JPS5984560A - Socket - Google Patents

Abstract

PURPOSE:To perform the positioning of package by merely placing it on the prescribed position as well as to enable to prevent the short circuit generating between external leads by a method wherein a positioning part, with which the package of a semiconductor device is positioned and an outer lead housing concavity with a barrier are provided. CONSTITUTION:The positioning part 7 of the package 11 on the semiconductor device is formed on the upper surface side of a socket block 6, and a protruded part 8, protruding in lateral direction, is provided on both sides in longitudinal direction. A number of outer lead housing concavities 9 are formed on both sides of the positioning part 7, and said concavities are partitioned by a barrier 10. When the lower side of the package 11 of the semiconductor device is placed on the positioning part 7, an external lead 12 is inserted into the concavities 9 located on both sides of the socket block 6 one by one and positioning is performed. The contactor 13 of a tester is automatically comes in contact with the above, thereby enabling to perform an inspection by the tester. According to this constitution, the taking out and putting in of the package 11 can be performed easily, and the exfoliation of plating, the bending and breaking of the lead can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a socket, and particularly to a socket used for testing, sorting, etc. of semiconductor devices.

Generally, when inspecting and sorting semiconductor devices such as so-called dual-in-line (D/L) type packages, a socket having a large number of holes into which external leads protruding from the package are inserted is used.

FIG. 1 shows a conventional socket such as ff1Jk, and FIG. 1 is a sectional view thereof, and lbl is a plan view thereof. In this conventional example, an external lead 2 protrudes outside the package 1.
are inserted into the two rows of socket insertion holes 4 of the socket 3, one each. Additionally, in order to reduce contact resistance with the external lead 2, a gold-plated leaf spring 5 is provided inside the socket insertion hole 4.

However, this conventional technology has the following problems. That is, first of all, since the positioning of the package is difficult, the package may be inserted out of alignment with respect to the socket, which may make accurate inspection impossible. Additionally, since the opening angle of the external leads of the package varies, the external leads may not fit into the lead insertion holes of the socket, and if you try to force them in, the external leads may bend or break. In addition, there is a risk that the adhesive strength between the package and external leads may be reduced. Additionally, external REITs.

Because the contact between the socket and the leaf spring of the socket is tight, if the external lead is inserted and removed many times as in the inspection process, the gold plating or tin plating of the external lead may become thin.7?1. C,
There is a risk of it peeling off.

An object of the present invention is to solve the problems of the prior art and to solve the problems of the prior art. To provide a socket which does not need to be inserted into a lead insertion hole of the socket, can be positioned simply by placing a package on a predetermined position, and can be correctly set without external leads coming into contact with adjacent external leads.

Hereinafter, a detailed explanation will be given according to an embodiment shown in the upper drawings of Kinegiri.

FIG. 2 shows one embodiment of the socket flock used in the socket according to the present invention, and FIG.

In this implementation, the socket block 6 is placed on the lower surface r of the package of the semiconductor device to be measured, and the positioning portion 7 is used for positioning the package. i[L, is there. This positioning part 7
It is formed on the upper surface side of the socket block 6, and has protrusions 8r extending in the width direction at both ends in the length δ direction.

A large number of recesses 9 for accommodating external leads are formed on both sides of the positioning portion 60, and each of the four portions 9 is partitioned by a partition wall 10. These recesses 9 are used for inspection of semiconductor devices,
When the pan cage is placed on the positioning part 7 during sorting or the like, the external leads protruding on both sides of the package can be accommodated and positioned, thereby preventing short circuits between the external leads that are in R contact.

The external leads thus housed in the four parts 9 are tested by contacting them from the outside with a contactor of a tester, for example.

Next, the operation of this implementation sequence will be explained.

First, as shown in FIG. 3, the socket block 6 of FIG. 2 is prepared, and then the bottom surface of the pan cage IT of the semiconductor device to be measured is placed on the positioning portion 7 of the socket block 6. Accordingly, the external leads 12 protruding diagonally downward from both sides of the package 11 are inserted one by one into the four parts 9 on both sides of the socket block 6 and positioned.

In this state, each external lead 12 is individually accommodated in each recess 9, and adjacent external leads 12 are
They are separated from each other by the s-wall 10 to prevent short circuits.

Therefore, the contactors 13 of the tester are arranged on both sides of the socket block 6, and when the test start button (not shown) of the tester is pressed with the pusher, the contactors 13 automatically come into contact with each external lead 12 from the outside. do. In addition, it will be ready for inspection by a tester.

After the test is completed, the silicone taffeta 13 is separated from the external lead 12 in response to a stop signal from the tester. As a result, the package 11 can be easily taken out from the socket block 6.

In this embodiment, it is easy to position the package 11 and accommodate the external leads 12 in the recess 9, and it is not necessary to insert the external leads 12 into the holes of the socket as in the conventional case. Peeling, bending, and folding of the plating on the outer board 12 can be prevented, and the package can be inserted and removed simply and easily, reducing labor and work time. Furthermore, the socket block 6 has a very simple structure and is low cost.

As explained above, according to the present invention, the package and external leads can be positioned simply by placing the package on the socket block, short circuits between external leads can be prevented, and the package can be easily inserted and removed. It can also prevent plating peeling, lead bending, and bending.

[Brief explanation of the drawing]

FIG. 1 (al and fbl are a cross-sectional view and a plan view, respectively, showing a conventional socket; FIG.
FIGS. 3ial, lbl, lc) are diagrams showing step-by-step how a semiconductor device is tested using the socket of the present invention. 6...Socket block, 7...Positioning part, also...
... recess, l'O... partition, ll... package of semiconductor device, 12... external lead, 13... contactor of tester. Agent Masuya Susuki 1) Ori room ・Figure 1 (lr) Figure 2 Figure 3

Claims (1)

[Claims] ■ In a socket for a semiconductor device having an external lead assembly protruding to the outside of the package, there is a positioning part for positioning the package of the semiconductor device, and a positioning part formed on both sides of this positioning part to connect the adjacent external leads. A kW socket comprising a socket block consisting of a recess for accommodating external leads and having partition walls separating them from each other.