JPS63189440A - Production of laminate with paper base - Google Patents
Production of laminate with paper baseInfo
- Publication number
- JPS63189440A JPS63189440A JP2208487A JP2208487A JPS63189440A JP S63189440 A JPS63189440 A JP S63189440A JP 2208487 A JP2208487 A JP 2208487A JP 2208487 A JP2208487 A JP 2208487A JP S63189440 A JPS63189440 A JP S63189440A
- Authority
- JP
- Japan
- Prior art keywords
- paper
- laminate
- base
- paper base
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 14
- 239000011122 softwood Substances 0.000 claims description 6
- 238000004080 punching Methods 0.000 abstract description 13
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 37
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000011121 hardwood Substances 0.000 description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- HCQKNMBGTLTZCQ-UHFFFAOYSA-N 2-[8-(2-hydroxyphenyl)octyl]phenol Chemical compound OC1=CC=CC=C1CCCCCCCCC1=CC=CC=C1O HCQKNMBGTLTZCQ-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は紙を基材とする積層板の製造法に関するもので
、その目的とするところは、積層板の打抜加工性、そり
に優れた紙基材積層板を製造することにある。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a laminate using paper as a base material, and its purpose is to provide a laminate with excellent punching workability and warpage. The purpose of the present invention is to manufacture paper-based laminates.
近年、ＴＶ、ＶＴＲなどの民生電子機器、パソコン、ワ
ープロなどのＯＡ電子機器、自動車、通信機などに用い
られる印刷回路基板には安価な紙基材の合成樹脂積層板
が用いられることが多くなっている。これらの紙基材の
印刷回路基板の穴明けは生産性の高いプレスによる打抜
加工によって行われる。In recent years, cheap paper-based synthetic resin laminates have been increasingly used for printed circuit boards used in consumer electronic devices such as TVs and VTRs, OA electronic devices such as personal computers and word processors, automobiles, and communication devices. ing. Holes in these paper-based printed circuit boards are made by punching using a highly productive press.
最近の印刷回路基板の高密度化高性能化に伴い、導体中
、導体間隔が細く狭くなってきたために、基板の寸法精
度、印刷精度に対する要求が厳しくなってきた。加熱に
よる基板の寸法変化を小さくするため、打抜加工は加熱
しないで打抜く、いわゆる常温打抜が行われている。従
って積層板には常温打抜加工性が要求される。同時に、
印刷時には、そりが小さいことが要求されている。With the recent increase in density and performance of printed circuit boards, the spacing between conductors in conductors has become thinner and narrower, and as a result, requirements for dimensional accuracy and printing accuracy of the board have become stricter. In order to reduce dimensional changes in the substrate due to heating, the punching process is performed without heating, so-called room-temperature punching. Therefore, the laminate is required to be punchable at room temperature. at the same time,
When printing, it is required that the warpage be small.
従来から打抜加工性の良好な基材としては綿花から得ら
れるコツトンリンク紙がある。しかしながらコツトンリ
ンク紙の場合は、打抜加工性は良好なものの、加熱冷却
に伴う熱膨張、収縮が太きく、寸法精度、そりの面で問
題があり、高密度配線板への適用は困難になってきてい
る。Conventionally, as a base material with good die-cutting properties, there is cotton-made link paper. However, in the case of Kotsuton link paper, although it has good punching workability, it has large thermal expansion and contraction due to heating and cooling, and has problems in terms of dimensional accuracy and warping, making it difficult to apply to high-density wiring boards. It is becoming.
また、特開昭５８−１６３６５３号公報、特開昭６０−
７９９５２号公報で提案されているα−セルロース含量
の高い広葉樹パルプから抄造した紙基材では、コツトン
リンク紙と同様に打抜加工性は良好なものの、寸法精度
、そりに問題があった。Also, JP-A-58-163653, JP-A-60-
The paper base material made from hardwood pulp with a high α-cellulose content, as proposed in Japanese Patent No. 79952, has good punching workability similar to Kottonlink paper, but has problems with dimensional accuracy and warpage.
