JPS5985750A - Manufacture of copper lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 1. Technique of the Invention IIi Field] The present invention is directed to a 6+1 film with less warpage and a good 1 law support.
It relates to a method of manufacturing stretched laminates.

[Problems with technical betrayal of inventions] In recent years, there has been an increase in the number of puddings used in consumer electronic devices.
In particular, automation and labor saving will be significantly promoted. This J, uh'eh automation, labor saving' culm is a condition that satisfies C.
1 A good Ω plate with little warpage and good legal stability is strongly warped.

To such a print 1, a wiring board (J, generally paper is coated with a thermosetting U resin such as a condensation type phenol resin or an epoxy resin), and a plurality of sheets of processed paper impregnated with 11 are laminated, and one or both sides of this laminate is coated with fFJ ft'i is manufactured using heat and pressure, but the heating during this molding is 21, l.
, - is the heating of 111S, J, S, 1st elbow (7J l
There was a problem in that the blades that were formed on I6 were shrunk and a bimetallic effect appeared between them and the copper foil, causing warping and shrinkage on the blades.

[Purpose of d Ming] In order to apply λ・j to this J, Una-ma W11, the wood-burning experts found that 15 (as a result of their research, heat-pressing molded 1 culm LL of copper-clad fr'j laminate) Jj Lee(,/Jll J-E L/
l'c Ma: T: kn / Jl % IC゛, When the temperature of the product at cold 7J1 is 80 to 130', the pressure is decompressed once, and then at a contact pressure of 1 to 50 kg/c. It has been found that a copper-clad laminate with less warpage and shrinkage can be obtained by cooling.

The present invention is based on this knowledge (C)
The purpose is to provide a method for manufacturing a 6F plate with low shrinkage, which is composed of copper foil and processed paper (relieving residual stress between the base material and C warping of 1%').

[Summary of the Invention] In other words, the method of the present invention involves laminating a thermosetting resin (Immersion 1 - &til ff on paper), heating and press-molding it, and then forming a thermosetting resin. f
Ma warm paralyze cold j, II L, l' Fj day Hari (4 尼1(
Make the cloth 3 blue lily (Latari, cold 1, 4 degrees in the middle of 11)
゛Once the pressure is released, then 450 kg / +: + (
Contact n: ni (-1 沫BO と ま ま e cold fJj ruru) (that is spelled as 1″1 character.

I will explain the invention method in detail to IU.

(1) Loading the product into the press Reseal Tyzo's phenolic resin or 1-boxy 4
KJ fat, etc. is applied to the applicator (clat paper 1'), linter paper, or sword paper [1st (ゝ) sword paper tank] lining cloth is impregnated] 2 papers are manufactured, and this processed paper is made into several pieces. Stack the sheets, re-arrange the adhesive copper foil or adhesive-treated copper foil on top of it, and sandwich it with a mirror-finished stainless steel board.1 set 1-
Then, heat this through the cushion paper. Seeds are placed in 18 presses. Heater Zores (generally heated plate surface (＾ is 1, 5"□'l +n2 culm 5~
There are 30 multi-tiered ovens that are used to heat the soil with steam.

(2) Heat the molded product in the 181'I nos.
/ l: A, -1 niboxy resin system C゛ is 10-.50
kI! After applying pressure to y' c+, put the hot air into a heater and heat it to 1F50-.180. Warm at ℃ for 1-2 hours;
1 month - molding. .

(3) Cold) 1 sterilizing steam at 11-m (hot fil (combined) 1, 1 ratio,
To ε30・130"C the product temperature has changed to jY 0, Y
50 kg
/ Touch the soil ((, 1 warm your palms, cool your hands, 11.

1. Example of Komyo] Next, embodiments of the present invention will be explained.

Length h111 Example 1 1 Nosol type IFi oil-modified phenolic resin was diluted with methanol, and then 10 mils of Kushinol was added to the applicator.
-1i;i paper has a resin content of 50%J, sea urchin coating I11
, I>2 dryness l! 'U 110 I got paper. Stack 8 sheets of this pressurized paper, place copper foil on top of it, and
A 14-layer plate (1i layered board) and a 10-layer plate were inserted between two mirror-finished stainless steel plates, and 10 sets of these were placed between the heaters with cushion paper interposed between the heaters for one stage. This was molded into the following J shape using a 430-stage natural air heating type multi-stage press.

