JPS5910308B2 - Double-sided copper clad laminate - Google Patents

Double-sided copper clad laminate

Info

Publication number
JPS5910308B2
JPS5910308B2 JP53148760A JP14876078A JPS5910308B2 JP S5910308 B2 JPS5910308 B2 JP S5910308B2 JP 53148760 A JP53148760 A JP 53148760A JP 14876078 A JP14876078 A JP 14876078A JP S5910308 B2 JPS5910308 B2 JP S5910308B2
Authority
JP
Japan
Prior art keywords
impregnated paper
resin
paper layer
double
impregnated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53148760A
Other languages
Japanese (ja)
Other versions
JPS5574866A (en
Inventor
定洋 白川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP53148760A priority Critical patent/JPS5910308B2/en
Publication of JPS5574866A publication Critical patent/JPS5574866A/en
Publication of JPS5910308B2 publication Critical patent/JPS5910308B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は両面銅張積層板に関するものである。[Detailed description of the invention] The present invention relates to a double-sided copper-clad laminate.

従来の両面銅張積層板は、フェノールホルムアルデヒド
樹脂のような熱硬化性樹脂のワニスを含浸した樹脂含有
率が略同じ樹脂含浸紙を所要枚数重ね合せ、その両面に
銅箔を載せてから加熱加圧することにより製造されてい
るが、加工工程中や加工後に発生する反りや捩れが銅箔
残存率に関係なく大きいという欠点があつた。本発明は
上述した欠点を解消するものであり、その目的とすると
ころは、種類及び厚みの同じ紙に樹脂を含浸させて異な
る樹脂含有率の主含浸紙層と調整用含浸紙層とを調製し
、主含浸紙層の表裏両面に主含浸紙層より樹脂含有率の
少ない調整用含浸紙層を設けることにより、加工工程中
や加工後に発生する反クや捩れを小さくできるようにし
た両面銅張積層板を提供するにある。
Conventional double-sided copper-clad laminates are made by stacking the required number of resin-impregnated papers impregnated with a thermosetting resin varnish such as phenol formaldehyde resin and having approximately the same resin content, placing copper foil on both sides, and then heating them. Although it is manufactured by pressing, it has the disadvantage that warping and twisting that occur during and after the processing process are large regardless of the copper foil residual rate. The present invention solves the above-mentioned drawbacks, and its purpose is to impregnate paper of the same type and thickness with resin to prepare a main impregnated paper layer and a control impregnated paper layer with different resin contents. By providing adjustment impregnated paper layers with a lower resin content than the main impregnated paper layer on both the front and back sides of the main impregnated paper layer, it is possible to reduce warping and twisting that occur during and after processing. We offer tension laminates.

本発明を以下詳述する。The present invention will be described in detail below.