一方、α−セルロース含量が少ない（含有量８３重量％
）クラフトパルプから抄造した紙基材の場合は、積層板
のそり、寸法精度が良好であるが常温打抜性に問題があ
った。そこで、打抜加工性を改良すべく合成樹脂の可焼
化方法について種々検討を進めてきたが、充分に満足で
きるには至っていないのが現状である。On the other hand, the α-cellulose content is low (content 83% by weight)
) In the case of a paper base material made from kraft pulp, the warp of the laminate and dimensional accuracy were good, but there was a problem with room temperature punchability. Therefore, various studies have been carried out on methods for sintering synthetic resins in order to improve the punching processability, but at present the results have not been fully satisfactory.
以上述べてきたように、従来知られている打抜加工性に
優れた紙基材はそり、寸法精度が劣り、そり、寸法精度
に優れた紙基材は、打抜加工性が劣り、打抜加工性とそ
り、寸法精度は二律背反的特性であった。本発明は、打
抜加工性とそり寸法精度共に優れた紙基材積層板の製造
方法を提供しようとするものである。As mentioned above, conventionally known paper base materials with excellent punching workability suffer from warping and poor dimensional accuracy; Punctability, warpage, and dimensional accuracy were contradictory characteristics. The present invention aims to provide a method for manufacturing a paper base laminate that is excellent in both punching workability and warpage dimensional accuracy.
本発明者らは、上記問題点を解決するため鋭意研究を重
ねた結果、紙基材として特定のパルプから抄造した原紙
を用いることにより、打抜加工性が優れ、かつ寸法安定
性すなわち熱膨張係数が小さく、そりにも優れた積層板
が得られることを見い出し、本発明を完成するに至った
。As a result of extensive research to solve the above problems, the present inventors have found that by using base paper made from a specific pulp as the paper base material, it has excellent punching workability and dimensional stability, that is, thermal expansion. It was discovered that a laminate with a small coefficient and excellent warpage can be obtained, and the present invention was completed.
すなわち、本発明は、紙基材に熱硬化性樹脂を含浸、乾
燥させプリプレグを作成し、該プリプレグを複数枚重ね
て加熱加圧して積層板を製造する方法において、紙基材
としてα−セルロース含量が９５重量％以上の針葉樹パ
ルプから抄造した原紙を用いることを特徴とする紙基材
積層板の製造法を提供するものである。That is, the present invention provides a method for producing a laminate by impregnating a paper base material with a thermosetting resin and drying it to create a prepreg, and then stacking a plurality of sheets of the prepreg under heat and pressure, in which α-cellulose is used as the paper base material. The present invention provides a method for manufacturing a paper base laminate, characterized by using base paper made from softwood pulp having a content of 95% by weight or more.
以下に本発明の詳細な説明する。The present invention will be explained in detail below.
本発明の積層板用の紙基材としては、針葉樹バルブから
抄造した原紙が用いられる。そして針葉樹バルブとして
はα−セルロース含量が９５重量％以上のものが用いら
れる。As the paper base material for the laminate of the present invention, base paper made from coniferous bulbs is used. The softwood bulb used has an α-cellulose content of 95% by weight or more.
本発明の紙基材は現在広く用いられている、広葉樹パル
プのもの（α−セルロース含ｆｉ８３重量％）に比べて
、平均繊維長も長く、平均繊維径も太くなっている。従
って紙の単繊維が従来のものと比べ剛直になっているた
め、これを用いて製造した積層板の熱膨張係数が小さく
、また寸法精度、そりが改良される。α−セルロース含
量が９５重量％未満では打抜加工性の改良が十分でな（
なる。The paper base material of the present invention has a longer average fiber length and a larger average fiber diameter than the currently widely used hardwood pulp (containing α-cellulose fi of 83% by weight). Therefore, since the single fibers of paper are more rigid than conventional ones, the coefficient of thermal expansion of the laminate manufactured using the same is small, and dimensional accuracy and warpage are improved. If the α-cellulose content is less than 95% by weight, the improvement in punching processability will not be sufficient (
Become.
また、広葉樹パルプのα−セルロース含量を高めたもの
では熱膨張係数、寸法精度、そりが改良されない。Furthermore, hardwood pulp with increased α-cellulose content does not improve the coefficient of thermal expansion, dimensional accuracy, and warpage.
