JPS598329A - Molded chip type electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to molded chip type electronic components such as molded chip type aluminum electrolytic capacitors used in electronic equipment, electrical equipment, etc., and its purpose is to prevent melting during mounting of molded chip type electronic components. The goal is to prevent deformation and cracks caused by soldering and to make chips smaller.

As shown in Fig. 1, conventional molded chip type electronic components have an element 2 such as a capacitor or electronic component built into a leak-preventing inner can l sealed with a sealing rubber 8, and then the whole is sealed with an exterior resin 4. In order to prevent the element 2 from being vaporized by the temperature of the molten solder during mounting and the sealing rubber 8 being pushed outward due to the increase in internal pressure, a constriction part 6 is provided in a part of the inner can for leakage prevention. In addition, it was necessary to increase the thickness of the sealing rubber. However, even with this, deformation and cracking caused by molten solder during mounting could not be completely prevented, and miniaturization of the chip was impossible due to the thickness of the sealing rubber.

The present invention solves the above-mentioned deficiency (5), and is a molded chip type electronic component in which a rigid plate 7 and a sealing material 8 are interposed between an exterior resin support portion 6 and an element 2 as shown in FIG. Even if the element 2 vaporizes due to the temperature of the molten solder during mounting and the internal pressure increases, it is first prevented by the sealing material 8, and then by the rigid plate 7.
Furthermore, since the interior can 1 for preventing surface liquid and the exterior resin 4 are firmly connected by the exterior resin support part 6, deformation and cracking due to increased internal pressure can be completely prevented, and the conventional method requires a large thickness. This eliminates the need for the sealing rubber that had previously been used, making it possible to significantly reduce the size of the chip.

An embodiment of the present invention will be described below with reference to the drawing of FIG.

1 is an inner can for preventing liquid leakage, which contains the element 2, and the space between the element 2 and the exterior resin support part 6 is made of epoxy resin.

Synthetic resins such as phenol resin, unsaturated polynisder resin, polyamide, polyimide, amide-imide resin, polybutadiene, rubber, etc. alone or in their liquid form can be used for paper, cloth,
It is sealed with a sealing material 8 such as impregnated paper or cloth impregnated with glass cloth, asbestos cloth, etc.

Further, a rigid plate 7 made of phenol resin @ laminate, epoxy resin laminate, polyester resin @ laminate, etc. is arranged on the outside thereof,
There is an exterior resin support part Q on the outermost side of the inner can mouth part to prevent liquid leakage.
51, 61! , 61# is further sealed as a whole with an exterior resin 4 to form a molded chip type electronic component. The thickness of the sealing material is not particularly limited, but from the viewpoint of chip miniaturization, it is preferable to make it thinner, and
The thickness of the rigid plate is also not particularly limited, but from the viewpoint of miniaturization, it is preferably less than 1 mm thick.

The material of the sealing material is not particularly limited as long as it can seal like the materials listed above. The rigid plate Toga is not particularly limited as long as it has a rigid plate shape. Furthermore, the exterior resin support part 4 may be any shape as long as it strengthens the bond with the exterior resin, and is preferably in the shape of a claw, a wedge, a needle, a loop, a cane, etc., but is not particularly limited. It is desirable that the structure has an anchoring effect. Further, the exterior resin support portion may be subjected to coating treatment, surface roughening, or other treatments to further improve bonding with the exterior resin. In addition, the 1m liquid-proof internal can sealing part is provided not in one direction but in two directions, front and back, making it possible to provide a symmetrical chip and making it easier to position the chip when bonding it to the lead frame. You can also do that. In order to improve the bonding force of the sealing material to the foot, the sealing portion may be provided with a constriction portion.

As explained above, according to the molded chip type electronic component of the present invention, there is no deformation or cracking caused by molten solder (immersion treatment at 280°C for 10 seconds) during mounting, and it is possible to make the chip better than conventional products. % smaller.

[Brief explanation of the drawing]

FIG. 1 is a simplified sectional view of a conventional molded chip type electronic component, and FIGS. 2 and 8 are simplified sectional views showing one embodiment of a molded chip type electronic component according to the present invention. l is the inner can for leakage prevention, 2 is the element, 8 is the sealing rubber, 4I
i Exterior resin, 5): f, L-shaped portion, 6 is exterior resin support portion, 7 is the same rigid plate, and 8 is sealing material. Patent applicant representative of Koshita Electric Works Co., Ltd., Toshimaru Takemoto (and 2 others) Figure 1 Figure 2

Claims (2)

[Claims] (1) A molded chip type electronic component having an exterior resin support part on the outermost side of the sealing part, characterized in that a rigid plate and a sealing material are interposed between the exterior resin support part and the element. (2) The molded chip type electronic component according to claim 1, wherein the thickness of the rigid plate is 11 g or less.