両面銅張積層板は第1図のように主含浸紙層1と上部調
整用含浸紙層2下部調整用含浸紙層3及び銅箔層4から
なつておV)フェノール樹脂のような熱硬化性樹脂を含
浸した含浸紙を複数枚積層した主含浸紙層1の樹脂含有
率は49〜6096になつていて主含浸紙層1の表裏両
面には樹脂含有率が主含浸紙層1より少なくて44〜4
9%の樹脂含有率を有する1枚の含浸紙からなる上部調
整用含浸紙層2と下部調整用含浸紙層3がそれぞれ設け
られている。ここで主含浸紙層1の含浸紙と調整用含浸
紙層2、3の含浸紙とは種類及び厚みの同じ紙が用いら
れている。調整用含浸紙層2、3の外面にはそれぞれ銅
箔層4が設けられており、銅箔層4は塩化第2鉄のよう
なエッチング液でエッチング処理を施されている。上記
のように主含浸紙層1の表裏両面に主含浸紙層1より樹
脂含有率の少ない調整用含浸紙層2、3を設け、各調整
用含浸紙層2、3の外面に銅箔層4を設けて両面銅張積
層板を形成したので、積層板を加熱処理するさいに銅箔
層4と主含浸紙層1の熱膨張率の違いに起因して積層板
が反つたり捩れようとするが、主含浸紙層1より樹一
脂含有率の少ない調整用含浸紙層2、3が反クや捩れを
防止するように作用して積層板に発生する反りや捩れを
最小限に抑えることができる。本発明は上記のような構
成を有するので、加工工程中や加工後に積層板に発生す
る反りや捩れを] 小さくすることができるものである
。しかも、種類及び厚みの同じ紙に異なる樹脂含有率で
樹脂を含浸させて主含浸紙層と調整含浸紙層とを調製し
てあるから、一種類の紙しか用いられておらず、樹脂の
含有率を変えるだけで反り矯正のコントロ5−ルを簡単
かつ精度良く行なえ、製造や品質管理も容易であるとい
う効果がある。本発明を以下、実施例により詳述する。
As shown in Figure 1, the double-sided copper-clad laminate is made of a main impregnated paper layer 1, an upper adjustment impregnated paper layer 2, a lower adjustment impregnated paper layer 3, and a copper foil layer 4. The resin content of the main impregnated paper layer 1, which is made by laminating a plurality of sheets of impregnated paper impregnated with a synthetic resin, is 49 to 6096, and the resin content on both the front and back sides of the main impregnated paper layer 1 is lower than that of the main impregnated paper layer 1. Te44~4
An upper impregnated paper layer 2 for adjustment and a lower impregnated paper layer 3 for adjustment are each formed of a sheet of impregnated paper having a resin content of 9%. Here, the impregnated paper of the main impregnated paper layer 1 and the impregnated paper of the adjustment impregnated paper layers 2 and 3 are of the same type and thickness. A copper foil layer 4 is provided on the outer surface of each of the conditioning impregnated paper layers 2 and 3, and the copper foil layer 4 is etched with an etching solution such as ferric chloride. As described above, the adjusting impregnated paper layers 2 and 3 having a lower resin content than the main impregnated paper layer 1 are provided on both the front and back sides of the main impregnated paper layer 1, and the copper foil layer is formed on the outer surface of each adjusting impregnated paper layer 2 and 3. 4 to form a double-sided copper-clad laminate, the laminate may warp or twist due to the difference in thermal expansion coefficient between the copper foil layer 4 and the main impregnated paper layer 1 when the laminate is heat-treated. However, the tree is more dense than the main impregnated paper layer 1.
The impregnated paper layers 2 and 3 for adjustment, which have a low fat content, act to prevent warping and twisting, so that warping and twisting occurring in the laminate can be minimized. Since the present invention has the above configuration, it is possible to reduce warping and twisting that occur in the laminate during and after the processing process. Moreover, since the main impregnated paper layer and the adjustment impregnated paper layer are prepared by impregnating paper of the same type and thickness with resins at different resin contents, only one type of paper is used, and the resin-containing Warpage correction can be easily and precisely controlled by simply changing the rate, and manufacturing and quality control are also easy. The present invention will be explained in detail below using examples.

実施例1乃至実施例2 レゾール型フエノールホルムアルデヒド樹脂石炭酸、ク
レゾールの混合物に37%ホルマリンを添加して反応さ
せたもの)にメタノールを加え固型分60%のワニスを
得た。
Examples 1 to 2 Methanol was added to a resol type phenol formaldehyde resin (reacted by adding 37% formalin to a mixture of carbolic acid and cresol) to obtain a varnish with a solid content of 60%.

積層板用クラフト紙10ミルスに上記ワニスを含浸させ
て130ト〜155℃、5〜10分の条件で加熱乾燥し
て樹脂含有率がそれぞれ45%、48%、51%、54
%、60%、樹脂フローがいずれも7〜9(Lの樹脂含
浸紙を得た。ここで樹脂含有率が45(fl)の樹脂含
浸紙をA,48%のものをB,5l%のものをC,54
%のものをD,6O%のものをEとする。この含浸紙A
−Eを表1の様に組合せ、厚さ35μの接着剤付銅箔を
両側に1枚のせ、圧力120〜130kg/c!!L2
、温度154〜160℃の条件で60分間熱圧成型して
厚さ1.611!の両面銅張積層板を得た。表 2 得られた積層板を200×200nで銅箔残存率が片面
側60%、一方の反対面30%の回路を通常のエツチン
グ方法にて形成した。
Craft paper for laminates (10 mils) was impregnated with the above varnish and heated and dried at 130 to 155°C for 5 to 10 minutes to give resin contents of 45%, 48%, 51%, and 54%, respectively.
%, 60%, and resin flow of 7 to 9 (L) were obtained. Here, the resin-impregnated paper with a resin content of 45 (fl) was A, the one with a resin content of 48% was B, and the resin flow was 7 to 9 (L). thing C, 54
% is D and 60% is E. This impregnated paper A
-E as shown in Table 1, put one sheet of 35μ thick adhesive-coated copper foil on both sides, and apply a pressure of 120 to 130 kg/c! ! L2
, a thickness of 1.611 after being hot-pressed for 60 minutes at a temperature of 154-160°C! A double-sided copper-clad laminate was obtained. Table 2 A 200×200n circuit was formed on the resulting laminate using a conventional etching method, with a copper foil residual rate of 60% on one side and 30% on the opposite side.