積層板製造用の熱硬化性樹脂としてはフェノール樹脂、
エポキシ樹脂、メラミン樹脂、ポリエステル樹脂、ジア
リルフタレート樹脂、ポリイミド樹脂等の熱硬化性樹脂
全般が用いられる。上記積層板用基材に熱硬化性樹脂を
含浸、乾燥させプリプレグを作成し、該プリプレグを複
数枚重ねて加熱加圧成形して紙基材積層板を得る。なお
、上記積層されたプリプレグ表面に接着剤付銅箔を載置
して加熱積層成形すれば銅張り積層板を得ることができ
、本発明の積層板は銅張り積層板を包含する。Phenolic resins are used as thermosetting resins for manufacturing laminates.
Thermosetting resins in general such as epoxy resins, melamine resins, polyester resins, diallyl phthalate resins, and polyimide resins can be used. The base material for a laminate is impregnated with a thermosetting resin and dried to create a prepreg, and a plurality of prepregs are stacked and molded under heat and pressure to obtain a paper base laminate. Note that a copper-clad laminate can be obtained by placing an adhesive-coated copper foil on the surface of the laminated prepreg and performing heat lamination molding, and the laminate of the present invention includes a copper-clad laminate.
以下、実施例により本発明をより詳細に説明するが、本
発明はこれらの実施例に限定されるものではない。EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples.
°・性フェノール樹１の八
フェノール１モルにホルムアルデヒド１．２モルを３７
％ホルマリンとして加えてから、３０％トリメチルアミ
ン水溶液としてトリメチルアミン０゜４モルを加えて７
０℃で６時間反応させた。該反応液を水とメタノールで
樹脂固形分１２重量％に調整して紙基材の下処理フェス
とした。1.2 moles of formaldehyde is added to 1 mole of octophenol of phenolic tree 1
% formalin, then 0.4 mol of trimethylamine as a 30% trimethylamine aqueous solution.
The reaction was carried out at 0°C for 6 hours. The reaction solution was adjusted to a resin solid content of 12% by weight with water and methanol to prepare a paper base material preparation face.
上璽皇貰版至立底
温度計、攪拌機、冷却器を備えた５１の四ツロフラスコ
に、桐油１０００ｇ、メタクレゾール１０００ｇ、フェ
ノール１０００ｇ１００Ｏ（パラトルエンスルホン酸）
１ｇを加えて、１１０℃で２時間反応させ、桐油にフェ
ノール類を付加させた。Into a 51 four-piece flask equipped with a vertical bottom thermometer, a stirrer, and a condenser, 1000 g of tung oil, 1000 g of metacresol, and 1000 g of phenol 100O (para-toluenesulfonic acid) were added.
1 g was added and reacted at 110°C for 2 hours to add phenols to tung oil.
さらに、該生成物にパラホルム１０４５ｇ、メタノール
３００ ｇ、アンモニア水１８０ｇを加えて８０℃で反
応させた。反応物の１６０℃熱板上でのゲル化時間が５
分になったところで減圧上脱水濃縮した。反応物のゲル
化時間が３分になったところで反応終点とした。Further, 1045 g of paraform, 300 g of methanol, and 180 g of aqueous ammonia were added to the product and reacted at 80°C. The gelation time of the reactant on a 160°C hot plate is 5
When the time reached 10 minutes, the mixture was dehydrated and concentrated under reduced pressure. The reaction was terminated when the gelation time of the reaction product reached 3 minutes.
次いでメタノール、トルエンで樹脂固形分５０重量％に
希釈してフェノール樹脂フェスを得た。Next, the resin was diluted with methanol and toluene to a resin solid content of 50% by weight to obtain a phenol resin face.