Products J and E (100 kg/c) were placed in a heating oven and heated until the temperature of the products reached 170°C. After 85 minutes, stop heating.
Pass cold 7J] water through hot saucer 18". Start with "No C Cold 711", and when the temperature of the product reaches 120"C, -11,I M
i[L Maintained the condition for 3 minutes. After that, apply pressure for remelting, maintain product pressure at 5kFX/t:IK, and further cool 1k.
JI 1. When the temperature of the U product reached 40℃, the pressure was released and the C product was taken out.

The warpage of the original plate of this J, UU eJe product, the warpage of the heating process after pattern creation, J3A, and the J method change were measured. The results were C' as shown in the table.

Example 2 After loading the product into the multi-stage press in the same manner as in Example 1, the product pressure was 15
Apply a pressure of 0 kg / cj, then put the steam into the heat oven 8 and the humidity will be 165'C (゛Heated.
Start cooling the product through water? When fA degree reaches 100℃, temporarily release the pressure at lζ and keep it in that state for 3 minutes /j
Using ob[(''), pressurize the product
aJ and further cool)ilt L,, the product temperature is /I
I+ reached O"Ct; the pressure at 5 points P was released and the product was taken out.

The product thus obtained was tested in the same manner as in Example '1.

Comparative Example After placing the product between the hot plates in the same manner as in Example 1, the product 1-[10
Pressure to 0 kg/c+ [), then k) heat?
li1 and heat at C until the temperature reaches 170°C. 1. :
. Turn on the hot air (after 85 minutes, set the heat to -1, and turn on the heat oven (
Cool 711j water through cold 7J]shi, the product temperature is /lo
As soon as °CIc was reached, the pressure was released and Product C was taken out.

In this way, UJ! The same test as in Example 1 was conducted on the product prepared in Example 7.

Hereafter (Note 1) J l5-C- (34815, /I method (
Koyoru. Span length 1020mm Note 2) Cut the ltK board into 300 mm x 250 mm rI7i (longitudinal length is in the lj direction of the board), and the residual copper percentage is approximately 8.
The 0% pattern is printed and stitched to create a circuit board.

Next, the circuit board shown in the table is heated in a 1''cA-thin, and both ends of the circuit board are placed on a surface plate with strings 1'J and 1'' in contact with each other. Measure the height of the peak as the warpage.When the copper foil side is on the surface plate side, it is 11.When the opposite case is -, it is measured.
1 (expressed.

(Note 3) 300 mm x 25 for Note 2 and l1i1
Create a circuit board with On+m &lll remaining rate of approximately 80%. Next, drill holes for 3J method measurement at the end of the e pattern ()
Then, heat the strip shown in the table ('l''r 71' - 71' - 62 mm and measure the dimensions with a coordinate measuring device. Span length 280 x 23 (,) .

As is clear from the table, in Example 1.2C, the warpage and shrinkage of the copper-clad laminate were reduced.

As explained above, according to the method of the present invention, there is less warpage.
Good usage and stable I11'J! ii. (11-layer board can be made into 1 [1].

Claims (2)

[Claims] (1) Copper fi'i is laminated onto paper impregnated with thermosetting resin, heated to form L1, and then cooled to about room temperature. 10 solutions L
iU i at 1-shi, ~50 ke, / Cl11
A method for producing a copper-clad laminate, characterized in that the contact LL is cooled to approximately room temperature. (2) Molding mouth, ν heating disturbance 1 claw to 150/180°O
C Copper clad (six-layer board) according to claim 111
80～130-CC'Al4'l iiT crystal quest "1"
(Method for manufacturing copper-clad laminates listed in Section 1 JR and Section 2 iiL!).