 １・・・基板、２・・・放熱板、４・・・パワートラン
ジス　　　　゛り、５、・・・脚部、６・・・板金筐体
、９・・・ブツシュバック部、１３・・・絞り部、１１
・・・固定部、１２．１４・・・ビスFigure 1 is a cross-sectional view showing an example using a conventional heat sink;
The figure is a cross-sectional view showing an example in which a conventional housing is used as a heat sink, FIG. 3 is a perspective view of a board showing the present invention, FIG. 4 is a cross-sectional view of a board showing the present invention, and FIG. FIG. 2 is a cross-sectional view showing the substrate and the casing of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Heat sink, 4... Power transistor, 5... Legs, 6... Sheet metal casing, 9... Bushback part, 13...・Aperture part, 11
...fixing part, 12.14...screw

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に取付けられるべき電子部品と同程度以上の大き
さのブツシュバック部を、押圧された時開口可能なよう
に、かつ該ブツシュバック部の少くとも一辺をガイドと
して該電子部品を位置決めしてハンダ付可能なように設
けると共に、該開口を通して該電子部品を該開口に対向
して位置する部材に取付けたことを特徴とする電子部品
の取付構造。Position the electronic component so that it can open when pressed, using at least one side of the bushing back portion as a guide, with a bushing back portion having the same size or larger as the electronic component to be mounted on the board. 1. A mounting structure for an electronic component, characterized in that the electronic component is provided so as to be solderable through the opening, and the electronic component is mounted through the opening to a member located opposite to the opening.
JP18315982U 1982-12-03 1982-12-03 Mounting structure of electronic components Pending JPS5987170U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18315982U JPS5987170U (en) 1982-12-03 1982-12-03 Mounting structure of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18315982U JPS5987170U (en) 1982-12-03 1982-12-03 Mounting structure of electronic components

Publications (1)

Publication Number Publication Date
JPS5987170U true JPS5987170U (en) 1984-06-13

Family

ID=30396477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18315982U Pending JPS5987170U (en) 1982-12-03 1982-12-03 Mounting structure of electronic components

Country Status (1)

Country Link
JP (1) JPS5987170U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521343U (en) * 1978-07-27 1980-02-12
JPS5831429B2 (en) * 1978-02-03 1983-07-06 野村株式会社 Manufacturing method for highly elastic lace

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831429B2 (en) * 1978-02-03 1983-07-06 野村株式会社 Manufacturing method for highly elastic lace
JPS5521343U (en) * 1978-07-27 1980-02-12

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