舐益林亘腹仮至盟遺
上記、下処理フェスと上塗り樹脂を用いて表１に示す厚
さ０．２５０の針葉樹パルプから抄造した原紙に塗工紙
樹脂分が５０重量％になるように含浸乾燥して塗工紙を
作成した。該塗工紙を所定枚数重ね、片面に接着剤付銅
箔を積載して、加熱加圧成形して、紙基材銅張積層板を
作成した。表１に原紙の種類、α−セルロース含量、積
層板特性を示す。As described above, the base paper was made from softwood pulp with a thickness of 0.250 as shown in Table 1 using the pretreatment face and top coat resin so that the coated paper resin content was 50% by weight. Coated paper was prepared by impregnating and drying. A predetermined number of sheets of the coated paper were stacked, adhesive-coated copper foil was placed on one side, and the paper was molded under heat and pressure to create a paper-based copper-clad laminate. Table 1 shows the type of base paper, α-cellulose content, and laminate properties.
比較例１〜４
現在広く用いられている広葉樹パルプから抄造したα−
セルロース含量の高い原紙と低い原紙および針葉樹パル
プから抄造したα−セルロース含量の低い原紙を比較原
紙として用い、実施例と同様にして紙基材銅張積板を作
成した。Comparative Examples 1 to 4 α- Paper made from hardwood pulp, which is currently widely used
Paper-based copper-clad laminates were prepared in the same manner as in Examples using base papers with high and low cellulose contents and base papers with low α-cellulose content made from softwood pulp as comparative base papers.
表１に実施例と同様に結果を示す。Table 1 shows the results as in Examples.
（以下余白）
〔発明の効果〕
本発明の針葉樹パルプから抄造した原紙を用いて製造さ
れた紙基材積層板は打抜加工性に優れ、かつ寸法収縮率
、熱膨張係数が小さく、そり、寸法精度に優れたもので
あり、本発明の工業的価値は極めて大である。(The following is a blank space) [Effects of the Invention] The paper base laminate manufactured using the base paper made from the softwood pulp of the present invention has excellent punching workability, has a small dimensional shrinkage rate and coefficient of thermal expansion, and has no warpage or warpage. It has excellent dimensional accuracy, and the industrial value of the present invention is extremely large.
Claims (1)
を作成し、該プリプレグを複数枚重ねて加熱加圧成形し
て積層板を製造する方法において、紙基材としてα−セ
ルロース含量が９５重量％以上の針葉樹パルプから抄造
した原紙を用いることを特徴とする紙基材積層板の製造
法。1. In the method of manufacturing a laminate by impregnating a paper base material with a thermosetting resin and drying it to create a prepreg, and then stacking a plurality of prepregs and molding them under heat and pressure, the paper base material has a high α-cellulose content. A method for producing a paper base laminate, characterized by using base paper made from 95% by weight or more of softwood pulp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2208487A JPS63189440A (en) | 1987-02-02 | 1987-02-02 | Production of laminate with paper base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2208487A JPS63189440A (en) | 1987-02-02 | 1987-02-02 | Production of laminate with paper base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63189440A true JPS63189440A (en) | 1988-08-05 |
Family
ID=12073011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2208487A Pending JPS63189440A (en) | 1987-02-02 | 1987-02-02 | Production of laminate with paper base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63189440A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5676518A (en) * | 1992-11-25 | 1997-10-14 | Kabushiki Kaisha Komatsu Seisakusho | Unstacking feeder |
| JP2002527536A (en) * | 1998-10-09 | 2002-08-27 | レヨニヤー，インク． | Composites containing cellulose pulp fibers and methods of making and using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58163653A (en) * | 1982-03-25 | 1983-09-28 | 新神戸電機株式会社 | Manufacture of laminate |
| JPS6079952A (en) * | 1983-10-07 | 1985-05-07 | 山陽国策パルプ株式会社 | Manufacture of laminated board |
-
1987
- 1987-02-02 JP JP2208487A patent/JPS63189440A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58163653A (en) * | 1982-03-25 | 1983-09-28 | 新神戸電機株式会社 | Manufacture of laminate |
| JPS6079952A (en) * | 1983-10-07 | 1985-05-07 | 山陽国策パルプ株式会社 | Manufacture of laminated board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5676518A (en) * | 1992-11-25 | 1997-10-14 | Kabushiki Kaisha Komatsu Seisakusho | Unstacking feeder |
| JP2002527536A (en) * | 1998-10-09 | 2002-08-27 | レヨニヤー，インク． | Composites containing cellulose pulp fibers and methods of making and using the same |
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