回路形成後、積層板を130℃で2分、次いで140〜
150℃で20分間加熱乾燥した後、更に80〜120
5℃で10分間加熱し、80トンパワープレスにて゛打
抜加工した。打抜加工した積層板を?nダイヤルゲージ
付反り測定機を用いて支点距離180nで最大の反りを
、支点距離250?で積j層板の対角線上の反りを各々
測定し、その絶対値の差を捩れとして測定した。結果を
表2に示す。表2から明らかなように実施例1乃至実施
例2は比較例よジ格段に反クや捩れが小さかつた。実施
例 3レゾール型フエノールホルムアルデヒド樹脂(石
炭酸ホルマリン37%、アンモニア触媒で反応させた樹
脂で、1〜2核体のメチロールフエノールを主成分とす
る)にメタノール、水を重量比でシ,の割合で混合して
比重0.92〜0.95、固型分20〜30%のワニス
を得た。
After circuit formation, the laminate was heated at 130°C for 2 minutes, then at 140°C.
After heating and drying at 150℃ for 20 minutes,
It was heated at 5°C for 10 minutes and punched using an 80-ton power press. A punched laminate? Using a warp measuring machine with an n-dial gauge, measure the maximum warp at a fulcrum distance of 180n, and measure the maximum warp at a fulcrum distance of 250? The diagonal warpage of the laminated sheets was measured, and the difference between the absolute values was measured as the torsion. The results are shown in Table 2. As is clear from Table 2, Examples 1 and 2 had significantly less warp and twist than the comparative example. Example 3 Resol type phenol formaldehyde resin (37% carbonic acid formalin, a resin reacted with an ammonia catalyst, containing mono- to dinuclear methylolphenol as the main component), methanol and water in a weight ratio of By mixing, a varnish with a specific gravity of 0.92 to 0.95 and a solid content of 20 to 30% was obtained.

このワニスを使用して積層板用クラフト紙10ミルスを
含浸し、130〜155℃で5〜10分間加熱乾燥して
、樹脂含有率がAは7〜9%、Bは10〜12%、Cは
13〜15%でかつ揮発分はA,B,Cとも2.5〜3
.5%の樹脂含浸紙A,B,Cを得た。
This varnish was used to impregnate 10 mils of kraft paper for laminates, and heat-dried at 130-155°C for 5-10 minutes.The resin content was 7-9% for A, 10-12% for B, and 10-12% for C. is 13 to 15%, and the volatile content of A, B, and C is 2.5 to 3.
.. 5% resin-impregnated papers A, B, and C were obtained.

この含浸紙を使用して更にレゾール型ホルムアルデヒド
樹脂(石炭酸クレゾール混合物に37%ホルマリンを加
え、25$アンモニア触媒で反応させたものにメタノー
ルの溶媒を加えて固型分55〜57%としたもの)に含
浸し、表3のよう一に全樹脂含有率を45%、47%、
50%と55%にした8種類の樹脂含浸紙を得た。
Using this impregnated paper, we further prepared a resol-type formaldehyde resin (37% formalin was added to a carbonic acid cresol mixture and reacted with a 25$ ammonia catalyst, and a methanol solvent was added to make the solid content 55-57%). and the total resin content was 45%, 47%, as shown in Table 3.
Eight types of resin-impregnated papers with 50% and 55% were obtained.

上記樹脂含浸紙a1〜C,を表4の様に組合せ厚さ35
μの接着剤付銅箔を両側に1枚のせ、圧力120〜13
01<9/鑞2、温度154〜160℃で60分間加熱
成型して厚さ1.6nの両面積層板を得た。
The above resin-impregnated papers a1 to C are combined as shown in Table 4 to a thickness of 35
Place one piece of μ copper foil with adhesive on both sides and apply pressure to 120~13cm.
A double-sided laminate with a thickness of 1.6 nm was obtained by heat molding at a temperature of 154 to 160° C. for 60 minutes at a temperature of 01<9/Brain 2 and a temperature of 154 to 160°C.

得られた積層板を200X2001rgサイズで銅箔残
存率が片面側60%、一方の反対面30(F6の回路を
通常のエツチング方法にて形成した。
The resulting laminate was 200×2001rg in size with a copper foil remaining rate of 60% on one side and a circuit of 30 (F6) on the other side by a normal etching method.

回路形成後、130℃2分、140〜150℃で20分
間加熱乾燥した後、更に80〜120℃で10分間加熱
し、80トンパワブレスにて打抜加工した。この積層板
イ。。mlダイヤルゲージ付反り測定機を用いて支点間
距離1801!lで最大の反りを支点間距離250m1
で積層板の対角線上の反りを各々測定し、その差の絶対
値を捩れとtて測定した。表から明らかなように▲1乃
至Jf65は▲6乃至Jf68より格段に反クや捩れが
小さかつた。
After forming the circuit, it was dried by heating at 130°C for 2 minutes, then at 140-150°C for 20 minutes, then further heated at 80-120°C for 10 minutes, and punched using an 80-ton power press. This laminate board i. . Distance between fulcrums is 1801 using a warp measuring machine with ml dial gauge! The maximum warpage is 250m1 between fulcrums.
The diagonal warpage of the laminate was measured, and the absolute value of the difference was defined as the torsion. As is clear from the table, ▲1 to Jf65 had much smaller warp and twist than ▲6 to Jf68.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の縦断面図、第2図は同上の
製造時の説明図、第3図は比較例の製造時の説明図であ
り、1は主含浸紙層、2は上部調整用含浸紙層3は下部
調整用含浸紙層、4は銅箔層である。
FIG. 1 is a longitudinal cross-sectional view of an example of the present invention, FIG. 2 is an explanatory diagram of the same manufacturing process, and FIG. 3 is an explanatory diagram of a comparative example during manufacturing, in which 1 is the main impregnated paper layer, 2 The upper adjustment impregnated paper layer 3 is the lower adjustment impregnated paper layer, and 4 is the copper foil layer.

Claims (1)

【特許請求の範囲】[Claims] 1 種類及び厚みの同じ紙に異なる樹脂含有率で樹脂を
含浸させて主含浸紙層と調整用含浸紙層とを調製し、主
含浸紙層の表裏両面に主含浸紙層より樹脂含有率の少な
い調整用含浸紙層を設け、各調整用含浸紙層の外面に銅
箔層を設けて成ることを特徴とする両面銅張積層板。
1. Prepare a main impregnated paper layer and an adjustment impregnated paper layer by impregnating paper of the same type and thickness with resins at different resin contents. A double-sided copper-clad laminate comprising a small number of adjustment impregnated paper layers and a copper foil layer provided on the outer surface of each adjustment impregnated paper layer.
JP53148760A 1978-11-30 1978-11-30 Double-sided copper clad laminate Expired JPS5910308B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53148760A JPS5910308B2 (en) 1978-11-30 1978-11-30 Double-sided copper clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53148760A JPS5910308B2 (en) 1978-11-30 1978-11-30 Double-sided copper clad laminate

Publications (2)

Publication Number Publication Date
JPS5574866A JPS5574866A (en) 1980-06-05
JPS5910308B2 true JPS5910308B2 (en) 1984-03-08

Family

ID=15460021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53148760A Expired JPS5910308B2 (en) 1978-11-30 1978-11-30 Double-sided copper clad laminate

Country Status (1)

Country Link
JP (1) JPS5910308B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5674993A (en) * 1979-11-22 1981-06-20 Toshiba Chem Prod Method of fabricating copperrcoated laminated board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128786A (en) * 1974-03-30 1975-10-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128786A (en) * 1974-03-30 1975-10-11

Also Published As

Publication number Publication date
JPS5574866A (en) 1980-06-05

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